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HMC830LP6GETR

Analog Devices

HMC830LP6GETR by Analog Devices

Analog Devices' HMC830LP6GETR is a 40-terminal cellphone IC in a square chip carrier package with matte tin finish. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features RF and baseband circuits, nominal voltage of 3.3V, and terminal pitch of 0.5mm for telecom applications.

Median Price

$12.190

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 881,584 parts In-Stock

1+ parts

-

100+ parts

$12.190

1k+ parts

$10.910

10k+ parts

$10.260

881,584

-

$12.190

$10.910

$10.260

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 39 parts In-Stock

1+ parts

$15.520

100+ parts

-

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39

$15.520

-

-

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Digiode

USA . 339 parts In-Stock

1+ parts

$17.356

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339

$17.356

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Vyrian

USA . 578,439 parts In-Stock

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578,439

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Cyclops Electronics Ltd

UK . 21,404 parts In-Stock

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21,404

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SPM Sales

USA . 3 parts In-Stock

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3

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Prism Electronics

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Corohmni

South Africa . 1,205 parts In-Stock

1+ parts

$7.331

100+ parts

-

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1,205

$7.331

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Parana Technologies

USA . 957 parts In-Stock

1+ parts

$13.726

100+ parts

-

1k+ parts

$12.765

10k+ parts

-

957

$13.726

-

$12.765

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Aztec Data Supply Inc.

USA . 2,300 parts In-Stock

1+ parts

$14.502

100+ parts

-

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2,300

$14.502

-

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IDEA Electronic Components Group

UK . 821 parts In-Stock

1+ parts

$14.759

100+ parts

$14.021

1k+ parts

$14.021

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821

$14.759

$14.021

$14.021

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Continental Prestige Electronics

USA . 1,582 parts In-Stock

1+ parts

$15.520

100+ parts

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1k+ parts

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$15.210

1,582

$15.520

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-

$15.210

Semicontronic

India . 578,450 parts In-Stock

1+ parts

$15.530

100+ parts

$15.142

1k+ parts

$15.064

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578,450

$15.530

$15.142

$15.064

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Corphita

USA . 17 parts In-Stock

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$16.443

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17

$16.443

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DigiPath Technology Company

USA . 2,342 parts In-Stock

1+ parts

$23.024

100+ parts

$22.103

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$22.103

2,342

$23.024

$22.103

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$22.103

Microchip USA

USA . 438 parts In-Stock

1+ parts

$42.970

100+ parts

$42.350

1k+ parts

$42.050

10k+ parts

$41.740

438

$42.970

$42.350

$42.050

$41.740

Futuretech Components

Singapore . 5,000 parts In-Stock

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5,000

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Lixinc

USA . 3,741 parts In-Stock

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Argo Parts USA

USA . 2,934 parts In-Stock

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2,934

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Technoshack Inc. (Excess)

Canada . 2,000 parts In-Stock

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2,000

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Perfect Parts

USA . 1,138 parts In-Stock

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Kepictronics

USA . 390 parts In-Stock

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390

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iodParts Technologies Inc.

India . 191 parts In-Stock

1+ parts

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$11.094

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191

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$11.094

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Overview

Enhance the performance of your cellphone with the HMC830LP6GETR from Analog Devices. Known for their high-quality products, Analog Devices delivers reliable solutions for the Telecom IC industry. This chip carrier with a very thin profile offers superb value and benefits to customers looking to optimize their RF and baseband circuits. With a wide operating temperature range and a durable plastic/epoxy package body material, this Surface Mount device is perfect for various applications. Upgrade your cellphone's capabilities with the HMC830LP6GETR and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

No. of Terminals: 40

Having 40 terminals provides ample connectivity options for various components, ensuring compatibility with different systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand elevated heat levels without compromising performance.

Terminal Finish: MATTE TIN

Matte tin finish on terminals enhances conductivity and solderability, improving overall reliability and functionality of the product.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V makes the product energy-efficient and suitable for a wide range of applications.

Technical Specifications

Cellphone ICs HMC830LP6GETR attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

HMC830LP6GETR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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