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MAX19995AETX+

Analog Devices

MAX19995AETX+ by Analog Devices

MAX19995AETX+ by Analog Devices is a Cellphone IC with BICMOS tech. It operates b/w -40 to 85 °C, has 36 terminals in a square package style, and requires 5V supply voltage. Ideal for RF and baseband circuits in telecom applications due to its small form factor and high-temperature tolerance.

Median Price

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3

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1k+

MAX19995AETX+ by Analog Devices
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Vyrian

USA . 3,998 parts In-Stock

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Anansix

USA . 2,471 parts In-Stock

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Digiode

USA . 1,712 parts In-Stock

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Advanced Electronics

New Zealand . 270 parts In-Stock

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$12.017

100+ parts

$10.935

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$9.854

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270

$12.017

$10.935

$9.854

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MARBEL Systems

Belgium . 27,009 parts In-Stock

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$13.005

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Texas Native Microelectronics

USA . 100 parts In-Stock

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$14.948

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$14.350

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$13.902

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$13.154

100

$14.948

$14.350

$13.902

$13.154

AZTECH Wire

Italy . 830 parts In-Stock

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$17.181

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Kenton Components

USA . 1,446 parts In-Stock

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$17.938

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$15.785

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Qasali Group International

UK . 2,802 parts In-Stock

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$40.360

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Component Stockers USA

USA . 233 parts In-Stock

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$99.990

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233

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Semicontronic

India . 1,432 parts In-Stock

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$496.000

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$483.600

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$481.120

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One Stop Electronics

USA . 1,181 parts In-Stock

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$546.000

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Corphita

USA . 2,601 parts In-Stock

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Perfect Parts

USA . 812 parts In-Stock

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Overview

Elevate your cellphone's performance with the MAX19995AETX+ by Analog Devices, a top-tier manufacturer known for delivering cutting-edge semiconductor solutions. This Cellphone IC boasts exceptional quality and reliability, making it the perfect choice for a wide range of applications. From RF to baseband circuits, this chip carrier with a very thin profile offers unmatched value and benefits to customers looking to enhance their device's capabilities. Experience seamless connectivity and superior functionality with the MAX19995AETX+, setting a new standard in telecom IC technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design, making this product ideal for compact devices.

Package Shape: SQUARE

Square package shape provides stability and efficient use of space within the device.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can withstand high temperatures, making it suitable for a variety of environments and applications.

Technology: BICMOS

The BICMOS technology used in this product combines the advantages of both bipolar and CMOS technologies, offering high-performance and low power consumption.

Nominal Supply Voltage: 5 V

Operates at a nominal supply voltage of 5 V, making it compatible with standard power sources and easy to integrate into existing systems.

Technical Specifications

Cellphone ICs MAX19995AETX+ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

MAX19995AETX+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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