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TCM320AC56PT

Texas Instruments

TCM320AC56PT by Texas Instruments

Texas Instruments TCM320AC56PT is a 48-terminal cellphone IC in a square, low-profile package. With operating temperatures from -40 to 85°C, it's ideal for industrial telecom applications requiring a 5V supply voltage. The Gull Wing terminals and fine pitch make it suitable for baseband circuit integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,245 parts In-Stock

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Digiode

USA . 587 parts In-Stock

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587

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Distributors (Availability)

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AZTECH Wire

Italy . 818 parts In-Stock

1+ parts

$6.697

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818

$6.697

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Parana Technologies

USA . 563 parts In-Stock

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$10.857

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$11.334

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563

$10.857

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$11.334

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DigiPath Technology Company

USA . 183 parts In-Stock

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$11.955

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183

$11.955

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ChromeModa Solutions

Germany . 6,249 parts In-Stock

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$12.199

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$10.003

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6,249

$12.199

$10.003

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IDEA Electronic Components Group

UK . 1,901 parts In-Stock

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$12.199

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$11.589

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$10.979

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$12.199

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$10.979

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Ampacity Inc.

Singapore . 1,116 parts In-Stock

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$738.000

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$738.000

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Semicontronic

India . 401 parts In-Stock

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$785.000

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$765.375

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$761.450

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401

$785.000

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One Stop Electronics

USA . 872 parts In-Stock

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$927.000

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Corphita

USA . 1,435 parts In-Stock

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Corohmni

South Africa . 357 parts In-Stock

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Overview

Elevate your cellphone technology with the TCM320AC56PT by Texas Instruments. This high-quality baseband circuit IC offers unmatched reliability and performance, thanks to Texas Instruments' reputation for excellence in semiconductor manufacturing. Ideal for a wide range of telecommunications applications, this product delivers value, benefits, and advantages that will take your devices to the next level. Trust Texas Instruments to provide cutting-edge solutions for all your cellphone IC needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material is lightweight and cost-effective, making the product suitable for mobile devices.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and cost in production.

No. of Terminals: 48

With 48 terminals, this IC can support complex functionality and connectivity in cellphones.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can withstand varying environmental conditions, enhancing its reliability.

Terminal Position: QUAD

Quad terminal position provides better mechanical stability and easier soldering during assembly.

Width: 7 mm

Compact width of 7 mm allows for space-efficient integration in cellphones while maintaining functionality.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh environments, making it suitable for industrial applications.

Nominal Supply Voltage: 5 V

Nominal 5V supply voltage is common in many electronic devices, ensuring compatibility and ease of integration.

Technical Specifications

Cellphone ICs TCM320AC56PT attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TCM320AC56PT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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