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HMC829LP6GETR

Analog Devices

HMC829LP6GETR by Analog Devices

Analog Devices' HMC829LP6GETR is a 40-terminal cellphone IC in a square chip carrier package. With an operating temperature range of -40 to 85 °C, it's ideal for industrial telecom applications requiring RF and baseband circuit integration. This surface-mount IC has a very thin profile, measures 6x6mm, and operates at a nominal voltage of 5V.

Median Price

$20.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,496 parts In-Stock

1+ parts

-

100+ parts

$20.000

1k+ parts

$17.890

10k+ parts

$16.840

3,496

-

$20.000

$17.890

$16.840

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 687 parts In-Stock

1+ parts

$21.109

100+ parts

-

1k+ parts

-

10k+ parts

-

687

$21.109

-

-

-

Vyrian

USA . 299 parts In-Stock

1+ parts

$22.220

100+ parts

-

1k+ parts

-

10k+ parts

-

299

$22.220

-

-

-

Chip Stock

USA . 1,125 parts In-Stock

1+ parts

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1,125

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,890 parts In-Stock

1+ parts

$10.874

100+ parts

-

1k+ parts

$10.113

10k+ parts

-

1,890

$10.874

-

$10.113

-

IDEA Electronic Components Group

UK . 1,505 parts In-Stock

1+ parts

$11.693

100+ parts

$11.108

1k+ parts

$11.108

10k+ parts

-

1,505

$11.693

$11.108

$11.108

-

DigiPath Technology Company

USA . 2,373 parts In-Stock

1+ parts

$18.241

100+ parts

$17.511

1k+ parts

-

10k+ parts

$17.511

2,373

$18.241

$17.511

-

$17.511

Semicontronic

India . 585 parts In-Stock

1+ parts

$18.890

100+ parts

$18.418

1k+ parts

$18.323

10k+ parts

-

585

$18.890

$18.418

$18.323

-

Corphita

USA . 132 parts In-Stock

1+ parts

$19.998

100+ parts

-

1k+ parts

-

10k+ parts

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132

$19.998

-

-

-

Component Stockers USA

USA . 2 parts In-Stock

1+ parts

$22.910

100+ parts

$21.540

1k+ parts

-

10k+ parts

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2

$22.910

$21.540

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-

QUARKTWIN TECHNOLOGY LTD

USA . 23,024 parts In-Stock

1+ parts

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23,024

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Authorized Procurement Solutions

USA . 2,800 parts In-Stock

1+ parts

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2,800

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Microchip USA

USA . 1,025 parts In-Stock

1+ parts

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100+ parts

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1,025

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Metaverse IC Inc.

Canada . 251 parts In-Stock

1+ parts

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251

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Overview

Enhance the performance of your cellphone with the HMC829LP6GETR by Analog Devices. Crafted with precision and expertise, this cutting-edge Cellphone IC offers unparalleled quality and reliability. Ideal for RF and baseband circuits, this product is designed to optimize your device's functionality. With its advanced features and industrial-grade temperature grade, the HMC829LP6GETR guarantees seamless operation even in extreme conditions. Upgrade your mobile experience today with this innovative solution from Analog Devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good protection for the internal components of the IC, making it durable and reliable.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape is compact and allows for efficient use of space on the PCB.

No. of Terminals: 40

Having 40 terminals provides ample connectivity options for various functions and interfaces in the cellphone IC.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation and space-saving design in the cellphone IC.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this IC can withstand harsh environmental conditions and maintain performance.

Minimum Operating Temperature: -40 °C

Operating reliably at a low temperature of -40 °C allows for versatile usage of the cellphone IC in various environments.

Terminal Position: QUAD

Quad terminal positions provide a balanced distribution of connections for efficient signal routing and connectivity.

Maximum Seated Height: 0.9 mm

A low maximum seated height of 0.9 mm contributes to the overall compactness and sleek design of the cellphone IC.

Width: 6 mm

A width of 6 mm allows for a slim and space-efficient design of the IC, suitable for modern cellphone form factors.

Maximum Time At Peak Reflow Temperature (s): 30

The capability to withstand peak reflow temperature for up to 30 seconds ensures robust soldering and manufacturing process compatibility.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, this IC can be effectively soldered onto PCBs using standard reflow techniques.

Length: 6 mm

A length of 6 mm contributes to the overall compactness and efficient layout of the cellphone IC on the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates high reliability and performance under challenging temperature conditions in industrial applications.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and compliant with RoHS regulations, reducing the environmental impact of the product.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuit functionality in a single IC enhances the integration and performance of the cellphone communications system.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V provides compatibility with standard power sources and achieves reliable performance in cellphone applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for fine-pitch connections, enabling high-density packaging and efficient signal routing in the cellphone IC.

Technical Specifications

Cellphone ICs HMC829LP6GETR attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N40

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

HMC829LP6GETR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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