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TRF370317IRGER

Texas Instruments

TRF370317IRGER by Texas Instruments

TRF370317IRGER by Texas Instruments is a cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 5V and max current of 0.245mA. Ideal for RF and baseband circuits in industrial telecom applications.

Median Price

$10.910

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,500 parts In-Stock

1+ parts

$11.034

100+ parts

$8.996

1k+ parts

$5.997

10k+ parts

-

8,500

$11.034

$8.996

$5.997

-

Rochester

USA . 4,439 parts In-Stock

1+ parts

-

100+ parts

$8.630

1k+ parts

$7.720

10k+ parts

$7.260

4,439

-

$8.630

$7.720

$7.260

DigiKey

USA . 4,439 parts In-Stock

1+ parts

-

100+ parts

$11.350

1k+ parts

-

10k+ parts

-

4,439

-

$11.350

-

-

Verical

USA . 2,832 parts In-Stock

1+ parts

-

100+ parts

$10.787

1k+ parts

$9.650

10k+ parts

-

2,832

-

$10.787

$9.650

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$7.123

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$7.123

-

-

-

Digiode

USA . 2,061 parts In-Stock

1+ parts

$7.914

100+ parts

-

1k+ parts

-

10k+ parts

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2,061

$7.914

-

-

-

Vyrian

USA . 5,476 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,476

-

-

-

-

DigiKey Marketplace

USA . 4,439 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,439

-

-

-

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Cyclops Electronics Ltd

UK . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,325 parts In-Stock

1+ parts

$7.080

100+ parts

-

1k+ parts

-

10k+ parts

-

5,325

$7.080

-

-

-

Continental Prestige Electronics

USA . 5,249 parts In-Stock

1+ parts

$7.123

100+ parts

-

1k+ parts

-

10k+ parts

$6.981

5,249

$7.123

-

-

$6.981

Corphita

USA . 4,996 parts In-Stock

1+ parts

$7.497

100+ parts

-

1k+ parts

-

10k+ parts

-

4,996

$7.497

-

-

-

Parana Technologies

USA . 508 parts In-Stock

1+ parts

$7.779

100+ parts

-

1k+ parts

$8.323

10k+ parts

-

508

$7.779

-

$8.323

-

DigiPath Technology Company

USA . 1,883 parts In-Stock

1+ parts

$8.565

100+ parts

$7.880

1k+ parts

-

10k+ parts

-

1,883

$8.565

$7.880

-

-

IDEA Electronic Components Group

UK . 1,785 parts In-Stock

1+ parts

$8.740

100+ parts

$8.303

1k+ parts

$7.866

10k+ parts

-

1,785

$8.740

$8.303

$7.866

-

ChromeModa Solutions

Germany . 1,193 parts In-Stock

1+ parts

$8.740

100+ parts

$7.167

1k+ parts

-

10k+ parts

-

1,193

$8.740

$7.167

-

-

A-Z Elektronik GmbH

Germany . 5,382 parts In-Stock

1+ parts

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100+ parts

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5,382

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-

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Kepictronics

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

-

-

-

-

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,500

-

-

-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$6.981

1k+ parts

$6.767

10k+ parts

$6.625

2,000

-

$6.981

$6.767

$6.625

Argo Parts USA

USA . 1,747 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,747

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-

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1,000

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-

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-

Overview

Experience the cutting-edge technology of Texas Instruments with the TRF370317IRGER, a top-of-the-line Cellphone IC that promises unmatched quality and reliability. Designed for peak performance, this IC offers a range of applications in the telecommunications industry, ensuring seamless connectivity and efficient operation. With Texas Instruments' reputation for innovation and excellence, customers can trust in the value and benefits provided by this product, making it an essential component for any electronic device. Elevate your technology with the TRF370317IRGER and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body makes this product lightweight and durable, making it a good choice for mobile devices.

Surface Mount: YES

The surface mount feature offers easy installation and space-saving design, making this product suitable for compact electronic devices.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, making this product ideal for devices with limited space.

Power Supplies (V): 5

With a 5V power supply, this product is compatible with a wide range of electronic devices, making it a versatile option for different applications.

No. of Terminals: 24

The high number of terminals provides additional connections for various functions, increasing the product's capability for complex applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier, heat sink/slug, and very thin profile package styles offer efficient heat dissipation and compact design, making this product suitable for high-performance devices in a small form factor.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even under extreme conditions, making this product a durable choice for harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function in cold environments, making it a versatile option for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring the product's reliability and longevity in use.

Terminal Position: QUAD

The quad terminal position offers multiple connection points for stability and secure attachment, making this product suitable for high vibration environments.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a slim design, making this product ideal for thin and lightweight electronic devices.

Width: 4 mm

The compact width of 4mm enables the product to fit in tight spaces, making it a suitable choice for small electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and efficient soldering, making this product easy to install in manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature enables secure soldering connections, ensuring the product's reliability in high-temperature environments.

Length: 4 mm

The 4mm length provides a compact size for the product, making it a space-efficient option for electronic devices with limited room.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product's reliability in demanding environments, making it a robust choice for commercial and industrial applications.

Terminal Form: NO LEAD

The no lead terminal form is environmentally friendly and ensures compliance with regulations, making this product a sustainable choice for eco-conscious consumers.

Maximum Supply Current: 0.245 mA

The low maximum supply current consumption helps conserve energy and battery life, making this product an efficient choice for portable devices.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The RF and baseband circuit type offers comprehensive connectivity solutions for telecommunications applications, making this product a versatile option for communication devices.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a standard power requirement, making this product compatible with a wide range of electronic devices.

Terminal Pitch: 0.5 mm

The tight terminal pitch of 0.5mm allows for precise connections on a circuit board, making this product suitable for high-density designs.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates moderate sensitivity to moisture exposure, allowing the product to be safely used in moderate humidity conditions.

Technical Specifications

Cellphone ICs TRF370317IRGER attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.245 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

TRF370317IRGER Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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