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TCM320AC57CPT

Texas Instruments

TCM320AC57CPT by Texas Instruments

TCM320AC57CPT by Texas Instruments is a 48-terminal cellphone IC with 5V power supply, operating b/w 0-70°C. It features A-LAW companding law, 13-bit linear coding, and a baseband circuit for telecom applications. The package is a square flatpack with low profile and fine pitch, suitable for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,331 parts In-Stock

1+ parts

-

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6,331

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Digiode

USA . 3,699 parts In-Stock

1+ parts

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3,699

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,980 parts In-Stock

1+ parts

$9.363

100+ parts

-

1k+ parts

$9.985

10k+ parts

-

1,980

$9.363

-

$9.985

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DigiPath Technology Company

USA . 1,054 parts In-Stock

1+ parts

$10.310

100+ parts

$9.485

1k+ parts

-

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1,054

$10.310

$9.485

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AZTECH Wire

Italy . 619 parts In-Stock

1+ parts

$10.488

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619

$10.488

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IDEA Electronic Components Group

UK . 1,089 parts In-Stock

1+ parts

$10.520

100+ parts

$9.994

1k+ parts

$9.468

10k+ parts

-

1,089

$10.520

$9.994

$9.468

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ChromeModa Solutions

Germany . 807 parts In-Stock

1+ parts

$10.520

100+ parts

$8.626

1k+ parts

-

10k+ parts

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807

$10.520

$8.626

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Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$21.143

100+ parts

$19.240

1k+ parts

$17.337

10k+ parts

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15

$21.143

$19.240

$17.337

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One Stop Electronics

USA . 422 parts In-Stock

1+ parts

$985.000

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422

$985.000

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Corphita

USA . 2,696 parts In-Stock

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2,696

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Overview

Enhance the functionality of your cellphone with the TCM320AC57CPT by Texas Instruments. Crafted with precision and expertise, this high-quality Cellphone IC boasts a wide range of applications in the telecommunications industry. With a compact design and advanced features, this product offers unparalleled value to customers seeking reliability, efficiency, and top-notch performance. Elevate your mobile experience today with Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy installation and saves space on the circuit board.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes this product compatible with a wide range of devices.

No. of Terminals: 48

Having a high number of terminals allows for more connectivity options and functionality.

Maximum Operating Temperature: 70 °C

Being able to operate at a high temperature range ensures reliable performance in various environments.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures makes this product suitable for use in colder climates.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving the efficiency of the product.

Technical Specifications

Cellphone ICs TCM320AC57CPT attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

1 dB

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Linear Coding:

13-BIT

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Codecs

Maximum Supply Current:

.0099 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

TCM320AC57CPT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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