Loading...

TRF4900PW

Texas Instruments

TRF4900PW by Texas Instruments

TRF4900PW by Texas Instruments is a 24-terminal cellphone IC with 3V supply voltage. It features CMOS technology, RF and baseband circuit for telecom applications. With a small outline package style, it operates b/w 0-70°C temperature range.

Median Price

$2.100

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 77 parts In-Stock

1+ parts

-

100+ parts

$2.100

1k+ parts

$1.880

10k+ parts

$1.770

77

-

$2.100

$1.880

$1.770

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,810 parts In-Stock

1+ parts

$2.223

100+ parts

-

1k+ parts

-

10k+ parts

-

2,810

$2.223

-

-

-

Vyrian

USA . 2,505 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,505

-

-

-

-

Prism Electronics

USA . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,350 parts In-Stock

1+ parts

$2.106

100+ parts

-

1k+ parts

-

10k+ parts

-

3,350

$2.106

-

-

-

AZTECH Wire

Italy . 73 parts In-Stock

1+ parts

$11.630

100+ parts

-

1k+ parts

-

10k+ parts

-

73

$11.630

-

-

-

Parana Technologies

USA . 1,670 parts In-Stock

1+ parts

$14.479

100+ parts

-

1k+ parts

$14.922

10k+ parts

-

1,670

$14.479

-

$14.922

-

DigiPath Technology Company

USA . 1,924 parts In-Stock

1+ parts

$15.944

100+ parts

-

1k+ parts

-

10k+ parts

-

1,924

$15.944

-

-

-

ChromeModa Solutions

Germany . 1,070 parts In-Stock

1+ parts

$16.269

100+ parts

$13.341

1k+ parts

-

10k+ parts

-

1,070

$16.269

$13.341

-

-

IDEA Electronic Components Group

UK . 862 parts In-Stock

1+ parts

$16.269

100+ parts

$15.456

1k+ parts

$14.642

10k+ parts

-

862

$16.269

$15.456

$14.642

-

Kepictronics

USA . 40 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

40

-

-

-

-

Overview

Unlock the potential of your cellphone with the TRF4900PW by Texas Instruments. Designed with high-quality materials and cutting-edge technology, this RF and baseband circuit offers unmatched performance and reliability. Whether you're looking to enhance your communication capabilities or improve signal processing, this compact yet powerful IC is the perfect solution. Trust in Texas Instruments' expertise in telecom ICs and elevate your mobile experience today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

The surface mount feature allows for easy and quick installation on PCBs, making it convenient for manufacturers.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the PCB.

Power Supplies (V): 3

Operating at a lower voltage of 3V helps in reducing power consumption, leading to improved energy efficiency.

No. of Terminals: 24

Having 24 terminals provides ample connectivity options for various applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style allows for compact integration and saves space on the PCB.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can withstand high temperature environments without compromising performance.

Minimum Operating Temperature: 0 °C

The product can operate in colder environments down to 0°C, making it suitable for a wide range of applications.

Terminal Position: DUAL

The dual terminal position provides redundancy and improves reliability in case of any terminal failures.

Maximum Seated Height: 1.2 mm

The low seated height of 1.2mm allows for a slim profile design, ideal for compact electronic devices.

Width: 4.4 mm

The narrow width of 4.4mm helps in saving space on the PCB and allows for more components to be placed closer together.

Length: 7.8 mm

The compact length of 7.8mm contributes to a smaller footprint on the PCB, optimizing space utilization.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades ensures compatibility with a wide range of commercial applications.

Technology: CMOS

The use of CMOS technology offers lower power consumption and faster operation, enhancing overall performance.

Terminal Form: GULL WING

The gull wing terminal form provides secure soldering connections and enhances the mechanical stability of the product.

Maximum Supply Current: 0.075 mA

Operating at a maximum supply current of 0.075mA helps in reducing energy consumption and prolonging battery life.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The inclusion of RF and baseband circuitry in the telecom IC type allows for seamless communication and signal processing capabilities.

Nominal Supply Voltage: 3 V

The product operating at a nominal supply voltage of 3V ensures compatibility with standard voltage requirements in electronic devices.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm enables tighter component placement on the PCB, leading to a more compact design.

Technical Specifications

Cellphone ICs TRF4900PW attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.075 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

TRF4900PW Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 13