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TRF4400PWG4

Texas Instruments

TRF4400PWG4 by Texas Instruments

TRF4400PWG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at 3V. It features CMOS technology, RF and baseband circuit for telecom applications. The package is small outline, thin profile, with shrink pitch, suitable for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,359 parts In-Stock

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3,359

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Digiode

USA . 2,097 parts In-Stock

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2,097

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Distributors (Availability)

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Parana Technologies

USA . 901 parts In-Stock

1+ parts

$13.640

100+ parts

-

1k+ parts

$14.141

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901

$13.640

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$14.141

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AZTECH Wire

Italy . 790 parts In-Stock

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$14.489

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790

$14.489

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DigiPath Technology Company

USA . 1,466 parts In-Stock

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$15.019

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$13.818

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1,466

$15.019

$13.818

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ChromeModa Solutions

Germany . 5,320 parts In-Stock

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$15.326

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$12.567

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5,320

$15.326

$12.567

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IDEA Electronic Components Group

UK . 1,391 parts In-Stock

1+ parts

$15.326

100+ parts

$14.560

1k+ parts

$13.793

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1,391

$15.326

$14.560

$13.793

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$19.830

100+ parts

$18.045

1k+ parts

$16.261

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500

$19.830

$18.045

$16.261

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One Stop Electronics

USA . 359 parts In-Stock

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$29.000

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359

$29.000

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Component Stockers USA

USA . 519 parts In-Stock

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$99.990

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519

$99.990

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Ampacity Inc.

Singapore . 1,261 parts In-Stock

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$348.000

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1,261

$348.000

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Semicontronic

India . 495 parts In-Stock

1+ parts

$751.000

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$732.225

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$728.470

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495

$751.000

$732.225

$728.470

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Corphita

USA . 482 parts In-Stock

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Corohmni

South Africa . 128 parts In-Stock

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Overview

Elevate your cellphone performance with the TRF4400PWG4 by Texas Instruments, a top-quality RF and baseband circuit that offers seamless connectivity and superior functionality. Manufactured by industry leader Texas Instruments, this cutting-edge IC boasts a sleek rectangular design and surface mount capability for easy integration. Perfect for enhancing your device's performance, this small outline, thin profile package delivers reliable power supplies and optimal temperature range for peak efficiency. Upgrade your cellphone experience with the TRF4400PWG4 and unlock a world of endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product suitable for portable devices like cellphones.

Surface Mount: YES

Surface mount technology saves space on the PCB and allows for automated assembly, increasing efficiency and reducing production costs.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easy to handle during manufacturing and installation processes.

Power Supplies (V): 3

Stable power supply of 3V ensures reliable operation of the cellphone ICs.

No. of Terminals: 24

Having 24 terminals provides flexibility in connecting various components of the cellphone ICs.

Maximum Operating Temperature: 60 °C

High maximum operating temperature ensures reliability in different environmental conditions.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature allows the cellphone ICs to function in cold environments as well.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures better connectivity for improved performance.

Width: 4.4 mm

Compact width allows for space-saving design in the cellphone circuitry.

Length: 7.8 mm

Optimal length for efficient placement and connectivity within the cellphone circuit layout.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, ideal for cellphone applications.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering during assembly.

Nominal Supply Voltage: 3 V

Stable supply voltage of 3V ensures consistent performance of the cellphone ICs.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm allows for compact design and high-density integration of components in the circuit.

Technical Specifications

Cellphone ICs TRF4400PWG4 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.075 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

TRF4400PWG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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