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AD8348XXX

Analog Devices

AD8348XXX by Analog Devices

AD8348XXX by Analog Devices is a Cellphone IC with 28 terminals in a small outline, thin profile package. It operates b/w -34 °C to 85°C and has a nominal voltage of 5V. This RF and baseband circuit is ideal for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,610 parts In-Stock

1+ parts

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3,610

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Digiode

USA . 759 parts In-Stock

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759

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,251 parts In-Stock

1+ parts

$13.362

100+ parts

-

1k+ parts

$12.427

10k+ parts

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2,251

$13.362

-

$12.427

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IDEA Electronic Components Group

UK . 865 parts In-Stock

1+ parts

$14.368

100+ parts

$13.650

1k+ parts

$13.650

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865

$14.368

$13.650

$13.650

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AZTECH Wire

Italy . 519 parts In-Stock

1+ parts

$18.766

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519

$18.766

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DigiPath Technology Company

USA . 610 parts In-Stock

1+ parts

$22.414

100+ parts

$21.518

1k+ parts

-

10k+ parts

$21.518

610

$22.414

$21.518

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$21.518

Semicontronic

India . 557 parts In-Stock

1+ parts

$451.000

100+ parts

$439.725

1k+ parts

$437.470

10k+ parts

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557

$451.000

$439.725

$437.470

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One Stop Electronics

USA . 896 parts In-Stock

1+ parts

$735.000

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896

$735.000

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Northwest PG Solutions

USA . 1,973 parts In-Stock

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1,973

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Corphita

USA . 959 parts In-Stock

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959

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Native Components

USA . 742 parts In-Stock

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742

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Overview

Elevate your cellphone experience with the AD8348XXX by Analog Devices. Known for their top-quality manufacturing, Analog Devices delivers exceptional performance and reliability in the realm of Cellphone ICs. This innovative product offers enhanced connectivity and functionality, making it ideal for a variety of applications. With its compact design and advanced features, the AD8348XXX provides unmatched value and benefits to customers seeking seamless communication and performance in their devices. Experience the difference with Analog Devices today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for long-term use.

Surface Mount: YES

Surface mount technology enables easy installation and allows for compact and lightweight designs.

Package Shape: RECTANGULAR

Rectangular shape helps in easy placement and alignment on circuit boards, optimizing space utilization.

No. of Terminals: 28

More terminals provide enhanced connectivity options, enabling the IC to interface with multiple components in a cellphone system.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance under harsh environmental conditions.

Minimum Operating Temperature: -34 °C

Low minimum operating temperature allows for operation in a wide range of temperature conditions.

Terminal Finish: TIN LEAD

Tin lead finish offers good solderability and conductivity, improving the overall performance of the IC.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures secure connection, reducing the risk of signal loss.

Maximum Seated Height: 1.1 mm

Low seated height allows for slim and sleek designs, making the IC suitable for compact cellphones.

Width: 4.4 mm

Narrow width facilitates easy integration into space-constrained cellphone designs.

Length: 9.7 mm

Compact length contributes to overall space efficiency in the cellphone system.

Terminal Form: GULL WING

Gull wing terminals offer secure solder connections and mechanical strength, ensuring long-term reliability.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combination of RF and baseband circuitry enables seamless communication and signal processing in cellphones.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage ensures compatibility with common power sources in cellphone systems.

Terminal Pitch: 0.65 mm

Fine terminal pitch facilitates high-density mounting and allows for intricate circuit designs in cellphones.

Technical Specifications

Cellphone ICs AD8348XXX attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e0

Length:

9.7 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-34 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

AD8348XXX Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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