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CC2511F8RSP

Texas Instruments

CC2511F8RSP by Texas Instruments

Texas Instruments CC2511F8RSP is a cellphone IC with 36 terminals in a square chip carrier package. Operating b/w 0-85°C, it features CMOS technology, RF and baseband circuitry for telecom applications. With a nominal voltage of 3.3V, it has a compact size of 6x6mm and terminal pitch of 0.5mm.

Median Price

$5.388

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 785 parts In-Stock

1+ parts

-

100+ parts

$4.310

1k+ parts

$3.860

10k+ parts

$3.630

785

-

$4.310

$3.860

$3.630

DigiKey

USA . 785 parts In-Stock

1+ parts

-

100+ parts

$5.680

1k+ parts

-

10k+ parts

-

785

-

$5.680

-

-

Verical

USA . 299 parts In-Stock

1+ parts

-

100+ parts

$5.388

1k+ parts

$4.825

10k+ parts

$4.537

299

-

$5.388

$4.825

$4.537

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,805 parts In-Stock

1+ parts

$4.009

100+ parts

-

1k+ parts

-

10k+ parts

-

1,805

$4.009

-

-

-

Vyrian

USA . 4,000 parts In-Stock

1+ parts

$4.220

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

$4.220

-

-

-

Euro-Tech

UK . 461 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

461

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 397 parts In-Stock

1+ parts

$1.830

100+ parts

-

1k+ parts

-

10k+ parts

-

397

$1.830

-

-

-

Northwest PG Solutions

USA . 2,300 parts In-Stock

1+ parts

$2.013

100+ parts

-

1k+ parts

-

10k+ parts

-

2,300

$2.013

-

-

-

Corphita

USA . 4,417 parts In-Stock

1+ parts

$3.798

100+ parts

-

1k+ parts

-

10k+ parts

-

4,417

$3.798

-

-

-

Parana Technologies

USA . 1,096 parts In-Stock

1+ parts

$7.296

100+ parts

-

1k+ parts

$7.792

10k+ parts

-

1,096

$7.296

-

$7.792

-

DigiPath Technology Company

USA . 1,233 parts In-Stock

1+ parts

$8.034

100+ parts

$7.391

1k+ parts

-

10k+ parts

-

1,233

$8.034

$7.391

-

-

ChromeModa Solutions

Germany . 5,959 parts In-Stock

1+ parts

$8.198

100+ parts

$6.722

1k+ parts

-

10k+ parts

-

5,959

$8.198

$6.722

-

-

IDEA Electronic Components Group

UK . 889 parts In-Stock

1+ parts

$8.198

100+ parts

-

1k+ parts

$7.378

10k+ parts

-

889

$8.198

-

$7.378

-

QUARKTWIN TECHNOLOGY LTD

USA . 5,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,250

-

-

-

-

Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,790

-

-

-

-

Overview

Elevate your cellphone experience with the CC2511F8RSP by Texas Instruments. Designed with precision and quality in mind, this surface-mount IC offers unmatched performance and reliability. From seamless connectivity to enhanced signal processing, this product is a game-changer in the industry. Whether you're a tech enthusiast or a professional in the field, the benefits of this chip carrier with heat sink/slug package shape are undeniable. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape is more compact and can fit neatly onto circuit boards, optimizing space usage.

Power Supplies (V): 3

Operating at a lower voltage of 3V can help enhance energy efficiency and reduce power consumption.

No. of Terminals: 36

Having a high number of terminals allows for more connectivity options and flexibility in circuit design.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style combination offers efficient heat dissipation, compact size, and low profile for versatile usage.

Maximum Operating Temperature: 85 °C

Being able to operate at a higher temperature range of 85 °C ensures durability and reliability in various environments.

Minimum Operating Temperature: 0 °C

The ability to operate at a low temperature of 0 °C makes this product suitable for a wide range of operating conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Using this terminal finish enhances conductivity, corrosion resistance, and ensures a reliable connection.

Terminal Position: QUAD

Quad terminal position provides stability and secure connection for the IC, reducing the risk of signal loss or failure.

Maximum Seated Height: 0.9 mm

With a maximum seated height of 0.9 mm, this product is suitable for compact devices where space is limited.

Width: 6 mm

The width of 6 mm allows for easy integration into various circuit board layouts and designs.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260C, this IC can withstand high-temperature soldering processes without damage.

Length: 6 mm

The length of 6 mm provides a balanced form factor for the IC, making it suitable for various applications.

Technology: CMOS

Using CMOS technology offers low power consumption, high noise immunity, and fast switching speeds for efficient performance.

Terminal Form: NO LEAD

Having a lead-free terminal form is environmentally friendly and complies with regulations, making it a sustainable choice.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Being a combination of RF and Baseband circuit types offers versatility and compatibility for different communication applications.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures stable performance and compatibility with standard power sources.

Terminal Pitch: 0.5 mm

Having a terminal pitch of 0.5 mm allows for close spacing and compact layout, ideal for miniaturized electronic devices.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates the IC can withstand moderate exposure to moisture during storage or assembly.

Technical Specifications

Cellphone ICs CC2511F8RSP attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Trade Compliance

CC2511F8RSP Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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