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TRF3701IRHC

Texas Instruments

TRF3701IRHC by Texas Instruments

TRF3701IRHC by Texas Instruments is a cellphone IC with 16 terminals, operating at -40 to 85°C. It features a 5V supply voltage, RF and baseband circuit for telecom applications. The chip carrier package has a square shape, nickel palladium gold finish, and is surface mountable.

Median Price

$10.563

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,646 parts In-Stock

1+ parts

-

100+ parts

$8.450

1k+ parts

$7.560

10k+ parts

$7.110

6,646

-

$8.450

$7.560

$7.110

DigiKey

USA . 6,646 parts In-Stock

1+ parts

-

100+ parts

$11.110

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-

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6,646

-

$11.110

-

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Verical

USA . 3,360 parts In-Stock

1+ parts

-

100+ parts

$10.563

1k+ parts

$9.450

10k+ parts

$8.887

3,360

-

$10.563

$9.450

$8.887

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,560 parts In-Stock

1+ parts

$8.911

100+ parts

-

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-

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1,560

$8.911

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-

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Vyrian

USA . 4,375 parts In-Stock

1+ parts

$9.380

100+ parts

-

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4,375

$9.380

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Elcom Components

USA . 62 parts In-Stock

1+ parts

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62

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ACDS - Activité Composants Distribution Service

France . 60 parts In-Stock

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60

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Holdelec - ElecDif-Pro

France . 60 parts In-Stock

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60

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Bristol Electronics

USA . 14 parts In-Stock

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14

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,357 parts In-Stock

1+ parts

$8.442

100+ parts

-

1k+ parts

-

10k+ parts

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1,357

$8.442

-

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Parana Technologies

USA . 727 parts In-Stock

1+ parts

$9.451

100+ parts

-

1k+ parts

$10.062

10k+ parts

-

727

$9.451

-

$10.062

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DigiPath Technology Company

USA . 1,751 parts In-Stock

1+ parts

$10.407

100+ parts

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1k+ parts

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1,751

$10.407

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ChromeModa Solutions

Germany . 5,119 parts In-Stock

1+ parts

$10.619

100+ parts

$8.708

1k+ parts

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10k+ parts

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5,119

$10.619

$8.708

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IDEA Electronic Components Group

UK . 1,157 parts In-Stock

1+ parts

$10.619

100+ parts

$10.088

1k+ parts

$9.557

10k+ parts

-

1,157

$10.619

$10.088

$9.557

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A-Z Elektronik GmbH

Germany . 7,449 parts In-Stock

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7,449

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Perfect Parts

USA . 608 parts In-Stock

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608

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Assy Fe

Spain . 5 parts In-Stock

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5

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Overview

Enhance the performance of your cellphone with the TRF3701IRHC from Texas Instruments. Known for their high-quality products, Texas Instruments delivers cutting-edge solutions in the cellphone ICs category. This innovative chip carrier with a very thin profile offers unmatched value, providing seamless integration and reliable performance. Whether you're looking to boost RF and baseband circuits or optimize telecom applications, the TRF3701IRHC is the ideal choice. Upgrade your device with this industrial-grade component and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and reliability for the product.

Surface Mount: YES

Surface mount allows for easy and efficient installation of the IC onto a circuit board.

Package Shape: SQUARE

Square shape makes the IC compatible with a wide range of circuit board designs.

Power Supplies (V): 5

Operating at 5V allows for compatibility with common power sources.

No. of Terminals: 16

Having 16 terminals provides flexibility and connectivity options for the IC.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles provide versatility for different application requirements.

Maximum Operating Temperature: 85 °C

Operating at high temperatures ensures stable performance in challenging environments.

Minimum Operating Temperature: -40 °C

Operating at low temperatures allows for use in a wide range of conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish provides excellent conductivity and corrosion resistance.

Terminal Position: QUAD

Quad terminal position enables efficient connections and signal processing.

Maximum Seated Height: 1 mm

Low seated height allows for compact and slim device designs.

Width: 4 mm

Compact width facilitates easy integration into circuit board layouts.

Maximum Time At Peak Reflow Temperature (s): 30

Short peak reflow time reduces the risk of damage to the IC during soldering.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable soldering connections for the IC.

Length: 4 mm

Compact length allows for space-efficient placement on circuit boards.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the IC can operate reliably in harsh industrial environments.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and is more sustainable.

Telecom IC Type: RF AND BASEBAND CIRCUIT

RF and baseband circuit compatibility makes this IC suitable for telecommunications applications.

Nominal Supply Voltage: 5 V

Operating at 5V allows for compatibility with common power sources.

Terminal Pitch: 0.8 mm

Narrow terminal pitch enables high density mounting and efficient signal routing.

Moisture Sensitivity Level (MSL): 2

MSL 2 ensures the IC is less sensitive to moisture, making it more robust in humid environments.

Technical Specifications

Cellphone ICs TRF3701IRHC attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,32

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

TRF3701IRHC Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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