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MAX19995AETX+T

Analog Devices

MAX19995AETX+T by Analog Devices

MAX19995AETX+T by Analog Devices is a Cellphone IC with 36 terminals in a square chip carrier package. Operating temperature range from -40 to 85 °C, BICMOS technology, and telecom IC type for RF and baseband circuits. Ideal for industrial applications requiring a nominal voltage of 5V.

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4

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1k+

MAX19995AETX+T by Analog Devices
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Vyrian

USA . 2,865 parts In-Stock

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Digiode

USA . 2,521 parts In-Stock

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Anansix

USA . 1,436 parts In-Stock

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Chip Stock

USA . 875 parts In-Stock

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MARBEL Systems

Belgium . 328 parts In-Stock

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$7.404

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Texas Native Microelectronics

USA . 33,264 parts In-Stock

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$8.510

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$8.170

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$7.914

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$7.489

33,264

$8.510

$8.170

$7.914

$7.489

AZTECH Wire

Italy . 458 parts In-Stock

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$9.222

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Kenton Components

USA . 1,928 parts In-Stock

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$10.212

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$8.987

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Qasali Group International

UK . 5,340 parts In-Stock

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$22.977

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$21.369

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$20.220

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$20.220

Semicontronic

India . 716 parts In-Stock

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$494.000

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$481.650

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$479.180

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716

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One Stop Electronics

USA . 2,011 parts In-Stock

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$784.000

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QUARKTWIN TECHNOLOGY LTD

USA . 19,415 parts In-Stock

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Perfect Parts

USA . 3,291 parts In-Stock

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Corphita

USA . 2,224 parts In-Stock

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Glotronic Ltd.

UK . 2,117 parts In-Stock

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Kepictronics

USA . 1,460 parts In-Stock

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Overview

Enhance the performance of your cellphone with the MAX19995AETX+T by Analog Devices. This cutting-edge Cellphone IC boasts unparalleled quality and reliability from a trusted manufacturer. With a wide range of applications in the telecom industry, this IC delivers exceptional value and benefits to customers seeking superior RF and baseband circuitry. Upgrade your device today and experience the advantages of Analog Devices technology at its finest.

Feature Benefit Bullets

Surface Mount: YES

Enables easy and efficient PCB assembly, reducing production time and cost.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB, maximizing component density.

No. of Terminals: 36

Sufficient number of terminals for connectivity and functionality in a compact IC.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable performance in extreme conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good solderability and conductivity for reliable connections.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption.

Nominal Supply Voltage: 5 V

Standard supply voltage for compatibility with a wide range of systems and applications.

Technical Specifications

Cellphone ICs MAX19995AETX+T attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

MAX19995AETX+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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