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MAX1959ETP+

Analog Devices

MAX1959ETP+ by Analog Devices

MAX1959ETP+ by Analog Devices is a Cellphone IC with 20 terminals in a square package. It operates b/w -40 to 85 °C, suitable for industrial use. This BASEBAND CIRCUIT has a nominal voltage of 3.6V and uses BICMOS technology for efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,733 parts In-Stock

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Anansix

USA . 2,583 parts In-Stock

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Digiode

USA . 829 parts In-Stock

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829

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AZTECH Wire

Italy . 325 parts In-Stock

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$6.829

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$6.829

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MARBEL Systems

Belgium . 2,116 parts In-Stock

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$12.724

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Texas Native Microelectronics

USA . 1,949 parts In-Stock

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$14.625

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$14.040

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$13.601

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$12.870

1,949

$14.625

$14.040

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$12.870

Kenton Components

USA . 1,252 parts In-Stock

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$17.550

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$15.444

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$15.444

Qasali Group International

UK . 3,857 parts In-Stock

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$39.488

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Semicontronic

India . 406 parts In-Stock

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$377.000

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$367.575

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$365.690

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One Stop Electronics

USA . 688 parts In-Stock

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$740.000

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Corphita

USA . 2,031 parts In-Stock

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Overview

Unlock the potential of your cellphone with the MAX1959ETP+ by Analog Devices. Designed with precision and expertise, Analog Devices delivers top-notch quality in cellphone ICs. This versatile component offers a wide range of applications, ensuring seamless performance and reliability. Elevate your device with the MAX1959ETP+ and experience the value, benefits, and advantages it brings to your technology. Trust Analog Devices for cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and reducing production costs.

Package Shape: SQUARE

Square package shape provides a compact design that can easily fit into modern cellphone designs without taking up too much space.

No. of Terminals: 20

Having 20 terminals allows for sufficient connectivity options and versatility in connecting to other components within the cellphone.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures that the IC can handle the heat generated within the cellphone without malfunctioning, increasing its reliability.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the IC to function effectively even in colder environments, making it suitable for various usage scenarios.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good electrical conductivity, while the annealed state ensures durability and resistance to corrosion, enhancing the longevity of the IC.

Technology: BICMOS

BICMOS technology combines the strengths of both bipolar and CMOS technologies, offering high performance, low power consumption, and improved reliability for the IC.

Nominal Supply Voltage: 3.6 V

Compatible with standard cellphone battery voltages, ensuring seamless integration with the power supply system of the device.

Technical Specifications

Cellphone ICs MAX1959ETP+ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MAX1959ETP+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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