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CC1070RSQR

Texas Instruments

CC1070RSQR by Texas Instruments

The Texas Instruments CC1070RSQR is a cellphone IC with 20 terminals in a square package. It operates at temperatures from -40 to 105°C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 3V, making it ideal for telecom applications.

Median Price

$3.590

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 40 parts In-Stock

1+ parts

$3.180

100+ parts

$3.120

1k+ parts

$3.050

10k+ parts

-

40

$3.180

$3.120

$3.050

-

DigiKey

USA . 3,477 parts In-Stock

1+ parts

$8.770

100+ parts

$6.652

1k+ parts

$5.864

10k+ parts

$5.758

3,477

$8.770

$6.652

$5.864

$5.758

Chip1Stop

Japan . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.590

5,000

-

-

-

$3.590

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,088 parts In-Stock

1+ parts

$3.590

100+ parts

-

1k+ parts

-

10k+ parts

-

1,088

$3.590

-

-

-

EXC GmbH

Germany . 12,550 parts In-Stock

1+ parts

$4.774

100+ parts

-

1k+ parts

-

10k+ parts

-

12,550

$4.774

-

-

-

Digiode

USA . 1,634 parts In-Stock

1+ parts

$7.980

100+ parts

-

1k+ parts

-

10k+ parts

-

1,634

$7.980

-

-

-

Chip Stock

USA . 6,050 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,050

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 749 parts In-Stock

1+ parts

$0.460

100+ parts

-

1k+ parts

-

10k+ parts

$0.441

749

$0.460

-

-

$0.441

Northwest PG Solutions

USA . 534 parts In-Stock

1+ parts

$0.506

100+ parts

-

1k+ parts

-

10k+ parts

$0.446

534

$0.506

-

-

$0.446

Corphita

USA . 4,578 parts In-Stock

1+ parts

$7.560

100+ parts

-

1k+ parts

-

10k+ parts

-

4,578

$7.560

-

-

-

Corohmni

South Africa . 114 parts In-Stock

1+ parts

$7.703

100+ parts

-

1k+ parts

-

10k+ parts

-

114

$7.703

-

-

-

Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$12.224

100+ parts

$11.124

1k+ parts

$10.024

10k+ parts

-

20

$12.224

$11.124

$10.024

-

Parana Technologies

USA . 1,409 parts In-Stock

1+ parts

$12.882

100+ parts

-

1k+ parts

$13.365

10k+ parts

-

1,409

$12.882

-

$13.365

-

ChromeModa Solutions

Germany . 5,151 parts In-Stock

1+ parts

$14.474

100+ parts

$11.869

1k+ parts

-

10k+ parts

-

5,151

$14.474

$11.869

-

-

IDEA Electronic Components Group

UK . 1,151 parts In-Stock

1+ parts

$14.474

100+ parts

$13.750

1k+ parts

$13.027

10k+ parts

-

1,151

$14.474

$13.750

$13.027

-

Perfect Parts

USA . 54,005 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

54,005

-

-

-

-

Epart123

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.900

10,000

-

-

-

$3.900

Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

-

-

-

-

GreenTree Electronics

Israel . 5,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,200

-

-

-

-

A-Z Elektronik GmbH

Germany . 2,940 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,940

-

-

-

-

Kepictronics

USA . 1,960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,960

-

-

-

-

Lixinc

USA . 1,523 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,523

-

-

-

-

DigiPath Technology Company

USA . 130 parts In-Stock

1+ parts

-

100+ parts

$13.050

1k+ parts

-

10k+ parts

-

130

-

$13.050

-

-

Overview

Enhance the performance of your cellphone with the Texas Instruments CC1070RSQR, a top-quality Cellphone IC designed to optimize communication capabilities. Manufactured by industry leader Texas Instruments, this surface mount chip offers reliability and efficiency in a compact square package. With a wide range of applications in RF and baseband circuits, this product provides exceptional value to customers seeking seamless connectivity and improved functionality. Upgrade your device today with the CC1070RSQR and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

The square shape of the package provides a symmetrical and compact design, ideal for fitting into tight spaces within a cellphone.

Power Supplies (V): 2.5/3.3

Provides flexible power supply options to accommodate different voltage requirements in a cellphone, ensuring compatibility with various components.

No. of Terminals: 20

Having 20 terminals allows for connection to multiple input and output devices, enabling seamless communication within the cellphone.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package styles offer efficient heat dissipation, compact size, and low profile, making the product suitable for space-constrained cellphone designs.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the product can withstand demanding usage conditions without overheating, ensuring reliability and durability.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes the product suitable for use in various environmental conditions without performance degradation.

Terminal Position: QUAD

The quad terminal position allows for efficient routing of connections and signal flow, optimizing the performance of the cellphone ICs.

Maximum Seated Height: 1 mm

The low seated height enables a compact and slim design for the cellphone, contributing to overall sleek aesthetics and space-saving.

Width: 5 mm

The narrow width facilitates easy integration and placement of the IC within the cellphone circuitry, contributing to a streamlined design.

Length: 5mm

The compact length of the IC allows for efficient use of space within the cellphone, accommodating other components and minimizing footprint.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in a wide range of temperature environments, making it suitable for various industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, enhancing the energy efficiency and performance of the cellphone ICs.

Terminal Form: NO LEAD

The no lead terminal form simplifies soldering and promotes environmental friendliness by eliminating lead content, making it a more sustainable choice.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The inclusion of RF and baseband circuitry in the IC allows for seamless integration and connectivity in cellular communication systems, enhancing the overall functionality of the cellphone.

Nominal Supply Voltage: 3 V

The 3V supply voltage ensures compatibility with standard power sources, facilitating easy integration and operation in a wide range of cellphone applications.

Terminal Pitch: 0.65 mm

The small terminal pitch enables high density integration on the PCB, maximizing space efficiency and allowing for more features in the cellphone ICs.

Technical Specifications

Cellphone ICs CC1070RSQR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Length:

5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.20SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

CC1070RSQR Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.G

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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