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TRF6901PTR

Texas Instruments

TRF6901PTR by Texas Instruments

TRF6901PTR by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates at -40 to 85°C, with supply voltage of 2/3.3V and current draw of 0.04mA. Ideal for RF and baseband circuits in telecom applications due to its low profile design and fine pitch style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 22,000 parts In-Stock

1+ parts

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22,000

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Semi Source

USA . 8,440 parts In-Stock

1+ parts

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8,440

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Vyrian

USA . 7,655 parts In-Stock

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7,655

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Digiode

USA . 2,039 parts In-Stock

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2,039

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Distributors (Availability)

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Component Stockers USA

USA . 21,769 parts In-Stock

1+ parts

$3.870

100+ parts

$3.870

1k+ parts

$3.190

10k+ parts

$3.190

21,769

$3.870

$3.870

$3.190

$3.190

AZTECH Wire

Italy . 569 parts In-Stock

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$9.018

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569

$9.018

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Parana Technologies

USA . 1,043 parts In-Stock

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$10.930

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$11.397

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1,043

$10.930

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$11.397

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DigiPath Technology Company

USA . 1,760 parts In-Stock

1+ parts

$12.035

100+ parts

$11.073

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1,760

$12.035

$11.073

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ChromeModa Solutions

Germany . 3,475 parts In-Stock

1+ parts

$12.281

100+ parts

$10.070

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3,475

$12.281

$10.070

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IDEA Electronic Components Group

UK . 863 parts In-Stock

1+ parts

$12.281

100+ parts

$11.667

1k+ parts

$11.053

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863

$12.281

$11.667

$11.053

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One Stop Electronics

USA . 888 parts In-Stock

1+ parts

$818.000

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888

$818.000

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Ampacity Inc.

Singapore . 860 parts In-Stock

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$943.000

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860

$943.000

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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15,000

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Kepictronics

USA . 9,000 parts In-Stock

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9,000

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Lixinc

USA . 1,916 parts In-Stock

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Computer Components Inc. - USA

USA . 1,000 parts In-Stock

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1,000

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Corphita

USA . 84 parts In-Stock

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84

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Overview

Elevate your cellphone's performance with the TRF6901PTR by Texas Instruments, a top-quality RF and baseband circuit designed to enhance your mobile communication experience. Crafted by a renowned manufacturer, this IC boasts advanced features and superior reliability, making it a must-have for telecom applications. With its cutting-edge technology and industrial-grade construction, the TRF6901PTR offers unmatched value and benefits to customers looking for seamless connectivity and optimal functionality in their devices. Upgrade your cellphone today with this exceptional product and stay ahead of the curve in the fast-paced world of mobile communication.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy integration onto printed circuit boards, making assembly and manufacturing more efficient.

Power Supplies (V): 2/3.3

Offers flexibility in voltage requirements, allowing compatibility with a variety of power sources.

No. of Terminals: 48

Provides a sufficient number of connections for complex circuitry and functionality.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold temperatures, making it suitable for a wide range of operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Enhances conductivity and corrosion resistance, promoting stable connections and longevity.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Designed for telecommunications applications, ensuring efficient signal processing and communication capabilities.

Technical Specifications

Cellphone ICs TRF6901PTR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.04 mA

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TRF6901PTR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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