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ADF4360-3BCPZRL7

Analog Devices

ADF4360-3BCPZRL7 by Analog Devices

Analog Devices' ADF4360-3BCPZRL7 is a cellphone IC with 24 terminals, operating at 3.3V. It features BICMOS technology, -40 to 85°C temperature range, and matte tin finish. Ideal for baseband circuits in telecom applications due to its compact square package and low profile design.

Median Price

$6.178

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 274 parts In-Stock

1+ parts

$2.230

100+ parts

$2.124

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$2.088

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274

$2.230

$2.124

$2.088

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Verical

USA . 274 parts In-Stock

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$2.230

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$2.124

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$2.088

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274

$2.230

$2.124

$2.088

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Chip1Stop

Japan . 439 parts In-Stock

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$6.136

100+ parts

$5.910

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$5.835

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439

$6.136

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$5.835

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Analog Devices Inc

USA . 4,500 parts In-Stock

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$11.750

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$6.012

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$4.980

10k+ parts

$5.688

4,500

$11.750

$6.012

$4.980

$5.688

Mouser Electronics

USA . 240 parts In-Stock

1+ parts

$13.410

100+ parts

$8.960

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$6.730

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$6.720

240

$13.410

$8.960

$6.730

$6.720

Rochester

USA . 8,545 parts In-Stock

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-

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$6.220

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$5.570

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$5.240

8,545

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$6.220

$5.570

$5.240

Distributors (In-Stock)

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Digiode

USA . 600 parts In-Stock

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$5.665

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$5.665

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Nova Conductors

Japan . 750 parts In-Stock

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$5.900

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$5.900

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Chip Stock

USA . 4,240 parts In-Stock

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Vyrian

USA . 2,887 parts In-Stock

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Component Sense

UK . 2,329 parts In-Stock

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VNN

France . 912 parts In-Stock

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Connector Distribution Corp

USA . 505 parts In-Stock

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Rebound Electronics

UK . 361 parts In-Stock

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Cyclops Electronics Ltd

UK . 161 parts In-Stock

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Infinite Electronics LLP

India . 125 parts In-Stock

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Distributors (Availability)

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XScomponents

USA . 1,000 parts In-Stock

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$3.000

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1,000

$3.000

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Semicontronic

India . 2,779 parts In-Stock

1+ parts

$3.720

100+ parts

$3.627

1k+ parts

$3.608

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2,779

$3.720

$3.627

$3.608

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Ampacity Inc.

Singapore . 1,980 parts In-Stock

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$3.740

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1,980

$3.740

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Corphita

USA . 390 parts In-Stock

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$5.367

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390

$5.367

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$5.782

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$5.551

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500

$5.782

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$5.551

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Component Stockers USA

USA . 14,296 parts In-Stock

1+ parts

$5.860

100+ parts

$5.520

1k+ parts

$4.980

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14,296

$5.860

$5.520

$4.980

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Continental Prestige Electronics

USA . 4,325 parts In-Stock

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$5.900

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$5.782

4,325

$5.900

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$5.782

Vigor

Singapore . 1,122 parts In-Stock

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$7.740

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Corohmni

South Africa . 749 parts In-Stock

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$13.731

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Modulus Dynamics

Lithuania . 1,000 parts In-Stock

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$14.625

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$14.625

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$14.625

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$14.625

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Parana Technologies

USA . 3,563 parts In-Stock

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$16.592

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$15.431

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IDEA Electronic Components Group

UK . 1,541 parts In-Stock

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$17.841

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$16.949

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$16.949

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$16.949

$16.949

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DigiPath Technology Company

USA . 3,563 parts In-Stock

1+ parts

$27.832

100+ parts

$26.719

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$26.719

3,563

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$26.719

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$26.719

Lixinc

USA . 17,785 parts In-Stock

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Perfect Parts

USA . 16,206 parts In-Stock

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RC Electronics

USA . 7,677 parts In-Stock

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Kepictronics

USA . 4,000 parts In-Stock

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Argo Parts USA

USA . 2,562 parts In-Stock

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Futuretech Components

Singapore . 206 parts In-Stock

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A-Z Elektronik GmbH

Germany . 122 parts In-Stock

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Advanced Electronics

New Zealand . 114 parts In-Stock

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Overview

Elevate your cellphone technology with the ADF4360-3BCPZRL7 by Analog Devices. Known for their superior quality and innovative designs, Analog Devices delivers cutting-edge solutions for various applications in the telecom industry. This surface mount IC boasts a square package shape and a nominal supply voltage of 3.3V, making it ideal for baseband circuit integration. With a sleek design and industrial-grade temperature tolerance, this product offers customers unmatched reliability and performance. Upgrade your devices today with the ADF4360-3BCPZRL7 and experience the next level of connectivity.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation onto a circuit board, saving time and effort in the assembly process.

Package Shape: SQUARE

Square package shape provides a compact design, saving space in the overall product layout.

Power Supplies (V): 3.3

Operates on a standard voltage supply, making it compatible with many existing systems.

No. of Terminals: 24

Provides ample connectivity options for various functions and interfaces.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Incorporates advanced packaging styles for enhanced thermal management and space efficiency.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions without performance degradation.

Terminal Finish: MATTE TIN

Provides corrosion resistance and good solderability for reliable connections.

Terminal Position: QUAD

Quad terminal position offers increased robustness and stability during usage.

Maximum Seated Height: 1 mm

Low profile design ideal for slim devices or applications with height constraints.

Width: 4 mm

Compact width measurement contributes to space-saving design.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for quick and efficient solder reflow process during assembly.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures for soldering without damage.

Length: 4 mm

Compact length measurement contributes to space-saving design.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial operating conditions with reliability.

Technology: BICMOS

Utilizes Bipolar CMOS technology for high-performance and low-power consumption.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and reduces health risks during manufacturing.

Telecom IC Type: BASEBAND CIRCUIT

Specifically designed for baseband circuit functionality in telecommunications applications.

Nominal Supply Voltage: 3.3 V

Operates within the standard nominal supply voltage range for compatibility with various systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, ideal for compact product designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling procedures for storage and assembly.

Technical Specifications

Cellphone ICs ADF4360-3BCPZRL7 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

ADF4360-3BCPZRL7 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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