Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Infineon's BGC100GN6E6327XTSA1 is a CMOS Cellphone IC with 6 terminals in a rectangular chip carrier package. It features RF and baseband circuitry, suitable for telecom applications. This surface-mount IC has terminals at the bottom and a butt terminal form.
Median Price
$0.342
Lifecycle Status
Suppliers In-Stock
16
In-Stock Inventory
1k+
Arrow
1+ parts
$0.246
100+ parts
$0.198
1k+ parts
$0.178
10k+ parts
Element14
$0.414
$0.300
$0.270
-
Mouser Electronics
$0.480
$0.262
$0.222
$0.199
Newark
$0.484
$0.265
$0.226
DigiKey
$0.570
$0.308
$0.261
$0.242
Farnell
$0.597
$0.348
$0.221
Rochester
$0.243
$0.201
$0.180
Verical
$0.225
Chip1Stop
$0.213
RS (Exports)
$0.269
$0.231
$0.217
Digiode
$0.200
Nova Conductors
Vyrian
Chip Stock
Bristol Electronics
VNN
Ampacity Inc.
$0.159
Corphita
$0.190
Component Stockers USA
$0.210
Argo Parts USA
$0.224
Netroflash
$0.259
Continental Prestige Electronics
$0.430
$0.266
$0.185
Corohmni
$9.857
Advanced Electronics
$10.708
$10.601
$10.173
Modulus Dynamics
$12.375
$11.880
$11.385
Perfect Parts
QUARKTWIN TECHNOLOGY LTD
Authorized Procurement Solutions
Surface mount technology allows for easy and efficient installation of the IC onto a circuit board, saving time and reducing manufacturing costs.
Rectangular package shape provides a standardized form factor that is easily integrated into various electronic devices.
With 6 terminals, this Cellphone IC provides multiple connection points for enhanced functionality and connectivity.
Chip carrier package style offers a compact and robust housing for the IC, ensuring reliability and durability.
Bottom terminal position facilitates efficient heat dissipation and electrical connections within the circuit board layout.
CMOS technology offers low power consumption, high speed performance, and compatibility with a wide range of applications.
Butt terminal form ensures secure and stable connections within the circuit, minimizing the risk of signal loss or interference.
This Cellphone IC combines RF and baseband circuit functionalities in a single package, simplifying the design and operation of cellular communication systems.
Cellphone ICs BGC100GN6E6327XTSA1 attributes and parameters. Explore more Cellphone ICs devices from Infineon Technologies
JESD-30 Code:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Surface Mount:
Technology:
Telecom IC Type:
Terminal Form:
Terminal Position:
BGC100GN6E6327XTSA1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - Mult Dev Packing Box Chg 18/Oct/2019
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
BAV99
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Allegro MicroSystems
RECTIFIER DIODE; Terminal Position: END; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Terminal Finish: MATTE TIN; Maximum Operating Temperature: 200 Cel; Maximum Output Current: .15 A; JESD-609 Code: e3;
2N7002
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; No. of Elements: 1; Transistor Application: SWITCHING;
STM32H753BIT6
STMicroelectronics
STM32H753BIT6 by STMicroelectronics is a 32-bit microcontroller with 208 terminals, operating at up to 48 MHz. It features 20-Ch 16-Bit ADCs, 2-Ch 12-Bit DACs, and extensive peripherals for industrial applications like CAN, Ethernet, and USB connectivity. With a wide temperature range of -40 to +85 °C, it's ideal for demanding environments requiring high-speed processing capabilities.
1N4148WS
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358DR2G
Onsemi
LM358DR2G by Onsemi is a dual operational amplifier with 7000uV max input offset voltage and 70dB nominal CMRR. Ideal for applications requiring low bias current such as sensor interfaces, signal conditioning circuits, and audio amplifiers. Package style: Small Outline, Technology: Bipolar, Unity Gain Bandwidth: 1000 kHz.
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
BSS138
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; No. of Elements: 1; Maximum Drain Current (Abs) (ID): .2 A;
Panasonic
MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Continental Device India
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
First Components International
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Polarity: BIDIRECTIONAL; Maximum Repetitive Peak Reverse Voltage: 18 V;
LL4148
Weitron Technology
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
CRCW040210K0FKED
Vishay Intertechnology
Vishay Intertechnology's CRCW040210K0FKED is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.063 W power dissipation. Ideal for surface mount applications in electronics due to its compact SMT package style and high operating temperature range of -55 to 155 °C.
ABS06-32.768KHZ-T
Abracon
Abracon's ABS06-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 90000 ohm series resistance, and -40 to 85 °C operating temperature range. Ideal for applications requiring precise timing in compact designs like IoT devices and wearables.
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
BSS138PS,115
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
MBR0520LT1
Motorola
Tak Cheong Electronics Holdings
CC1020RSSG4
Texas Instruments
CC1020RSSG4 by Texas Instruments is a cellphone IC with 32 terminals in a square package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.
CC1070RSQ
The Texas Instruments CC1070RSQ is a cellphone IC with 20 terminals in a square package. It operates b/w -40 to 105°C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 3V, making it ideal for telecom applications.
ADF7020BCPZ-RL
Analog Devices
Analog Devices' ADF7020BCPZ-RL is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 2.5/3.3V and terminal pitch of 0.5mm, suitable for RF and baseband circuits in industrial telecom applications. The chip carrier package has a very thin profile, making it ideal for surface mount designs with limited space constraints.
MAX2021ETX+
Analog Devices' MAX2021ETX+ is a Cellphone IC with 36 terminals in a square package. It operates at temperatures from -40 to 85°C, with a supply voltage of 5V. This BASEBAND CIRCUIT Telecom IC uses BICMOS technology and has a max supply current of 0.315mA.
CC1000PW
CC1000PW by Texas Instruments is a cellphone IC with 28 terminals, operating at -40 to 85°C. It features a supply voltage of 2.5/3.3V, RF and baseband circuitry for telecom applications, and CMOS technology in a small outline package suitable for industrial use.
AD6655ABCPZ-150
AD6655ABCPZ-150 by Analog Devices is a cellphone IC with 64 terminals in a square package. It operates at temperatures from -40 to 85°C, with a supply voltage of 1.8V and max current of 0.805mA. Ideal for baseband circuits, it has a terminal pitch of 0.5mm and MSL level of 3 for industrial applications.
HMC601LP4
Analog Devices' HMC601LP4 is a 24-terminal cellphone IC in a square chip carrier package with a very thin profile. It operates b/w -40 to 85°C, suitable for industrial use. This RF front end circuit has a nominal voltage of 3.3V, making it ideal for telecom applications.
MAX2606EUT+T
MAX2606EUT+T by Analog Devices is a cellphone IC in small outline package with 6 terminals. Operating temp range -40 to 85°C, peak reflow temp 260°C. Telecom IC for baseband circuits with nominal voltage of 2.75V, ideal for industrial applications.
HMC381LP6E
Analog Devices' HMC381LP6E is a cellphone IC with 28 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features RF and baseband circuits, matte tin finish, and a nominal voltage of 5V.
AD6643BCPZRL7-200
AD6643BCPZRL7-200 by Analog Devices is a cellphone IC with 2 functions, operating at 1.8V. It features a square package style, matte tin finish, and industrial temperature grade suitable for RF and baseband circuits in telecom applications.
SKY13524-639LF
Skyworks Solutions
SKY13524-639LF by Skyworks Solutions is a cellphone IC with 14 terminals in a square package style. Operating b/w -30°C to 90°C, it's ideal for RF and baseband circuits at 3.3V supply voltage. With a compact size of 1.6mm x 1.6mm and terminal pitch of 0.4mm, it's suitable for telecom applications requiring surface mount technology.
CC1020RSS
The Texas Instruments CC1020RSS is a cellphone IC with 32 terminals in a square package. It operates at temperatures from -40 to 85°C, with a supply voltage of 3V. This RF and baseband circuit has a terminal pitch of 0.65mm, making it suitable for industrial telecom applications.
LMH6521SQX
Texas Instruments LMH6521SQX is a cellphone IC with 32 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It functions as an RF and baseband circuit with a nominal voltage of 5V, ideal for telecom applications.
LARA-R6001D-00B
U-blox Ag
RF AND BASEBAND CIRCUIT;
CC1000-RTR2
CC1000-RTR2 by Texas Instruments is a cellphone IC with 28 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 3V, CMOS technology, and RF/baseband circuitry. This rectangular package has a very thin profile, fine pitch grid array style for surface mounting applications.
ME310G1WW04T050400
Telit Communications Plc
Telit ME310G1WW04T050400 is a compact CELL IC with 94 terminals, ideal for RF & baseband circuits. Operates b/w -40°C to 85°C, with a nominal voltage of 3.8V. Its MICROELECTRONIC ASSEMBLY package makes it suitable for various cellphone applications.
MAX20461ATJD/V+
BASEBAND CIRCUIT; Terminal Finish: Matte Tin (Sn) - annealed; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; JESD-609 Code: e3;
LMH9126IRRLR
Texas Instruments LMH9126IRRLR is a cellphone IC with 12 terminals in a square chip carrier package. Operating temperature ranges from -40 to 105°C, suitable for industrial use. It features RF and baseband circuits, operates at 3.3V, and has moisture sensitivity level of 2.
CC1000-RTB1
CC1000-RTB1 by Texas Instruments is a cellphone IC with 28 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 2.5/3.3V and telecom IC type for RF and baseband circuits. This CMOS technology device has a small outline package style suitable for industrial applications.
BG95M1LA-64-SGNS
Quectel Wireless Solutions
Quectel Wireless Solutions' BG95M1LA-64-SGNS, a CELL IC with 102 terminals in MICROELECTRONIC ASSEMBLY, operates b/w -35°C to 75°C. This RF and BASEBAND CIRCUIT has a nominal voltage of 3.3V, ideal for compact cellphone designs due to its small dimensions of 19.9mm width and 23.6mm length.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
BGC100GN6
Infineon Technologies
Cellular Telephone Circuits;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved