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TRF6900APTR

Texas Instruments

TRF6900APTR by Texas Instruments

TRF6900APTR by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates at temperatures from -20 to 70°C, with a supply voltage of 3V. This RF and baseband circuit has low profile flatpack style for telecom applications.

Median Price

$3.990

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 11,818 parts In-Stock

1+ parts

-

100+ parts

$3.990

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11,818

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$3.990

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Rochester

USA . 9,568 parts In-Stock

1+ parts

-

100+ parts

$3.450

1k+ parts

$3.090

10k+ parts

$2.900

9,568

-

$3.450

$3.090

$2.900

Verical

USA . 4,650 parts In-Stock

1+ parts

-

100+ parts

$4.313

1k+ parts

$3.862

10k+ parts

$3.625

4,650

-

$4.313

$3.862

$3.625

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 913 parts In-Stock

1+ parts

$3.648

100+ parts

-

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913

$3.648

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Vyrian

USA . 3,996 parts In-Stock

1+ parts

$3.840

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3,996

$3.840

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DigiKey Marketplace

USA . 12,918 parts In-Stock

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12,918

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,970 parts In-Stock

1+ parts

$3.456

100+ parts

-

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1,970

$3.456

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Component Stockers USA

USA . 11,485 parts In-Stock

1+ parts

$3.930

100+ parts

$3.700

1k+ parts

$3.340

10k+ parts

$3.340

11,485

$3.930

$3.700

$3.340

$3.340

Parana Technologies

USA . 2,352 parts In-Stock

1+ parts

$9.585

100+ parts

-

1k+ parts

$10.179

10k+ parts

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2,352

$9.585

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$10.179

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DigiPath Technology Company

USA . 1,956 parts In-Stock

1+ parts

$10.555

100+ parts

-

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1,956

$10.555

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ChromeModa Solutions

Germany . 5,273 parts In-Stock

1+ parts

$10.770

100+ parts

$8.831

1k+ parts

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5,273

$10.770

$8.831

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IDEA Electronic Components Group

UK . 984 parts In-Stock

1+ parts

$10.770

100+ parts

$10.232

1k+ parts

$9.693

10k+ parts

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984

$10.770

$10.232

$9.693

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QUARKTWIN TECHNOLOGY LTD

USA . 29,169 parts In-Stock

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Lixinc

USA . 6,331 parts In-Stock

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6,331

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A-Z Elektronik GmbH

Germany . 4,875 parts In-Stock

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4,875

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Kepictronics

USA . 3,800 parts In-Stock

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3,800

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Overview

Elevate your cellphone performance with the Texas Instruments TRF6900APTR, a top-quality RF and baseband circuit IC designed to optimize your device's connectivity. With Texas Instruments' reputation for excellence in semiconductor technology, this product offers unparalleled value and benefits for your cellphone applications. Enjoy improved signal quality, enhanced data transfer speeds, and reliable performance with the TRF6900APTR. Upgrade your mobile experience today with this cutting-edge solution from a trusted industry leader.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection, making the product resilient to external factors.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on printed circuit boards, saving time during assembly.

Power Supplies (V): 3

Operating at a low power supply of 3V helps in reducing energy consumption and optimizing battery life.

No. of Terminals: 48

Having 48 terminals allows for connectivity with multiple components, enhancing the functionality of the cellphone IC.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, the IC can withstand varying environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to efficient performance.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V ensures compatibility with standard power sources, enhancing usability.

Technical Specifications

Cellphone ICs TRF6900APTR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.05 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TRF6900APTR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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