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MAX2685EEE+T

Analog Devices

MAX2685EEE+T by Analog Devices

MAX2685EEE+T by Analog Devices is a 16-terminal cellphone IC in small outline package. With operating temp range of -40 to 85 °C, it's ideal for RF and baseband circuits. Features include matte tin finish, shrink pitch style, and 3V supply voltage.

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MAX2685EEE+T by Analog Devices
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Vyrian

USA . 3,268 parts In-Stock

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Digiode

USA . 1,163 parts In-Stock

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Anansix

USA . 542 parts In-Stock

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542

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MARBEL Systems

Belgium . 45 parts In-Stock

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$9.330

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45

$9.330

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AZTECH Wire

Italy . 837 parts In-Stock

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$9.763

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837

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Texas Native Microelectronics

USA . 4,740 parts In-Stock

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$10.724

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$10.295

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$9.973

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$9.437

4,740

$10.724

$10.295

$9.973

$9.437

Kenton Components

USA . 1,553 parts In-Stock

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$12.869

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$11.325

1,553

$12.869

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$11.325

Qasali Group International

UK . 30 parts In-Stock

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$28.955

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$26.928

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$25.480

30

$28.955

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$26.928

$25.480

One Stop Electronics

USA . 2,620 parts In-Stock

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$925.000

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$925.000

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Semicontronic

India . 550 parts In-Stock

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$942.000

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$918.450

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$913.740

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550

$942.000

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QUARKTWIN TECHNOLOGY LTD

USA . 7,218 parts In-Stock

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Corphita

USA . 2,942 parts In-Stock

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Overview

Unlock the full potential of your cellphone with the MAX2685EEE+T by Analog Devices. Manufactured with precision and expertise, this RF and baseband circuit IC offers unparalleled performance and reliability. Perfect for a wide range of applications, this small outline package is designed for industrial-grade temperatures, making it ideal for demanding environments. Experience the seamless integration and superior quality that only Analog Devices can provide. Elevate your cellphone experience with the MAX2685EEE+T today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers durability and protection for the internal components of the Cellphone ICs, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the Cellphone ICs onto the circuit board, saving time during the manufacturing process.

No. of Terminals: 16

Having 16 terminals provides sufficient connectivity options for various functions and interfaces within the Cellphone ICs, allowing for versatile applications.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature of 85 °C ensures reliability and performance stability even under demanding environmental conditions, making it suitable for industrial use.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V indicates that the Cellphone ICs are energy-efficient, consuming lower power while delivering optimal performance.

Technical Specifications

Cellphone ICs MAX2685EEE+T attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

4.89 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.73 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MAX2685EEE+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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