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ADRV9010BBCZ-A-RL

Analog Devices

ADRV9010BBCZ-A-RL by Analog Devices

Analog Devices' ADRV9010BBCZ-A-RL is a CELLPHONE IC with 289 terminals in a PLASTIC/EPOXY package. It operates b/w -40 to 110 °C, suitable for RF and baseband circuits. The low-profile GRID ARRAY design with 0.8mm terminal pitch makes it ideal for compact mobile devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,577 parts In-Stock

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Digiode

USA . 904 parts In-Stock

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Parana Technologies

USA . 3,760 parts In-Stock

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$12.016

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$11.175

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IDEA Electronic Components Group

UK . 1,609 parts In-Stock

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$12.920

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$12.274

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$12.274

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AZTECH Wire

Italy . 860 parts In-Stock

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$17.719

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DigiPath Technology Company

USA . 271 parts In-Stock

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$20.155

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$19.349

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One Stop Electronics

USA . 819 parts In-Stock

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$132.000

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$132.000

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Semicontronic

India . 987 parts In-Stock

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$876.000

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$854.100

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$849.720

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$876.000

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Northwest PG Solutions

USA . 2,363 parts In-Stock

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Native Components

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Corphita

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Overview

Unlock the power of seamless connectivity with Analog Devices' ADRV9010BBCZ-A-RL Cellphone IC. Crafted with precision and expertise, this cutting-edge telecom IC offers unparalleled performance in RF and baseband circuitry. Whether you're designing the latest smartphone or optimizing network infrastructure, this product guarantees reliable operation in extreme temperatures and compact dimensions. Elevate your projects with Analog Devices' trusted quality and innovative solutions. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and durable, making it a good choice for portable electronic devices like cellphones.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the cellphone IC, reducing production costs.

Package Shape: SQUARE

Square package shape helps in compact design and efficient use of space in the cellphone, allowing for more components to be integrated.

No. of Terminals: 289

Having a high number of terminals allows for more connectivity options and functionalities in the cellphone IC.

Maximum Operating Temperature: 110 °C

High maximum operating temperature ensures reliable performance even in extreme conditions, increasing the overall reliability of the cellphone IC.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the cellphone IC to function in cold environments without any issues, ensuring versatile usage.

Terminal Position: BOTTOM

Bottom terminal position helps in efficient heat dissipation and electrical connectivity, ensuring stable performance of the cellphone IC.

Maximum Seated Height: 1.43 mm

Low maximum seated height enables slim and sleek design of the cellphone, making it visually appealing and easier to handle.

Width: 14 mm

Narrow width allows for a more compact and space-saving design of the cellphone, enhancing portability and user convenience.

Length: 14 mm

Short length helps in achieving a more symmetrical and balanced layout for the cellphone IC, ensuring optimal performance.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and easy soldering process, improving the overall quality and durability of the cellphone IC.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuit in one IC simplifies the design and integration process, making the cellphone more efficient and cost-effective.

Nominal Supply Voltage: 1 V

Low nominal supply voltage results in lower power consumption and heat generation, enhancing the energy efficiency of the cellphone IC.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density packaging and miniaturization of the cellphone IC, increasing functionality while reducing space requirements.

Technical Specifications

Cellphone ICs ADRV9010BBCZ-A-RL attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B289

Length:

14 mm

No. of Functions:

1

No. of Terminals:

289

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.43 mm

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

14 mm

Trade Compliance

ADRV9010BBCZ-A-RL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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