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MAX2055EUP+T

Analog Devices

MAX2055EUP+T by Analog Devices

Analog Devices' MAX2055EUP+T is a BICMOS technology-based Cellphone IC with 20 terminals in a small outline package. It operates b/w -40 to 85 °C, suitable for industrial telecom applications. The IC has a nominal voltage of 5V and peak reflow temperature of 260°C, making it ideal for baseband circuit integration.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,180 parts In-Stock

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Digiode

USA . 1,249 parts In-Stock

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Chip Stock

USA . 955 parts In-Stock

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955

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Anansix

USA . 177 parts In-Stock

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177

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Quantum Digital Technology

USA . 36 parts In-Stock

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MARBEL Systems

Belgium . 120 parts In-Stock

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$7.070

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120

$7.070

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AZTECH Wire

Italy . 444 parts In-Stock

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$7.547

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Texas Native Microelectronics

USA . 198 parts In-Stock

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$8.126

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$7.801

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$7.557

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$7.151

198

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$7.151

Kenton Components

USA . 1,068 parts In-Stock

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$9.751

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$8.581

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$8.581

Qasali Group International

UK . 3,089 parts In-Stock

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$21.940

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$20.404

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$19.307

3,089

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One Stop Electronics

USA . 1,078 parts In-Stock

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$32.000

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Semicontronic

India . 844 parts In-Stock

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$437.000

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$426.075

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$423.890

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844

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Corphita

USA . 3,155 parts In-Stock

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Authorized Procurement Solutions

USA . 100 parts In-Stock

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Overview

Discover the unparalleled quality and innovation of Analog Devices with the MAX2055EUP+T Cellphone IC. Designed for high performance and reliability, this cutting-edge technology offers seamless integration and optimized functionality for a wide range of applications. Whether you're looking to enhance your mobile device's capabilities or streamline your communication systems, this product delivers unparalleled value and benefits to meet all your needs. Upgrade to Analog Devices and experience the difference in quality and performance today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and protection for the IC, ensuring reliability and durability.

Surface Mount: YES

Surface mount capability simplifies the assembly process and saves space on the PCB.

No. of Terminals: 20

Having 20 terminals allows for more connectivity options and functionality in the IC.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high performance and low power consumption.

Technical Specifications

Cellphone ICs MAX2055EUP+T attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

MAX2055EUP+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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