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TLV320AC56IPT

Texas Instruments

TLV320AC56IPT by Texas Instruments

TLV320AC56IPT by Texas Instruments is a 48-terminal cellphone IC with 3V supply voltage. It features a 13-bit linear coding, mu-law companding law, and operates in industrial temperature range (-40 to 85°C). Ideal for baseband circuits, this CMOS technology IC has a low profile flatpack package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,461 parts In-Stock

1+ parts

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2,461

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Vyrian

USA . 1,987 parts In-Stock

1+ parts

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1,987

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 879 parts In-Stock

1+ parts

$8.113

100+ parts

-

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879

$8.113

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Parana Technologies

USA . 1,090 parts In-Stock

1+ parts

$12.512

100+ parts

-

1k+ parts

$12.957

10k+ parts

-

1,090

$12.512

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$12.957

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ChromeModa Solutions

Germany . 3,602 parts In-Stock

1+ parts

$14.058

100+ parts

$11.528

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3,602

$14.058

$11.528

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IDEA Electronic Components Group

UK . 657 parts In-Stock

1+ parts

$14.058

100+ parts

$13.355

1k+ parts

$12.652

10k+ parts

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657

$14.058

$13.355

$12.652

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One Stop Electronics

USA . 1,147 parts In-Stock

1+ parts

$644.000

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1,147

$644.000

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Corphita

USA . 3,580 parts In-Stock

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3,580

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DigiPath Technology Company

USA . 1,618 parts In-Stock

1+ parts

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$12.675

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1,618

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$12.675

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Overview

Discover the cutting-edge TLV320AC56IPT by Texas Instruments, a high-quality Cellphone IC that offers unparalleled performance and reliability. With Texas Instruments' reputation for excellence in semiconductor manufacturing, this product is sure to exceed your expectations. Ideal for a wide range of applications, this IC provides exceptional value with its compact design, low power consumption, and advanced technology. Enhance your products with the TLV320AC56IPT and experience the benefits of superior quality and precision engineering. Elevate your projects to the next level with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and heat resistance, making this product reliable in various operating conditions.

Surface Mount: YES

Surface mount design allows for easy installation and space-saving on the circuit board.

Power Supplies (V): 3

Operating at 3V ensures energy efficiency and compatibility with standard power sources.

No. of Terminals: 48

Having 48 terminals enables connectivity to a wide range of components for versatile functionality.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can perform reliably in demanding environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality even in cold conditions.

Technology: CMOS

Using CMOS technology offers low power consumption and high noise immunity for efficient performance.

Maximum Supply Current: 0.0075 mA

With low maximum supply current, this product is energy-efficient and minimizes power consumption.

Telecom IC Type: BASEBAND CIRCUIT

Being a baseband circuit telecom IC type, this product facilitates signal processing and communication functions effectively.

Technical Specifications

Cellphone ICs TLV320AC56IPT attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

1 dB

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Linear Coding:

13-BIT

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Codecs

Maximum Supply Current:

.0075 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

TLV320AC56IPT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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