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TRF4900

Texas Instruments

TRF4900 by Texas Instruments

TRF4900 by Texas Instruments is a cellphone IC with 24 terminals in a small outline, thin profile package. It operates b/w -20°C to 60°C and has a supply voltage of 3V. This RF and baseband circuit is ideal for telecom applications due to its compact size and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,136 parts In-Stock

1+ parts

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7,136

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Digiode

USA . 2,701 parts In-Stock

1+ parts

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2,701

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 228 parts In-Stock

1+ parts

$7.731

100+ parts

-

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228

$7.731

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Parana Technologies

USA . 1,969 parts In-Stock

1+ parts

$15.442

100+ parts

$1,434.060

1k+ parts

$13.898

10k+ parts

-

1,969

$15.442

$1,434.060

$13.898

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DigiPath Technology Company

USA . 523 parts In-Stock

1+ parts

$17.004

100+ parts

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523

$17.004

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ChromeModa Solutions

Germany . 6,155 parts In-Stock

1+ parts

$17.351

100+ parts

$14.228

1k+ parts

-

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6,155

$17.351

$14.228

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IDEA Electronic Components Group

UK . 1,424 parts In-Stock

1+ parts

$17.351

100+ parts

$16.483

1k+ parts

$15.616

10k+ parts

-

1,424

$17.351

$16.483

$15.616

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One Stop Electronics

USA . 980 parts In-Stock

1+ parts

$312.000

100+ parts

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980

$312.000

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Corphita

USA . 3,573 parts In-Stock

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3,573

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Overview

Elevate your cellphone's performance with the TRF4900 by Texas Instruments. Crafted with precision and expertise, this innovative RF and baseband circuit integrated circuit offers unparalleled quality and reliability. Designed for seamless integration, its small outline, thin profile package ensures optimal performance in a compact form factor. From enhanced signal processing to improved connectivity, the TRF4900 delivers exceptional value and benefits to customers seeking cutting-edge technology for their mobile devices. Upgrade your cellphone experience today with the TRF4900 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and protection for the internal components of the Cellphone IC, making it a reliable choice for long-term use.

Surface Mount: YES

Being surface mount compatible makes the Cellphone IC easy to install on a PCB, saving space and allowing for efficient assembly.

No. of Terminals: 24

With 24 terminals, this Cellphone IC offers a wide range of connectivity options, allowing for versatile usage in different cellphone applications.

Maximum Operating Temperature: 60 °C

The high maximum operating temperature of 60°C ensures that the Cellphone IC can withstand heat and continue to function reliably even under challenging conditions.

Nominal Supply Voltage: 3 V

The 3 V nominal supply voltage is standard for many cellphone applications, ensuring compatibility and ease of integration with existing circuitry.

Technical Specifications

Cellphone ICs TRF4900 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

TRF4900 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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