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BGC100GN6E6327XTSA1

Infineon Technologies

BGC100GN6E6327XTSA1 by Infineon Technologies

Infineon's BGC100GN6E6327XTSA1 is a CMOS Cellphone IC with 6 terminals in a rectangular chip carrier package. It features RF and baseband circuitry, suitable for telecom applications. This surface-mount IC has terminals at the bottom and a butt terminal form.

Median Price

$0.342

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 24,851 parts In-Stock

1+ parts

$0.246

100+ parts

$0.198

1k+ parts

$0.178

10k+ parts

$0.178

24,851

$0.246

$0.198

$0.178

$0.178

Element14

Singapore . 14,954 parts In-Stock

1+ parts

$0.414

100+ parts

$0.300

1k+ parts

$0.270

10k+ parts

-

14,954

$0.414

$0.300

$0.270

-

DigiKey

USA . 11,632 parts In-Stock

1+ parts

$0.470

100+ parts

$0.257

1k+ parts

$0.219

10k+ parts

-

11,632

$0.470

$0.257

$0.219

-

Mouser Electronics

USA . 4,132 parts In-Stock

1+ parts

$0.470

100+ parts

$0.256

1k+ parts

$0.219

10k+ parts

$0.195

4,132

$0.470

$0.256

$0.219

$0.195

Newark

USA . 13,999 parts In-Stock

1+ parts

$0.484

100+ parts

$0.264

1k+ parts

$0.224

10k+ parts

-

13,999

$0.484

$0.264

$0.224

-

Farnell

UK . 14,954 parts In-Stock

1+ parts

$0.597

100+ parts

$0.348

1k+ parts

$0.262

10k+ parts

$0.221

14,954

$0.597

$0.348

$0.262

$0.221

Rochester

USA . 690,673 parts In-Stock

1+ parts

-

100+ parts

$0.243

1k+ parts

$0.201

10k+ parts

$0.180

690,673

-

$0.243

$0.201

$0.180

Verical

USA . 660,268 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.225

660,268

-

-

-

$0.225

Chip1Stop

Japan . 14,954 parts In-Stock

1+ parts

-

100+ parts

$0.213

1k+ parts

-

10k+ parts

-

14,954

-

$0.213

-

-

RS (Exports)

UK . 100 parts In-Stock

1+ parts

-

100+ parts

$0.269

1k+ parts

$0.231

10k+ parts

$0.217

100

-

$0.269

$0.231

$0.217

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 386 parts In-Stock

1+ parts

$0.200

100+ parts

-

1k+ parts

-

10k+ parts

-

386

$0.200

-

-

-

Nova Conductors

Japan . 77 parts In-Stock

1+ parts

$0.265

100+ parts

-

1k+ parts

-

10k+ parts

-

77

$0.265

-

-

-

Vyrian

USA . 144,054 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

144,054

-

-

-

-

Chip Stock

USA . 32,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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32,500

-

-

-

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Bristol Electronics

USA . 4,341 parts In-Stock

1+ parts

-

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4,341

-

-

-

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VNN

France . 468 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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468

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 144,106 parts In-Stock

1+ parts

$0.159

100+ parts

-

1k+ parts

-

10k+ parts

-

144,106

$0.159

-

-

-

Corphita

USA . 241 parts In-Stock

1+ parts

$0.190

100+ parts

-

1k+ parts

-

10k+ parts

-

241

$0.190

-

-

-

Component Stockers USA

USA . 766,520 parts In-Stock

1+ parts

$0.210

100+ parts

$0.200

1k+ parts

$0.190

10k+ parts

$0.180

766,520

$0.210

$0.200

$0.190

$0.180

Argo Parts USA

USA . 534 parts In-Stock

1+ parts

$0.231

100+ parts

-

1k+ parts

-

10k+ parts

$0.224

534

$0.231

-

-

$0.224

Netroflash

USA . 500 parts In-Stock

1+ parts

$0.265

100+ parts

$0.259

1k+ parts

-

10k+ parts

-

500

$0.265

$0.259

-

-

Continental Prestige Electronics

USA . 14,978 parts In-Stock

1+ parts

$0.430

100+ parts

$0.266

1k+ parts

$0.185

10k+ parts

-

14,978

$0.430

$0.266

$0.185

-

Corohmni

South Africa . 195 parts In-Stock

1+ parts

$9.857

100+ parts

-

1k+ parts

-

10k+ parts

-

195

$9.857

-

-

-

Advanced Electronics

New Zealand . 1,999 parts In-Stock

1+ parts

$10.708

100+ parts

$10.601

1k+ parts

$10.173

10k+ parts

-

1,999

$10.708

$10.601

$10.173

-

Modulus Dynamics

Lithuania . 4,384 parts In-Stock

1+ parts

$12.375

100+ parts

$11.880

1k+ parts

$11.385

10k+ parts

-

4,384

$12.375

$11.880

$11.385

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Perfect Parts

USA . 33,656 parts In-Stock

1+ parts

-

100+ parts

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33,656

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QUARKTWIN TECHNOLOGY LTD

USA . 18,976 parts In-Stock

1+ parts

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100+ parts

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18,976

-

-

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,000

-

-

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Overview

Elevate your cellphone experience with the BGC100GN6E6327XTSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-quality Cellphone ICs that guarantee superior performance and reliability. This RF and baseband circuit is designed for seamless integration into your device, offering unmatched value and benefits to customers. Upgrade your phone's capabilities with this innovative technology and enjoy a smoother, more efficient user experience.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the IC onto a circuit board, saving time and reducing manufacturing costs.

Package Shape: RECTANGULAR

Rectangular package shape provides a standardized form factor that is easily integrated into various electronic devices.

No. of Terminals: 6

With 6 terminals, this Cellphone IC provides multiple connection points for enhanced functionality and connectivity.

Package Style: CHIP CARRIER

Chip carrier package style offers a compact and robust housing for the IC, ensuring reliability and durability.

Terminal Position: BOTTOM

Bottom terminal position facilitates efficient heat dissipation and electrical connections within the circuit board layout.

Technology: CMOS

CMOS technology offers low power consumption, high speed performance, and compatibility with a wide range of applications.

Terminal Form: BUTT

Butt terminal form ensures secure and stable connections within the circuit, minimizing the risk of signal loss or interference.

Telecom IC Type: RF AND BASEBAND CIRCUIT

This Cellphone IC combines RF and baseband circuit functionalities in a single package, simplifying the design and operation of cellular communication systems.

Technical Specifications

Cellphone ICs BGC100GN6E6327XTSA1 attributes and parameters. Explore more Cellphone ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-XBCC-B6

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Package Body Material:

UNSPECIFIED

Package Code:

BCC

Package Shape:

Package Style (Meter):

CHIP CARRIER

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

BGC100GN6E6327XTSA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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