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TC5584IUF#TRPBF

Analog Devices

TC5584IUF#TRPBF by Analog Devices

Analog Devices' TC5584IUF#TRPBF is a cellphone IC with 24 terminals in a square chip carrier package. It features RF and baseband circuit for telecom applications, operates at 5V supply voltage, and has a terminal pitch of 0.5mm. Ideal for compact mobile devices due to its very thin profile and surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,023 parts In-Stock

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Digiode

USA . 2,224 parts In-Stock

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Anansix

USA . 1,782 parts In-Stock

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MARBEL Systems

Belgium . 2,287 parts In-Stock

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$6.653

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$6.653

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Texas Native Microelectronics

USA . 100 parts In-Stock

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$7.647

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$7.341

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$7.112

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$6.729

100

$7.647

$7.341

$7.112

$6.729

Kenton Components

USA . 1,835 parts In-Stock

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$9.176

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$8.075

1,835

$9.176

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$8.075

Parana Technologies

USA . 4,761 parts In-Stock

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$11.827

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$10.999

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$11.827

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$10.999

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IDEA Electronic Components Group

UK . 355 parts In-Stock

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$12.717

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$12.081

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$12.081

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$12.717

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$12.081

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AZTECH Wire

Italy . 381 parts In-Stock

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$16.949

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DigiPath Technology Company

USA . 1,920 parts In-Stock

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$19.839

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$19.045

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$19.045

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$19.045

Qasali Group International

UK . 2,427 parts In-Stock

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$20.647

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$19.202

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$18.169

2,427

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One Stop Electronics

USA . 2,939 parts In-Stock

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$409.000

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Semicontronic

India . 1,047 parts In-Stock

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$920.000

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$897.000

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$892.400

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1,047

$920.000

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Corphita

USA . 2,015 parts In-Stock

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Corohmni

South Africa . 183 parts In-Stock

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Overview

Experience the superior quality and reliability of Analog Devices with the TC5584IUF#TRPBF, a cutting-edge Cellphone IC designed to enhance performance and efficiency. With its innovative technology and advanced features, this product delivers exceptional value and benefits to customers in the telecommunications industry. From RF to baseband circuits, this versatile IC offers a wide range of applications, making it the ideal choice for your next project. Trust Analog Devices to provide you with top-of-the-line solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and resistance to various environmental conditions, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on circuit boards, saving time and effort during manufacturing.

Package Shape: SQUARE

The square shape helps in efficient space utilization on the circuit board, enabling a compact and streamlined design for the overall product.

No. of Terminals: 24

Having 24 terminals provides ample connection points for various components, allowing for complex circuit designs and functionalities.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The chip carrier with a very thin profile ensures a compact form factor for the product, ideal for slim and lightweight cellphone designs.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish with annealing improves solderability and enhances the overall reliability of the connections, ensuring stable performance over time.

Terminal Position: QUAD

Quad terminal position allows for better signal integrity and reduced crosstalk between terminals, ensuring high-quality communication within the device.

Maximum Seated Height: 0.8 mm

Low seated height contributes to a slimmer overall profile of the product, ideal for modern and sleek cellphone designs.

Width: 4 mm

A narrow width of 4mm helps in minimizing space requirements on the circuit board, enabling more components to be packed in a limited area.

Length: 4 mm

With a compact length of 4mm, the product can be efficiently integrated into small form factor devices without compromising functionality.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and is safer for human health, contributing to a sustainable and eco-friendly product.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuits in one IC enhances signal processing capabilities and improves overall performance in cellphone communication.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and simplifies integration into existing cellphone systems.

Terminal Pitch: 0.5 mm

A small terminal pitch of 0.5mm allows for high-density mounting of components, enabling more functionalities to be packed into a limited space.

Technical Specifications

Cellphone ICs TC5584IUF#TRPBF attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e3

Length:

4 mm

No. of Functions:

1

No. of Terminals:

24

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

TC5584IUF#TRPBF Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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