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MAX2359ETIT

Analog Devices

MAX2359ETIT by Analog Devices

MAX2359ETIT by Analog Devices is a Cellphone IC with BICMOS tech. It operates b/w -40 to 85 °C, has 28 terminals in a square chip carrier package, and requires 2.75V supply voltage. Ideal for RF and baseband circuits in telecom applications due to its compact size and industrial temperature grade suitability.

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1k+

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Digiode

USA . 3,085 parts In-Stock

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Vyrian

USA . 2,611 parts In-Stock

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Anansix

USA . 786 parts In-Stock

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AZTECH Wire

Italy . 327 parts In-Stock

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$7.251

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MARBEL Systems

Belgium . 500 parts In-Stock

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$11.837

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Texas Native Microelectronics

USA . 4,592 parts In-Stock

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$13.606

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$13.062

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$12.654

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$11.973

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Kenton Components

USA . 3,943 parts In-Stock

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$14.368

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Qasali Group International

UK . 3,334 parts In-Stock

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$36.736

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$34.165

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$32.328

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Semicontronic

India . 896 parts In-Stock

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One Stop Electronics

USA . 596 parts In-Stock

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Corphita

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Overview

Discover the Analog Devices MAX2359ETIT, a cutting-edge Cellphone IC that delivers top-notch performance and reliability. Crafted by industry leader Analog Devices, this Surface Mount package boasts a sleek SQUARE design with 28 terminals for seamless integration. Perfect for RF and baseband circuits, this Telecom IC is designed for industrial-grade applications with a wide temperature range. Trust Analog Devices to deliver exceptional quality and superior technology in every product, ensuring your devices operate at their peak potential. Elevate your projects with the MAX2359ETIT and experience unparalleled value and performance.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the IC onto a printed circuit board, saving space and reducing manufacturing costs.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, making it suitable for compact devices.

No. of Terminals: 28

With 28 terminals, this IC provides a sufficient number of connections for complex cellphone functionalities.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the IC to function in a wide range of temperature conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring a reliable connection.

Terminal Position: QUAD

The quad terminal position allows for easy routing of connections and efficient layout design.

Maximum Seated Height: 0.9 mm

The low maximum seated height enables thin and sleek cellphone designs.

Width: 5 mm

The compact width of 5 mm allows for space-saving integration in the device.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures efficient and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature enables robust solder joints for long-term reliability.

Length: 5 mm

The compact length of 5 mm complements the overall small footprint of the IC.

Temperature Grade: INDUSTRIAL

The industrial temperature grade makes this IC suitable for use in harsh industrial environments.

Technology: BICMOS

BICMOS technology offers a combination of high-speed performance and low power consumption, making it ideal for cellphone applications.

Terminal Form: NO LEAD

The no-lead terminal form provides a more environmentally friendly and reliable connection compared to traditional leaded packages.

Telecom IC Type: RF AND BASEBAND CIRCUIT

This IC combines RF and baseband circuitry, offering integrated functionality for improved performance in cellphone applications.

Nominal Supply Voltage: 2.75 V

The low nominal supply voltage of 2.75 V helps in reducing power consumption and improving efficiency.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density mounting and compact design in the cellphone.

Technical Specifications

Cellphone ICs MAX2359ETIT attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

2.75 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MAX2359ETIT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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