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TRF4903PWRG4

Texas Instruments

TRF4903PWRG4 by Texas Instruments

TRF4903PWRG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at -40 to 85°C. It features a supply voltage of 2.7V and low current consumption of 0.043mA. Ideal for RF and baseband circuits in telecom applications due to its compact size and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,970 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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8,970

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Digiode

USA . 3,516 parts In-Stock

1+ parts

-

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-

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3,516

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,085 parts In-Stock

1+ parts

$15.673

100+ parts

-

1k+ parts

$16.042

10k+ parts

-

2,085

$15.673

-

$16.042

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DigiPath Technology Company

USA . 2,354 parts In-Stock

1+ parts

$17.258

100+ parts

$15.877

1k+ parts

-

10k+ parts

-

2,354

$17.258

$15.877

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ChromeModa Solutions

Germany . 6,889 parts In-Stock

1+ parts

$17.610

100+ parts

$14.440

1k+ parts

-

10k+ parts

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6,889

$17.610

$14.440

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IDEA Electronic Components Group

UK . 302 parts In-Stock

1+ parts

$17.610

100+ parts

$16.730

1k+ parts

$15.849

10k+ parts

-

302

$17.610

$16.730

$15.849

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AZTECH Wire

Italy . 351 parts In-Stock

1+ parts

$18.605

100+ parts

-

1k+ parts

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351

$18.605

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$20.650

100+ parts

$18.792

1k+ parts

$16.933

10k+ parts

-

2,500

$20.650

$18.792

$16.933

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One Stop Electronics

USA . 883 parts In-Stock

1+ parts

$228.000

100+ parts

-

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883

$228.000

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Corphita

USA . 321 parts In-Stock

1+ parts

-

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321

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Overview

Elevate your cellphone performance with the TRF4903PWRG4 by Texas Instruments. Renowned for their top-notch quality, Texas Instruments brings you a cutting-edge solution in cellphone ICs. This versatile component offers seamless integration, improved efficiency, and enhanced functionality for your mobile devices. Whether you're looking to boost signal reception, optimize power management, or enhance data processing, this Telecom IC is the key to unlocking superior performance. Trust Texas Instruments to deliver innovation that exceeds expectations. Elevate your cellphone experience today with the TRF4903PWRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the IC lightweight and durable, ideal for mobile devices that require components to be both sturdy and lightweight.

Surface Mount: YES

With surface mount capability, this IC can be easily and securely attached to the PCB, allowing for efficient manufacturing processes.

Power Supplies (V): 2.7

The 2.7V power supply allows for efficient power usage and compatibility with various devices that operate within this voltage range.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures that the IC can withstand elevated temperatures without compromising performance, making it suitable for industrial applications.

Terminal Form: GULL WING

The gull wing terminal form provides a reliable connection to the PCB, enhancing the overall performance and durability of the IC.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The RF and baseband circuit integration within the IC enables it to efficiently manage wireless communication signals, making it a versatile choice for cellphone applications.

Technical Specifications

Cellphone ICs TRF4903PWRG4 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.7

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.043 mA

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

TRF4903PWRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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