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ADF4360-2BCPZ

Analog Devices

ADF4360-2BCPZ by Analog Devices

Analog Devices' ADF4360-2BCPZ is a 24-terminal cellphone IC with 3.3V supply voltage, operating from -40 to 85°C. It features BICMOS technology, matte tin finish, and quad terminal position for baseband circuit applications in industrial telecom settings.

Median Price

$6.365

Lifecycle Status

Suppliers In-Stock

28

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 125 parts In-Stock

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$5.480

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Mouser Electronics

USA . 542 parts In-Stock

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$10.760

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$7.820

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$6.530

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542

$10.760

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DigiKey

USA . 64 parts In-Stock

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$10.760

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$7.827

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$6.660

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$6.534

64

$10.760

$7.827

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$6.534

Analog Devices Inc

USA . 983 parts In-Stock

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$11.420

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$6.882

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$4.780

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Rochester

USA . 1,197 parts In-Stock

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$5.980

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$5.350

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$5.030

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Verical

USA . 59 parts In-Stock

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$6.365

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Arrow

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Distributors (In-Stock)

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Digiode

USA . 711 parts In-Stock

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$5.206

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Nova Conductors

Japan . 10 parts In-Stock

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$5.735

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Mobius Materials

USA . 72 parts In-Stock

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$6.800

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VNN

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Vyrian

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Dynamic Solutions

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Sensible Micro Corp

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Bristol Electronics

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Atlantic Semiconductor

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Speed Components Ltd

Israel . 133 parts In-Stock

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Prism Electronics

USA . 128 parts In-Stock

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Zilex Electronics Inc.

Canada . 106 parts In-Stock

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ComSIT Distribution GmbH

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ComSIT USA

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ECAB

Sweden . 50 parts In-Stock

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Odintec Ltd.

Israel . 40 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

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Rebound Electronics

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Sea View Technologies

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Distributors (Availability)

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iBuyXS LLC

. 166 parts In-Stock

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$3.312

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Ampacity Inc.

Singapore . 762 parts In-Stock

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$4.660

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Semicontronic

India . 481 parts In-Stock

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$4.660

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$4.544

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$4.520

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Corphita

USA . 603 parts In-Stock

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$4.932

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$4.932

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Vigor

Singapore . 253 parts In-Stock

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$7.740

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Continental Prestige Electronics

USA . 456 parts In-Stock

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$8.520

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$6.370

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$5.060

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$5.060

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Parana Technologies

USA . 2,152 parts In-Stock

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$13.479

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$12.536

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IDEA Electronic Components Group

UK . 1,203 parts In-Stock

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$14.494

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$13.769

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$13.769

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$13.769

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Aztec Data Supply Inc.

USA . 2,527 parts In-Stock

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$15.610

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Corohmni

South Africa . 120 parts In-Stock

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$16.669

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DigiPath Technology Company

USA . 53 parts In-Stock

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$22.611

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$21.706

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$21.706

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$21.706

A-Z Elektronik GmbH

Germany . 8,648 parts In-Stock

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Lixinc

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Authorized Procurement Solutions

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Argo Parts USA

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Perfect Parts

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Assy Fe

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Kepictronics

USA . 529 parts In-Stock

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GreenTree Electronics

Israel . 181 parts In-Stock

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BidChips

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Infinite Electronics LLP (Excess)

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Speed Components Ltd (Excess)

Israel . 75 parts In-Stock

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Glotronic Ltd.

UK . 56 parts In-Stock

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ChipstoGo Electronic ltd

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Overview

Upgrade your cellphone's performance with the ADF4360-2BCPZ by Analog Devices. As a leading manufacturer in the industry of Cellphone ICs, Analog Devices delivers top-quality products that guarantee superior performance and reliability. This cutting-edge IC is designed for applications where precision and efficiency are essential, offering customers unparalleled value and advantages. Say goodbye to slow loading times and hello to seamless connectivity with the ADF4360-2BCPZ.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy and efficient PCB assembly, saving time and reducing costs.

Package Shape: SQUARE

Square packages are typically more compact and space-saving, ideal for applications with limited board real estate.

Power Supplies (V): 3.3

Operating at 3.3V ensures compatibility with a wide range of digital systems and helps maintain power efficiency.

No. of Terminals: 24

Having 24 terminals provides flexibility and connectivity options for the IC's functionality and interfacing with other components.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions and maintain reliable performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments without compromising functionality.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring a reliable connection on the PCB.

Terminal Position: QUAD

Quad terminal positioning offers improved mechanical stability and easier handling during assembly and rework.

Maximum Seated Height: 1 mm

The low profile of 1mm allows for a compact design and efficient use of space in the overall system layout.

Width: 4 mm

Compact width dimensions enable the IC to fit into tight spaces and contribute to overall system miniaturization.

Maximum Time At Peak Reflow Temperature (s): 30

This short reflow time ensures efficient and reliable soldering during assembly processes, reducing the risk of thermal damage.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the IC can withstand the soldering process without degradation, ensuring a robust assembly.

Length: 4 mm

The compact length of 4mm contributes to overall space savings and allows for tighter integration on the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation across a wide range of environmental conditions, making it suitable for industrial applications.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high-speed performance and low power consumption.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and eliminates the risk of lead contamination in products.

Telecom IC Type: BASEBAND CIRCUIT

As a baseband circuit IC, it is optimized for processing communication signals and data in telecom applications with high efficiency.

Nominal Supply Voltage: 3.3 V

Having a 3.3V nominal supply voltage ensures compatibility with standard digital systems and promotes energy efficiency.

Terminal Pitch: 0.5 mm

A small terminal pitch of 0.5mm enables high-density mounting on the PCB, maximizing board space utilization and connectivity options.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the IC can withstand a moderate level of moisture exposure during storage and assembly, enhancing reliability.

Technical Specifications

Cellphone ICs ADF4360-2BCPZ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

ADF4360-2BCPZ Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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