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ADF7020BCP

Analog Devices

ADF7020BCP by Analog Devices

Analog Devices' ADF7020BCP is a cellphone IC with 48 terminals, operating at -40 to 85 °C. It features a supply voltage of 2.5/3.3V and telecom IC type for RF and baseband circuits. The chip carrier package style with a square shape makes it suitable for industrial temperature-grade applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,907 parts In-Stock

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Digiode

USA . 832 parts In-Stock

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Native Components

USA . 931 parts In-Stock

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$1.053

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Northwest PG Solutions

USA . 2,076 parts In-Stock

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$1.159

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Parana Technologies

USA . 648 parts In-Stock

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$13.778

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$12.813

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IDEA Electronic Components Group

UK . 512 parts In-Stock

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$14.815

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$14.074

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$14.074

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AZTECH Wire

Italy . 299 parts In-Stock

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$19.205

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DigiPath Technology Company

USA . 1,446 parts In-Stock

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$23.111

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$22.187

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Semicontronic

India . 1,537 parts In-Stock

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$73.000

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$71.175

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$70.810

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One Stop Electronics

USA . 802 parts In-Stock

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$692.000

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A-Z Elektronik GmbH

Germany . 6,638 parts In-Stock

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Corphita

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Overview

Unlock seamless connectivity and superior performance with the ADF7020BCP by Analog Devices. As a leading manufacturer in the industry, Analog Devices ensures top-notch quality and reliability in cellphone ICs. This versatile device boasts a multitude of applications, making it a valuable asset for various projects. With its surface mount capability and compact package shape, this product offers convenience and efficiency. Experience the benefits of enhanced communication and efficiency with the ADF7020BCP, setting new standards in the realm of telecommunications. Elevate your connectivity solutions with Analog Devices today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing costs.

Package Shape: SQUARE

Square package shape provides uniformity and ease of handling during manufacturing and assembly processes.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages allows for flexible integration into various cellphone designs.

No. of Terminals: 48

Higher number of terminals enable more complex circuit connections, offering enhanced functionality for the cellphone IC.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG

Chip carrier package style with heat sink/slug design helps in efficient heat dissipation, ensuring optimal performance and reliability.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures stability and durability under demanding operating conditions.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range enables reliable operation even in extreme cold environments.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and corrosion resistance, enhancing the product's overall longevity.

Terminal Position: QUAD

Quad terminal position offers increased connectivity options and facilitates efficient signal transmission within the IC.

Maximum Seated Height: 1.5 mm

Low maximum seated height allows for compact and slim cellphone designs, optimizing space utilization.

Width: 7 mm

Narrow width makes the IC suitable for smaller form factor cellphones, enabling the development of sleek and portable devices.

Length: 7 mm

Compact length contributes to the overall miniaturization of the cellphone IC, supporting the trend towards smaller electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance across a wide range of ambient temperatures, making the IC suitable for industrial applications.

Terminal Form: NO LEAD

No lead terminal form eliminates the risk of lead contamination and aligns with environmental regulations, promoting eco-friendly practices.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Integration of RF and baseband circuitry within the IC simplifies design complexity and enhances overall efficiency in cellular communication.

Nominal Supply Voltage: 3 V

Stable 3V nominal supply voltage supports consistent performance and compatibility with various cellphone power requirements.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density PCB layouts, allowing for more features and functionality in a limited space.

Technical Specifications

Cellphone ICs ADF7020BCP attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e0

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

ADF7020BCP Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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