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MAX1958ETP+

Analog Devices

MAX1958ETP+ by Analog Devices

Analog Devices' MAX1958ETP+ is a BICMOS technology-based cellphone IC with 20 terminals in a square chip carrier package. It operates b/w -40 °C to 85°C, suitable for industrial applications. With a nominal voltage of 3.6V, it serves as a baseband circuit in telecom devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,587 parts In-Stock

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Digiode

USA . 2,533 parts In-Stock

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Anansix

USA . 1,340 parts In-Stock

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1,340

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MARBEL Systems

Belgium . 964 parts In-Stock

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$9.324

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$9.324

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Texas Native Microelectronics

USA . 352 parts In-Stock

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$10.717

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$10.288

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$9.967

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$9.431

352

$10.717

$10.288

$9.967

$9.431

Kenton Components

USA . 163 parts In-Stock

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$12.860

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$11.317

163

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$11.317

AZTECH Wire

Italy . 251 parts In-Stock

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$14.220

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251

$14.220

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Qasali Group International

UK . 6,596 parts In-Stock

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$28.936

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$26.910

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$25.464

6,596

$28.936

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$25.464

One Stop Electronics

USA . 3,209 parts In-Stock

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$355.000

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Semicontronic

India . 718 parts In-Stock

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$837.000

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$816.075

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$811.890

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718

$837.000

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$811.890

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Corphita

USA . 1,268 parts In-Stock

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Overview

Unlock the full potential of your cellphone with the MAX1958ETP+ by Analog Devices. Designed with precision and quality in mind, this innovative Cellphone IC offers unmatched performance and reliability. Whether you're looking to enhance the battery life, improve signal processing, or optimize power management, this product delivers exceptional value and benefits. Trust Analog Devices, a leading manufacturer in the industry, and elevate your cellphone experience today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for efficient and reliable PCB assembly, making this product suitable for automated manufacturing processes.

Package Shape: SQUARE

The square package shape provides a compact form factor, optimizing space on the PCB and allowing for denser designs.

No. of Terminals: 20

With 20 terminals, this product offers sufficient connectivity options for various functions and interfaces, making it versatile in cellphone applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the product can withstand demanding environmental conditions, enhancing reliability and performance.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and corrosion resistance, increasing the longevity of the product and ensuring robust connections.

Technology: BICMOS

Utilizing BiCMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed performance and low power consumption for efficient operation.

Nominal Supply Voltage: 3.6 V

The nominal supply voltage of 3.6 V is common in cellphone applications, ensuring compatibility and ease of integration into existing systems.

Technical Specifications

Cellphone ICs MAX1958ETP+ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MAX1958ETP+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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