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MAX2606EUT+

Analog Devices

MAX2606EUT+ by Analog Devices

MAX2606EUT+ by Analog Devices is a cellphone IC with 6 terminals in a small outline package. It operates b/w -40 to 85 °C, with a supply voltage of 2.75V. Ideal for baseband circuits in telecom applications due to its low profile and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

MAX2606EUT+ by Analog Devices
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Analog Devices Inc

USA . 2,334 parts In-Stock

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2,334

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Vyrian

USA . 3,311 parts In-Stock

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3,311

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Anansix

USA . 1,886 parts In-Stock

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1,886

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Digiode

USA . 1,335 parts In-Stock

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Rebound Electronics

UK . 300 parts In-Stock

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300

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ACDS - Activité Composants Distribution Service

France . 10 parts In-Stock

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10

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Distributors (Availability)

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MARBEL Systems

Belgium . 455 parts In-Stock

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$13.329

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455

$13.329

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Texas Native Microelectronics

USA . 4,085 parts In-Stock

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$15.321

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$14.708

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$14.249

10k+ parts

$13.482

4,085

$15.321

$14.708

$14.249

$13.482

Kenton Components

USA . 439 parts In-Stock

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$18.385

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$16.179

439

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$16.179

Qasali Group International

UK . 52 parts In-Stock

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$41.367

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52

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Semicontronic

India . 2,046 parts In-Stock

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$450.000

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$438.750

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$436.500

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2,046

$450.000

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A-Z Elektronik GmbH

Germany . 5,643 parts In-Stock

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Corphita

USA . 1,307 parts In-Stock

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1,307

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Perfect Parts

USA . 524 parts In-Stock

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524

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Overview

Unlock the full potential of your cellphone with the MAX2606EUT+ by Analog Devices. Crafted with precision and expertise, this top-of-the-line Cellphone IC boasts unparalleled quality and reliability. Whether you're looking to enhance signal reception, improve call quality, or optimize battery efficiency, this innovative device has you covered. With a compact design and industrial-grade construction, it's perfect for a wide range of telecom applications. Experience the difference with Analog Devices and take your cellphone performance to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product suitable for portable devices like cellphones.

Surface Mount: YES

Surface mount technology allows for convenient and efficient assembly, saving space on the PCB and reducing manufacturing costs.

Package Shape: RECTANGULAR

Rectangular shape is easy to handle and provides compatibility with standard PCB layouts, simplifying the design process.

No. of Terminals: 6

Having a sufficient number of terminals enables connectivity with other components, ensuring proper functionality.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in various environmental conditions.

Nominal Supply Voltage: 2.75 V

Optimal supply voltage for efficient power consumption and operation of the cellphone IC.

Technical Specifications

Cellphone ICs MAX2606EUT+ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.45 mm

Nominal Supply Voltage:

2.75 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.625 mm

Trade Compliance

MAX2606EUT+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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