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MAX19995ETX+T

Analog Devices

MAX19995ETX+T by Analog Devices

MAX19995ETX+T by Analog Devices is a Cellphone IC with BICMOS tech. It operates b/w -40 to 85 °C, has 36 terminals in a square chip carrier package, and requires 3V supply voltage. Ideal for RF front end circuits in telecom applications due to its compact size and industrial temperature grade suitability.

Median Price

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3

In-Stock Inventory

1k+

MAX19995ETX+T by Analog Devices
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Vyrian

USA . 7,444 parts In-Stock

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7,444

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Anansix

USA . 2,348 parts In-Stock

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2,348

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Digiode

USA . 2,146 parts In-Stock

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2,146

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MARBEL Systems

Belgium . 2,841 parts In-Stock

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$6.573

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$6.573

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AZTECH Wire

Italy . 527 parts In-Stock

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$7.430

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527

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Texas Native Microelectronics

USA . 16,538 parts In-Stock

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$7.555

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$7.253

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$7.026

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$6.648

16,538

$7.555

$7.253

$7.026

$6.648

Kenton Components

USA . 200 parts In-Stock

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$9.066

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$7.978

200

$9.066

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$7.978

Qasali Group International

UK . 704 parts In-Stock

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$20.398

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$18.971

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$17.951

704

$20.398

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$18.971

$17.951

One Stop Electronics

USA . 2,186 parts In-Stock

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$145.000

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Semicontronic

India . 1,242 parts In-Stock

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$412.000

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$401.700

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$399.640

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1,242

$412.000

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$399.640

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Glotronic Ltd.

UK . 2,117 parts In-Stock

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Corphita

USA . 1,540 parts In-Stock

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Overview

Elevate your cellphone's performance with the MAX19995ETX+T from Analog Devices. As a leading manufacturer in the industry, Analog Devices delivers top-notch quality and reliability in their products. Designed for RF front end circuits, this cellphone IC offers unparalleled value and benefits to customers seeking enhanced connectivity and signal processing. With its advanced technology and industrial-grade temperature range, this surface mount chip carrier is the perfect solution for maximizing your device's potential. Experience the advantages of Analog Devices with the MAX19995ETX+T today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient placement of the IC onto circuit boards, making it a convenient choice for manufacturing processes.

Package Shape: SQUARE

The square package shape provides a compact design, saving space on the circuit board and enabling efficient use of available space.

No. of Terminals: 36

With a higher number of terminals, this IC offers greater connectivity options and functionalities, allowing for versatile usage in various applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in elevated temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows for operation in cold environments without compromising performance, enhancing the IC's versatility.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides a durable and corrosion-resistant surface, ensuring long-term reliability of the IC in various environmental conditions.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that this IC is designed to withstand harsh industrial environments, providing robust performance and durability.

Technology: BICMOS

The BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed operation and low power consumption, making it an efficient choice for telecom applications.

Nominal Supply Voltage: 3 V

The 3V supply voltage requirement ensures compatibility with a wide range of systems and power sources, making it easy to integrate this IC into existing designs.

Technical Specifications

Cellphone ICs MAX19995ETX+T attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

MAX19995ETX+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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