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ADRV9010BBCZ

Analog Devices

ADRV9010BBCZ by Analog Devices

Analog Devices' ADRV9010BBCZ is a cellphone IC with 289 terminals in a low profile, fine pitch grid array package. It operates b/w -40 °C to 110°C and has a terminal pitch of 0.8mm. Ideal for RF and baseband circuits in telecommunications applications due to its 1V supply voltage requirement.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,028 parts In-Stock

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Digiode

USA . 86 parts In-Stock

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AZTECH Wire

Italy . 545 parts In-Stock

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$5.559

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545

$5.559

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Parana Technologies

USA . 1,903 parts In-Stock

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$10.251

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$9.534

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IDEA Electronic Components Group

UK . 673 parts In-Stock

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$11.023

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$10.472

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$10.472

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673

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$10.472

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DigiPath Technology Company

USA . 773 parts In-Stock

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$17.196

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$16.508

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$16.508

773

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$16.508

Semicontronic

India . 251 parts In-Stock

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$608.000

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$592.800

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$589.760

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One Stop Electronics

USA . 619 parts In-Stock

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$895.000

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Ampacity Inc.

Singapore . 987 parts In-Stock

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$907.000

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$907.000

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Native Components

USA . 982 parts In-Stock

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Northwest PG Solutions

USA . 884 parts In-Stock

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Corphita

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Overview

Upgrade your cellphone technology with the ADRV9010BBCZ by Analog Devices. This cutting-edge RF and baseband circuit IC offers unparalleled quality and performance, designed to meet the demands of today's fast-paced digital world. With a package body material of plastic/epoxy and a grid array, low profile, fine pitch style, this product ensures reliability and efficiency. Whether you're looking to enhance your smartphone's connectivity or improve your network performance, the ADRV9010BBCZ provides the value and benefits you need. Trust Analog Devices, a leader in semiconductor manufacturing, to deliver excellence in every aspect of your cellphone IC needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for long-term use.

Surface Mount: YES

Surface mount capability makes it easy to integrate into various electronic devices.

Package Shape: SQUARE

Square shape allows for efficient use of space and easier placement on circuit boards.

No. of Terminals: 289

High number of terminals allow for complex circuit connections and functionality.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style ensures optimized performance and space-saving design.

Maximum Operating Temperature: 110 °C

High maximum operating temperature ensures stability and reliability in different environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows for use in various climates and settings.

Terminal Position: BOTTOM

Bottom terminal position enables secure connections and efficient PCB layout.

Maximum Seated Height: 1.43 mm

Low maximum seated height saves space and allows for compact device designs.

Width: 14 mm

Compact width enables space-efficient placement on circuit boards.

Length: 14 mm

Short length allows for flexibility in device design and layout.

Terminal Form: BALL

Ball terminal form ensures reliable connections and signal integrity.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Specialized RF and baseband circuit type makes it suitable for telecommunication applications.

Nominal Supply Voltage: 1 V

Low nominal supply voltage helps in reducing power consumption and heat generation.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for precise connections and high-density integration.

Technical Specifications

Cellphone ICs ADRV9010BBCZ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B289

Length:

14 mm

No. of Functions:

1

No. of Terminals:

289

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.43 mm

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

ADRV9010BBCZ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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