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ADF4602BCPZ

Analog Devices

ADF4602BCPZ by Analog Devices

Analog Devices' ADF4602BCPZ is a cellphone IC with 40 terminals, operating at 3.3V. It features a square package shape, matte tin terminal finish, and RF/baseband circuit for telecom applications. With a compact size of 6x6mm and very thin profile, it's ideal for surface mount designs in mobile devices.

Median Price

$24.310

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,984 parts In-Stock

1+ parts

-

100+ parts

$24.310

1k+ parts

$21.750

10k+ parts

$20.470

6,984

-

$24.310

$21.750

$20.470

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 840 parts In-Stock

1+ parts

$9.740

100+ parts

-

1k+ parts

-

10k+ parts

-

840

$9.740

-

-

-

Digiode

USA . 51 parts In-Stock

1+ parts

$25.736

100+ parts

-

1k+ parts

-

10k+ parts

-

51

$25.736

-

-

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Bristol Electronics

USA . 31 parts In-Stock

1+ parts

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31

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 68 parts In-Stock

1+ parts

$9.599

100+ parts

-

1k+ parts

$8.927

10k+ parts

-

68

$9.599

-

$8.927

-

IDEA Electronic Components Group

UK . 656 parts In-Stock

1+ parts

$10.322

100+ parts

-

1k+ parts

$9.806

10k+ parts

-

656

$10.322

-

$9.806

-

DigiPath Technology Company

USA . 2,353 parts In-Stock

1+ parts

$16.102

100+ parts

$15.458

1k+ parts

-

10k+ parts

$15.458

2,353

$16.102

$15.458

-

$15.458

Semicontronic

India . 6,636 parts In-Stock

1+ parts

$23.030

100+ parts

$22.454

1k+ parts

$22.339

10k+ parts

-

6,636

$23.030

$22.454

$22.339

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Corphita

USA . 993 parts In-Stock

1+ parts

$24.381

100+ parts

-

1k+ parts

-

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993

$24.381

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-

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RC Electronics

USA . 44,878 parts In-Stock

1+ parts

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100+ parts

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44,878

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Northwest PG Solutions

USA . 921 parts In-Stock

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921

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Native Components

USA . 685 parts In-Stock

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685

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Kepictronics

USA . 230 parts In-Stock

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230

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Overview

Unlock the power of seamless communication with the ADF4602BCPZ by Analog Devices, a cutting-edge Cellphone IC designed for top-notch performance and reliability. Known for their high-quality products, Analog Devices delivers superior technology that exceeds industry standards. Ideal for a wide range of applications, this Surface Mount IC offers unparalleled value with its innovative design and advanced features. Elevate your mobile device experience with the ADF4602BCPZ and stay connected like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product convenient to incorporate into electronic devices.

Package Shape: SQUARE

The square package shape saves space on the PCB, allowing for more compact and streamlined designs.

Power Supplies (V): 3.3

Operating at 3.3V ensures compatibility with a wide range of electronic systems and power sources.

No. of Terminals: 40

The high number of terminals allows for versatile connectivity options and functionality within the device.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile packaging styles indicates efficient heat dissipation and space-saving design.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high heat conditions, ensuring reliability and longevity.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures down to 0°C makes this product suitable for a variety of environments and conditions.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish with annealing provides a durable and reliable terminal connection for stable performance.

Terminal Position: QUAD

The quad terminal position allows for secure and stable connections, enhancing the overall reliability of the product.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm enables a slim and compact form factor for the device.

Width: 6 mm

The narrow width of 6mm contributes to space-saving on the PCB layout and allows for efficient use of board space.

Length: 6 mm

The compact length of 6mm further enhances the overall space-saving design of the product.

Terminal Form: NO LEAD

The no lead terminal form improves reliability and signal integrity within the device, ensuring consistent performance.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuit capabilities in one package provides comprehensive functionality for telecom applications.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources and voltage levels.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density mounting and compact layout on the PCB, maximizing efficiency and space utilization.

Technical Specifications

Cellphone ICs ADF4602BCPZ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N40

JESD-609 Code:

e3

Length:

6 mm

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

ADF4602BCPZ Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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