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CC2591RGVT

Texas Instruments

CC2591RGVT by Texas Instruments

The Texas Instruments CC2591RGVT is a cellphone IC with 16 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 85°C, with a supply voltage of 3V and max current of 4mA. This RF front end circuit has a terminal pitch of 0.65mm and is suitable for industrial applications requiring very thin profile components.

Median Price

$8.210

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 576 parts In-Stock

1+ parts

$8.210

100+ parts

$6.224

1k+ parts

$5.570

10k+ parts

$5.327

576

$8.210

$6.224

$5.570

$5.327

Mouser Electronics

USA . 426 parts In-Stock

1+ parts

$8.210

100+ parts

$6.230

1k+ parts

$4.940

10k+ parts

-

426

$8.210

$6.230

$4.940

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Distributors (In-Stock)

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Digiode

USA . 3,801 parts In-Stock

1+ parts

$7.657

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3,801

$7.657

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Vyrian

USA . 1,091 parts In-Stock

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$8.060

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1,091

$8.060

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Voyager Components

USA . 80 parts In-Stock

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$11.670

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80

$11.670

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Chip Stock

USA . 155,290 parts In-Stock

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155,290

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Classic Components Corporation

USA . 2,050 parts In-Stock

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2,050

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Lantek

USA . 750 parts In-Stock

1+ parts

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750

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LIBRA Elektronik GmbH

Germany . 456 parts In-Stock

1+ parts

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456

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Semi Source

USA . 199 parts In-Stock

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199

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 176 parts In-Stock

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176

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Speed Components Ltd

Israel . 175 parts In-Stock

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175

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Cyclops Electronics Ltd

UK . 170 parts In-Stock

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170

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Inventory MP

USA . 132 parts In-Stock

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132

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Bristol Electronics

USA . 132 parts In-Stock

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132

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NexGen Digital

USA . 118 parts In-Stock

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EMSNET

USA . 12 parts In-Stock

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12

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LittleDiode

UK . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 507 parts In-Stock

1+ parts

$0.091

100+ parts

-

1k+ parts

-

10k+ parts

$0.087

507

$0.091

-

-

$0.087

Northwest PG Solutions

USA . 1,053 parts In-Stock

1+ parts

$0.100

100+ parts

-

1k+ parts

-

10k+ parts

$0.088

1,053

$0.100

-

-

$0.088

Component Stockers USA

USA . 1,612 parts In-Stock

1+ parts

$6.730

100+ parts

$5.040

1k+ parts

$3.800

10k+ parts

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1,612

$6.730

$5.040

$3.800

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Corphita

USA . 1,486 parts In-Stock

1+ parts

$7.254

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1,486

$7.254

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Parana Technologies

USA . 1,916 parts In-Stock

1+ parts

$13.905

100+ parts

$1,291.324

1k+ parts

$12.515

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1,916

$13.905

$1,291.324

$12.515

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DigiPath Technology Company

USA . 770 parts In-Stock

1+ parts

$15.312

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770

$15.312

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IDEA Electronic Components Group

UK . 2,344 parts In-Stock

1+ parts

$15.624

100+ parts

$14.843

1k+ parts

$14.062

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2,344

$15.624

$14.843

$14.062

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ChromeModa Solutions

Germany . 639 parts In-Stock

1+ parts

$15.624

100+ parts

$12.812

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639

$15.624

$12.812

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Perfect Parts

USA . 39,258 parts In-Stock

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GreenTree Electronics

Israel . 17,000 parts In-Stock

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Lixinc

USA . 10,162 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,235 parts In-Stock

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7,235

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Alle Elektronik GmbH

Germany . 4,823 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,019 parts In-Stock

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1,019

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Authorized Procurement Solutions

USA . 240 parts In-Stock

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240

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Kepictronics

USA . 50 parts In-Stock

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FE SAS

France . 2 parts In-Stock

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2

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Overview

Enhance your cellphone's performance with the Texas Instruments CC2591RGVT RF Front End Circuit. Manufactured by industry leader Texas Instruments, this high-quality IC offers unparalleled reliability and efficiency. With its advanced technology and innovative design, the CC2591RGVT optimizes signal strength and connectivity, providing seamless communication for your device. Experience the difference with Texas Instruments and elevate your cellphone's capabilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material offers good durability and thermal resistance, ensuring the longevity and reliability of the product.

Surface Mount: YES

Being surface mountable makes the product easy to install and saves valuable space on the PCB, enhancing overall design efficiency.

Power Supplies (V): 3

Operating at a power supply voltage of 3V ensures compatibility with a wide range of devices and applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand harsh environmental conditions, making it suitable for industrial use.

Nominal Supply Voltage: 3 V

Having a nominal supply voltage of 3V ensures consistent performance and compatibility with standard power sources.

Technical Specifications

Cellphone ICs CC2591RGVT attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

4 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

CC2591RGVT Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.G

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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