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HMC830LP6GE

Analog Devices

HMC830LP6GE by Analog Devices

Analog Devices' HMC830LP6GE is a 40-terminal cellphone IC in a square chip carrier package with matte tin finish. Operating b/w -40 to 85°C, it's ideal for RF and baseband circuits, with a nominal voltage of 3.3V. Its compact size of 6x6mm and very thin profile make it suitable for telecom applications requiring high performance in limited space.

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Chip Stock

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Cyclops Electronics Ltd

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Digiode

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LWI Electronics Inc

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Nova Conductors

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Prism Electronics

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Martec Srl

Italy . 40 parts In-Stock

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Corohmni

South Africa . 3 parts In-Stock

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$9.365

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AZTECH Wire

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Aztec Data Supply Inc.

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Parana Technologies

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IDEA Electronic Components Group

UK . 1,658 parts In-Stock

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DigiPath Technology Company

USA . 4,618 parts In-Stock

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Semicontronic

India . 1,109 parts In-Stock

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One Stop Electronics

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A-Z Elektronik GmbH

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Argo Parts USA

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Microchip USA

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Speed Components Ltd (Excess)

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Overview

Enhance your cellphone performance with the HMC830LP6GE by Analog Devices. Known for their top-notch quality and reliability, Analog Devices delivers cutting-edge Cellphone ICs that are essential for seamless communication. This versatile product boasts a wide range of applications, ensuring it meets all your connectivity needs. With its sleek package design and advanced technology, the HMC830LP6GE offers unmatched value and benefits to customers. Upgrade your device today and experience the difference with Analog Devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the cellphone IC, making it a reliable choice for long-term usage.

Surface Mount: YES

This feature allows for easy installation onto circuit boards, saving time and effort during assembly processes.

Package Shape: SQUARE

The square shape of the package ensures efficient use of space on the circuit board, optimizing the layout for enhanced performance.

No. of Terminals: 40

With a high number of terminals, this cellphone IC can accommodate a wide range of connections and functions, making it versatile for various applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style ensures effective heat dissipation and a compact design, ideal for slim and powerful cellphones.

Maximum Operating Temperature: 85 °C

The high operating temperature range of this IC allows it to function reliably even in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The low operating temperature range ensures that the IC can operate efficiently in cold climates without the risk of damage.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent conductivity and corrosion resistance, ensuring stable performance and longevity of the IC.

Terminal Position: QUAD

The quad terminal position allows for secure connections and efficient signal transmission, contributing to the overall performance of the cellphone IC.

Maximum Seated Height: 0.9 mm

The low seated height of this IC enables compact design layouts and minimizes the overall size of the electronic device.

Width: 6 mm

The narrow width of the IC allows for space-efficient placement on the circuit board, enabling denser and more complex electronic designs.

Peak Reflow Temperature: 260 C

The high peak reflow temperature tolerance ensures that the IC can withstand soldering processes without the risk of damage or degradation.

Length: 6 mm

The short length of the IC contributes to its compact design, making it suitable for small and portable devices such as smartphones.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures that the IC can operate reliably in rugged industrial environments, making it a robust choice for various applications.

Terminal Form: NO LEAD

The lead-free terminal form complies with environmental regulations and promotes sustainable manufacturing practices, making it an eco-friendly option for consumers.

Telecom IC Type: RF AND BASEBAND CIRCUIT

This IC is designed for telecom applications, providing both RF and baseband circuit functionality in a single package for enhanced communication capabilities.

Nominal Supply Voltage: 3.3 V

The 3.3V supply voltage requirement is compatible with standard power sources, making it easy to integrate this IC into existing electronic systems.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density packaging and precise connections, facilitating efficient signal processing and transmission in the cellphone IC.

Technical Specifications

Cellphone ICs HMC830LP6GE attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

HMC830LP6GE Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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