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HMC832ALP6GETR

Analog Devices

HMC832ALP6GETR by Analog Devices

Analog Devices' HMC832ALP6GETR is a cellphone IC with 40 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial telecom applications. It features RF and baseband circuits, operates at 3.3V, and has a compact size of 6x6mm with a terminal pitch of 0.5mm.

Median Price

$15.268

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 150 parts In-Stock

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$15.268

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Vyrian

USA . 6,290 parts In-Stock

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Digiode

USA . 754 parts In-Stock

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AZTECH Wire

Italy . 830 parts In-Stock

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$6.504

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$6.504

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Aztec Data Supply Inc.

USA . 14,379 parts In-Stock

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$9.130

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Parana Technologies

USA . 1,825 parts In-Stock

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$10.803

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$10.047

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$10.803

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IDEA Electronic Components Group

UK . 2,329 parts In-Stock

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$11.616

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$11.035

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$11.035

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Vigor

Singapore . 159 parts In-Stock

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$14.890

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Continental Prestige Electronics

USA . 3,097 parts In-Stock

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$15.268

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$14.962

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Corohmni

South Africa . 93 parts In-Stock

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$16.480

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DigiPath Technology Company

USA . 117 parts In-Stock

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$18.121

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$17.396

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$17.396

Semicontronic

India . 1,481 parts In-Stock

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$161.000

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$156.975

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$156.170

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One Stop Electronics

USA . 1,451 parts In-Stock

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$651.000

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Ampacity Inc.

Singapore . 658 parts In-Stock

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$846.000

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Lixinc

USA . 8,706 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,421 parts In-Stock

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Argo Parts USA

USA . 1,856 parts In-Stock

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Corphita

USA . 965 parts In-Stock

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Metaverse IC Inc.

Canada . 777 parts In-Stock

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Microchip USA

USA . 416 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$14.962

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$14.504

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$14.199

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Kepictronics

USA . 61 parts In-Stock

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Overview

Discover the superior quality and exceptional performance of the HMC832ALP6GETR by Analog Devices, a leading manufacturer in the industry. As a versatile Cellphone IC, this product offers advanced features and reliability for a wide range of applications. With its surface mount design and innovative package style, including a chip carrier and heat sink/slug, this IC ensures seamless integration and optimal functionality. Experience the value and benefits of this product, from its industrial-grade temperature tolerance to its RF and baseband circuit capabilities. Elevate your projects with the HMC832ALP6GETR and unlock limitless possibilities in the world of telecommunications.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for more efficient and compact designs, making this product suitable for smaller and thinner cellphones.

Package Shape: SQUARE

The square package shape helps in optimizing space within the cellphone, ensuring efficient use of internal components.

No. of Terminals: 40

Having 40 terminals allows for versatile connectivity options and functionality, making this product highly capable in handling various tasks within the cellphone.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding conditions and ensure reliable performance in various environments.

Width: 6 mm

The compact width of 6mm enables the integration of this IC in slim cellphones without compromising on performance.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is suitable for powering the IC efficiently while maintaining energy efficiency in the cellphone.

Technical Specifications

Cellphone ICs HMC832ALP6GETR attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N40

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

HMC832ALP6GETR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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