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TRF6901PTG4

Texas Instruments

TRF6901PTG4 by Texas Instruments

TRF6901PTG4 by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 2.7V, making it ideal for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,412 parts In-Stock

1+ parts

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6,412

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Digiode

USA . 845 parts In-Stock

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845

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,698 parts In-Stock

1+ parts

$7.763

100+ parts

-

1k+ parts

$8.303

10k+ parts

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1,698

$7.763

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$8.303

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DigiPath Technology Company

USA . 943 parts In-Stock

1+ parts

$8.548

100+ parts

-

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943

$8.548

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ChromeModa Solutions

Germany . 5,528 parts In-Stock

1+ parts

$8.722

100+ parts

$7.152

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5,528

$8.722

$7.152

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IDEA Electronic Components Group

UK . 1,525 parts In-Stock

1+ parts

$8.722

100+ parts

$8.286

1k+ parts

$7.850

10k+ parts

-

1,525

$8.722

$8.286

$7.850

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AZTECH Wire

Italy . 653 parts In-Stock

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$14.154

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653

$14.154

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One Stop Electronics

USA . 470 parts In-Stock

1+ parts

$525.000

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470

$525.000

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Kepictronics

USA . 50,000 parts In-Stock

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50,000

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Corphita

USA . 4,092 parts In-Stock

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4,092

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Overview

Discover the TRF6901PTG4 by Texas Instruments, a top-quality Cellphone IC that offers unparalleled performance and reliability. Manufactured by industry leader Texas Instruments, this product is designed for a wide range of applications in the telecommunications sector. With its advanced technology and durable construction, the TRF6901PTG4 delivers exceptional value, benefits, and advantages to customers looking for high-quality components for their projects. Trust Texas Instruments to provide you with cutting-edge solutions for your cellphone IC needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, making it suitable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Square package shape is commonly used in compact electronic devices, optimizing space utilization.

No. of Terminals: 48

With 48 terminals, this IC can accommodate a variety of connections and functions, making it versatile for different applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this IC can perform reliably in demanding environments and conditions.

Nominal Supply Voltage: 2.7 V

Operating at a nominal supply voltage of 2.7V, this IC is energy-efficient and suitable for low-power applications.

Technical Specifications

Cellphone ICs TRF6901PTG4 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TRF6901PTG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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