Loading...

TCM320AC56IN

Texas Instruments

TCM320AC56IN by Texas Instruments

TCM320AC56IN by Texas Instruments is a 20-terminal IC for cellphones. It operates at temperatures from -40 to 85°C, with a supply voltage of 5V. Featuring companding law MU-LAW and a filter, it is ideal for baseband circuit applications in the telecom industry.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,985 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,985

-

-

-

-

Digiode

USA . 2,675 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,675

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 516 parts In-Stock

1+ parts

$11.733

100+ parts

-

1k+ parts

-

10k+ parts

-

516

$11.733

-

-

-

Parana Technologies

USA . 1,350 parts In-Stock

1+ parts

$11.914

100+ parts

-

1k+ parts

$12.315

10k+ parts

-

1,350

$11.914

-

$12.315

-

DigiPath Technology Company

USA . 1,053 parts In-Stock

1+ parts

$13.118

100+ parts

-

1k+ parts

-

10k+ parts

-

1,053

$13.118

-

-

-

ChromeModa Solutions

Germany . 6,652 parts In-Stock

1+ parts

$13.386

100+ parts

$10.977

1k+ parts

-

10k+ parts

-

6,652

$13.386

$10.977

-

-

IDEA Electronic Components Group

UK . 932 parts In-Stock

1+ parts

$13.386

100+ parts

$12.717

1k+ parts

$12.047

10k+ parts

-

932

$13.386

$12.717

$12.047

-

One Stop Electronics

USA . 1,185 parts In-Stock

1+ parts

$630.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,185

$630.000

-

-

-

Corphita

USA . 2,166 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,166

-

-

-

-

Overview

Elevate your cellphone's performance with the TCM320AC56IN by Texas Instruments. Crafted with precision and expertise, this high-quality IC offers unparalleled reliability and efficiency. Perfect for baseband circuit applications, this product ensures seamless communication and enhanced functionality. Experience the value of cutting-edge technology and unlock a whole new world of possibilities with the TCM320AC56IN. Upgrade your device today and enjoy the benefits of superior performance and unmatched quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable devices like cellphones.

Power Supplies (V): 5

Operating at 5V provides compatibility with standard power sources, ensuring easy integration into various systems.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and functionalities, making the IC versatile and capable of handling various tasks.

Maximum Operating Temperature: 85 °C

With a high operating temperature limit of 85°C, this IC can withstand demanding conditions and maintain performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC efficient and reliable in cellphone applications.

Telecom IC Type: BASEBAND CIRCUIT

Being a baseband circuit IC, it is designed for processing signals in telecommunication devices like cellphones, ensuring optimal performance in communication tasks.

Technical Specifications

Cellphone ICs TCM320AC56IN attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

1 dB

JESD-30 Code:

R-PDIP-T20

Length:

24.325 mm

Linear Coding:

13-BIT

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Codecs

Maximum Supply Current:

.0099 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TCM320AC56IN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20