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TRF6900

Texas Instruments

TRF6900 by Texas Instruments

TRF6900 by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates b/w -20°C to 60°C, suitable for RF and baseband circuits. The technology used is CMOS with a nominal voltage of 3V, making it ideal for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,629 parts In-Stock

1+ parts

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7,629

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Digiode

USA . 3,026 parts In-Stock

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3,026

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 67 parts In-Stock

1+ parts

$5.489

100+ parts

-

1k+ parts

$6.221

10k+ parts

-

67

$5.489

-

$6.221

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AZTECH Wire

Italy . 256 parts In-Stock

1+ parts

$5.862

100+ parts

-

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256

$5.862

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ChromeModa Solutions

Germany . 6,563 parts In-Stock

1+ parts

$6.167

100+ parts

$5.057

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6,563

$6.167

$5.057

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IDEA Electronic Components Group

UK . 498 parts In-Stock

1+ parts

$6.167

100+ parts

-

1k+ parts

$5.550

10k+ parts

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498

$6.167

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$5.550

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One Stop Electronics

USA . 1,468 parts In-Stock

1+ parts

$956.000

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1,468

$956.000

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A-Z Elektronik GmbH

Germany . 6,717 parts In-Stock

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6,717

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Corphita

USA . 1,420 parts In-Stock

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1,420

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DigiPath Technology Company

USA . 3 parts In-Stock

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$5.560

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3

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$5.560

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Overview

Elevate your cellphone performance with the TRF6900 by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments guarantees top-notch quality and reliability. The TRF6900 is designed for seamless integration into cellphone ICs, offering enhanced connectivity and efficiency. With a compact design and advanced technology, this RF and baseband circuit promises superior performance at both high and low temperatures. Say goodbye to connectivity issues and hello to a new level of efficiency with the TRF6900. Upgrade your cellphone experience today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, ensuring a longer lifespan and reliable performance.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing production costs.

Package Shape: SQUARE

The square shape offers a compact design, making it suitable for applications where space is limited.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the IC.

Nominal Supply Voltage: 3 V

Operating at a low supply voltage of 3V helps in reducing power consumption and heat dissipation, making it energy-efficient.

Technical Specifications

Cellphone ICs TRF6900 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TRF6900 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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