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TRF3762-EIRHAT

Texas Instruments

TRF3762-EIRHAT by Texas Instruments

TRF3762-EIRHAT by Texas Instruments is a cellphone IC with 40 terminals, operating at -40 to 85°C. It features a 5V supply, RF and baseband circuit for telecom applications. The chip carrier package has a square shape, measures 6x6mm, and is surface mountable with nickel palladium gold finish.

Median Price

$11.230

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,750 parts In-Stock

1+ parts

-

100+ parts

$9.730

1k+ parts

$8.700

10k+ parts

$8.190

7,750

-

$9.730

$8.700

$8.190

DigiKey

USA . 7,750 parts In-Stock

1+ parts

-

100+ parts

$11.230

1k+ parts

-

10k+ parts

-

7,750

-

$11.230

-

-

Verical

USA . 750 parts In-Stock

1+ parts

-

100+ parts

$12.162

1k+ parts

$10.875

10k+ parts

$10.238

750

-

$12.162

$10.875

$10.238

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,358 parts In-Stock

1+ parts

$10.260

100+ parts

-

1k+ parts

-

10k+ parts

-

1,358

$10.260

-

-

-

Vyrian

USA . 4,776 parts In-Stock

1+ parts

$10.800

100+ parts

-

1k+ parts

-

10k+ parts

-

4,776

$10.800

-

-

-

DigiKey Marketplace

USA . 7,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,750

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 234 parts In-Stock

1+ parts

$9.720

100+ parts

-

1k+ parts

-

10k+ parts

-

234

$9.720

-

-

-

Component Stockers USA

USA . 6,744 parts In-Stock

1+ parts

$10.890

100+ parts

$10.230

1k+ parts

$9.250

10k+ parts

-

6,744

$10.890

$10.230

$9.250

-

Parana Technologies

USA . 1,729 parts In-Stock

1+ parts

$11.448

100+ parts

-

1k+ parts

$11.867

10k+ parts

-

1,729

$11.448

-

$11.867

-

DigiPath Technology Company

USA . 1,825 parts In-Stock

1+ parts

$12.606

100+ parts

$11.597

1k+ parts

-

10k+ parts

-

1,825

$12.606

$11.597

-

-

ChromeModa Solutions

Germany . 4,223 parts In-Stock

1+ parts

$12.863

100+ parts

$10.548

1k+ parts

-

10k+ parts

-

4,223

$12.863

$10.548

-

-

IDEA Electronic Components Group

UK . 179 parts In-Stock

1+ parts

$12.863

100+ parts

$12.220

1k+ parts

$11.577

10k+ parts

-

179

$12.863

$12.220

$11.577

-

A-Z Elektronik GmbH

Germany . 4,929 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,929

-

-

-

-

Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,500

-

-

-

-

Perfect Parts

USA . 1,434 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,434

-

-

-

-

Microchip USA

USA . 229 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

229

-

-

-

-

Overview

Enhance your cellphone's performance with the TRF3762-EIRHAT by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality Cellphone ICs that guarantee reliability and efficiency. This versatile product is designed to meet the demands of modern telecommunications, offering seamless integration and optimal functionality. With its advanced features and cutting-edge technology, the TRF3762-EIRHAT provides exceptional value and benefits to customers looking to upgrade their devices. Experience the difference with Texas Instruments and take your cellphone experience to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy materials are lightweight and durable, making the product suitable for portable devices.

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB design, saving space and reducing overall product size.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes the product compatible with a wide range of devices and power sources.

No. of Terminals: 40

Having a sufficient number of terminals allows for connectivity to various components and peripherals, enhancing functionality.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function reliably even in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent conductivity and corrosion resistance, enhancing the longevity of the product.

Maximum Supply Current: 0.15 mA

Operating at a low maximum supply current helps in conserving power and improving energy efficiency.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuits in one IC simplifies the design process and reduces the overall complexity of the product.

Technical Specifications

Cellphone ICs TRF3762-EIRHAT attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.15 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

TRF3762-EIRHAT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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