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TRF3701CRHC

Texas Instruments

TRF3701CRHC by Texas Instruments

TRF3701CRHC by Texas Instruments is a cellphone IC with 16 terminals, operating at 0-70°C. It features a 5V supply voltage, RF and baseband circuit for telecom applications. The chip carrier package has a square shape, measures 4x4mm in size, and is surface-mountable.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,772 parts In-Stock

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Digiode

USA . 4,480 parts In-Stock

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4,480

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Distributors (Availability)

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Parana Technologies

USA . 1,663 parts In-Stock

1+ parts

$8.871

100+ parts

-

1k+ parts

$9.554

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1,663

$8.871

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$9.554

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ChromeModa Solutions

Germany . 4,420 parts In-Stock

1+ parts

$9.967

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$8.173

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4,420

$9.967

$8.173

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IDEA Electronic Components Group

UK . 1,683 parts In-Stock

1+ parts

$9.967

100+ parts

$9.469

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$8.970

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1,683

$9.967

$9.469

$8.970

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AZTECH Wire

Italy . 423 parts In-Stock

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$17.276

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423

$17.276

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Semicontronic

India . 1,364 parts In-Stock

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$18.000

100+ parts

$17.550

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$17.460

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1,364

$18.000

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$17.460

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One Stop Electronics

USA . 1,454 parts In-Stock

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$111.000

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1,454

$111.000

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Ampacity Inc.

Singapore . 1,382 parts In-Stock

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$518.000

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$518.000

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DigiPath Technology Company

USA . 625 parts In-Stock

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$8.986

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625

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$8.986

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Corphita

USA . 280 parts In-Stock

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Corohmni

South Africa . 189 parts In-Stock

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Overview

Enhance the performance of your cellphone with the TRF3701CRHC by Texas Instruments. Known for their superior quality and innovation, Texas Instruments delivers top-notch Cellphone ICs that guarantee seamless connectivity and optimal functionality. This RF and baseband circuit boasts a compact design, making it ideal for modern mobile devices. Experience enhanced signal processing and reliability with this cutting-edge telecom IC. Upgrade your smartphone today with the TRF3701CRHC and stay connected like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for long-term use.

Surface Mount: YES

Surface mount technology makes installation easier and more efficient compared to through-hole mounting.

Power Supplies (V): 5

Operating at a standard voltage of 5V ensures compatibility with a wide range of systems and devices.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity options and functionality.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can handle high-demand situations without overheating.

Minimum Operating Temperature: 0 °C

Operating at temperatures as low as 0°C ensures reliable performance in a variety of environmental conditions.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuit capabilities in one product simplifies design and enhances overall performance in telecommunication applications.

Technical Specifications

Cellphone ICs TRF3701CRHC attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N16

Length:

4 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,32

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

TRF3701CRHC Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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