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CC1050PWR

Texas Instruments

CC1050PWR by Texas Instruments

CC1050PWR by Texas Instruments is a cellphone IC with 24 terminals in a small outline package. It operates at temperatures from -40 to 85°C, with supply voltages of 2.5/3.3V for RF and baseband circuits. The terminal finish is nickel palladium gold, making it suitable for industrial telecom applications.

Median Price

$4.896

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 5,323 parts In-Stock

1+ parts

$6.930

100+ parts

$5.238

1k+ parts

$4.610

10k+ parts

$4.393

5,323

$6.930

$5.238

$4.610

$4.393

Chip1Stop

Japan . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.863

2,500

-

-

-

$2.863

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EXC GmbH

Germany . 5,000 parts In-Stock

1+ parts

$2.485

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

$2.485

-

-

-

Vyrian

USA . 562 parts In-Stock

1+ parts

$2.863

100+ parts

-

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-

10k+ parts

-

562

$2.863

-

-

-

Digiode

USA . 2,711 parts In-Stock

1+ parts

$7.210

100+ parts

-

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-

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2,711

$7.210

-

-

-

ACDS - Activité Composants Distribution Service

France . 1,034 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1,034

-

-

-

-

Cyclops Electronics Ltd

UK . 400 parts In-Stock

1+ parts

-

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-

1k+ parts

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400

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,869 parts In-Stock

1+ parts

$2.430

100+ parts

-

1k+ parts

-

10k+ parts

-

3,869

$2.430

-

-

-

Corphita

USA . 1,701 parts In-Stock

1+ parts

$6.831

100+ parts

-

1k+ parts

-

10k+ parts

-

1,701

$6.831

-

-

-

Parana Technologies

USA . 1,349 parts In-Stock

1+ parts

$7.489

100+ parts

-

1k+ parts

$7.984

10k+ parts

-

1,349

$7.489

-

$7.984

-

ChromeModa Solutions

Germany . 4,310 parts In-Stock

1+ parts

$8.415

100+ parts

$6.900

1k+ parts

-

10k+ parts

-

4,310

$8.415

$6.900

-

-

IDEA Electronic Components Group

UK . 924 parts In-Stock

1+ parts

$8.415

100+ parts

$7.994

1k+ parts

$7.574

10k+ parts

-

924

$8.415

$7.994

$7.574

-

Native Components

USA . 56 parts In-Stock

1+ parts

$12.950

100+ parts

-

1k+ parts

-

10k+ parts

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56

$12.950

-

-

-

Northwest PG Solutions

USA . 492 parts In-Stock

1+ parts

$14.244

100+ parts

$12.820

1k+ parts

-

10k+ parts

-

492

$14.244

$12.820

-

-

Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$18.700

100+ parts

$18.513

1k+ parts

$17.765

10k+ parts

-

10

$18.700

$18.513

$17.765

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Kepictronics

USA . 50,000 parts In-Stock

1+ parts

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50,000

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-

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Lixinc

USA . 11,562 parts In-Stock

1+ parts

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11,562

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GreenTree Electronics

Israel . 10,000 parts In-Stock

1+ parts

-

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10,000

-

-

-

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A-Z Elektronik GmbH

Germany . 5,535 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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-

5,535

-

-

-

-

Epart123

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.280

10k+ parts

$1.280

5,000

-

-

$1.280

$1.280

Alle Elektronik GmbH

Germany . 3,690 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,690

-

-

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DigiPath Technology Company

USA . 1,529 parts In-Stock

1+ parts

-

100+ parts

$7.587

1k+ parts

-

10k+ parts

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1,529

-

$7.587

-

-

Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Enhance your cellphone's performance with the Texas Instruments CC1050PWR, a top-of-the-line RF and baseband circuit designed to optimize communication capabilities. Manufactured with precision and expertise, this small outline, thin profile IC offers unparalleled reliability and efficiency for your device. With a wide temperature range and dual terminal position, the CC1050PWR is perfect for industrial applications where quality is non-negotiable. Upgrade your cellphone experience today with this innovative technology that delivers exceptional value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and provide good protection for the internal components of the cellphone IC, ensuring a longer lifespan.

Surface Mount: Yes

Surface mount technology allows for easy installation and replacement of the IC, making it convenient for manufacturers and technicians.

Power Supplies (V): 2.5/3.3

Having multiple power supply options allows for flexibility in different operating environments, ensuring stable performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature means the IC can withstand heat and operate efficiently even in demanding conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the cellphone IC energy-efficient and reliable.

Technical Specifications

Cellphone ICs CC1050PWR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

CC1050PWR Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.G

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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