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HMC485MS8GETR

Analog Devices

HMC485MS8GETR by Analog Devices

Analog Devices' HMC485MS8GETR is a cellphone IC with 8 terminals in a small outline, thin profile package. It operates b/w -40 to 85 °C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Vyrian

USA . 8,766 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,000 parts In-Stock

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Digiode

USA . 516 parts In-Stock

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Inventory MP

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Bristol Electronics

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Parana Technologies

USA . 4,616 parts In-Stock

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$8.845

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$8.226

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IDEA Electronic Components Group

UK . 1,139 parts In-Stock

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$9.511

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$9.035

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AZTECH Wire

Italy . 197 parts In-Stock

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$10.209

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DigiPath Technology Company

USA . 27 parts In-Stock

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$14.837

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$14.244

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Semicontronic

India . 1,174 parts In-Stock

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$82.000

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$79.950

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$79.540

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One Stop Electronics

USA . 493 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

USA . 3,639 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 1,000 parts In-Stock

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Assy Fe

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Corphita

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GreenTree Electronics

Israel . 350 parts In-Stock

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Overview

Upgrade your cellphone technology with the HMC485MS8GETR by Analog Devices. Manufactured with top-quality materials and expertise, this cellphone IC offers unparalleled performance and reliability. Perfect for RF and baseband circuits, this product is designed to optimize your phone's functionality. With a small outline and thin profile package, it is easy to install and ensures seamless integration into your device. Trust Analog Devices for cutting-edge technology that delivers value and exceptional benefits to customers. Elevate your cellphone experience with the HMC485MS8GETR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are lightweight and durable, making this product ideal for portable devices like cellphones.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on the circuit board, saving space and enabling compact cellphone designs.

Package Shape: SQUARE

The square package shape is efficient for space utilization, maximizing the use of available board space in a cellphone.

No. of Terminals: 8

Having 8 terminals allows for connectivity to various components within the cellphone, enabling versatile functionality.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand extended usage in potentially demanding cellphone environments.

Minimum Operating Temperature: -40 °C

The ability to operate in low temperatures ensures reliable performance in various climates, making it suitable for international use.

Terminal Finish: MATTE TIN

Matte tin finish on terminals provides good solderability and electrical conductivity, ensuring secure connections in the cellphone circuit.

Nominal Supply Voltage: 5 V

Operating at a standard 5V supply voltage makes it compatible with many cellphone power sources, simplifying integration into existing designs.

Technical Specifications

Cellphone ICs HMC485MS8GETR attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

HMC485MS8GETR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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