Loading...

ADF7025BCPZ-RL7

Analog Devices

ADF7025BCPZ-RL7 by Analog Devices

Analog Devices' ADF7025BCPZ-RL7 is a cellphone IC with 48 terminals, operating at -40 to 85 °C. It features a 3V supply voltage, 0.5mm terminal pitch, and matte tin finish. Ideal for baseband circuits in telecom applications due to its compact square package and low profile design.

Median Price

$4.140

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,500 parts In-Stock

1+ parts

-

100+ parts

$4.140

1k+ parts

$3.710

10k+ parts

$3.490

10,500

-

$4.140

$3.710

$3.490

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 313 parts In-Stock

1+ parts

$4.076

100+ parts

-

1k+ parts

-

10k+ parts

-

313

$4.076

-

-

-

Vyrian

USA . 604 parts In-Stock

1+ parts

$4.290

100+ parts

-

1k+ parts

-

10k+ parts

-

604

$4.290

-

-

-

Quantum Digital Technology

USA . 49 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

49

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 483 parts In-Stock

1+ parts

$0.712

100+ parts

-

1k+ parts

-

10k+ parts

-

483

$0.712

-

-

-

Northwest PG Solutions

USA . 451 parts In-Stock

1+ parts

$0.783

100+ parts

-

1k+ parts

-

10k+ parts

-

451

$0.783

-

-

-

Andel Nordic

Denmark . 4,044 parts In-Stock

1+ parts

$3.800

100+ parts

-

1k+ parts

$2.658

10k+ parts

$2.658

4,044

$3.800

-

$2.658

$2.658

Corphita

USA . 817 parts In-Stock

1+ parts

$3.861

100+ parts

-

1k+ parts

-

10k+ parts

-

817

$3.861

-

-

-

Semicontronic

India . 10,004 parts In-Stock

1+ parts

$7.940

100+ parts

$7.742

1k+ parts

$7.702

10k+ parts

-

10,004

$7.940

$7.742

$7.702

-

Parana Technologies

USA . 950 parts In-Stock

1+ parts

$15.334

100+ parts

-

1k+ parts

$14.260

10k+ parts

-

950

$15.334

-

$14.260

-

IDEA Electronic Components Group

UK . 1,314 parts In-Stock

1+ parts

$16.488

100+ parts

$15.664

1k+ parts

$15.664

10k+ parts

-

1,314

$16.488

$15.664

$15.664

-

DigiPath Technology Company

USA . 473 parts In-Stock

1+ parts

$25.721

100+ parts

$24.692

1k+ parts

-

10k+ parts

$24.692

473

$25.721

$24.692

-

$24.692

Robosynatics

Brazil . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

200

-

-

-

-

Lucentia Tech

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$16.732

1k+ parts

$15.494

10k+ parts

$15.494

200

-

$16.732

$15.494

$15.494

Overview

Experience seamless connectivity like never before with the ADF7025BCPZ-RL7 by Analog Devices. As a leading manufacturer in the industry, Analog Devices ensures top-notch quality and reliability in their products. This cellphone IC boasts cutting-edge technology, making it ideal for a wide range of applications. Enhance your devices with the value and benefits this product offers, providing customers with exceptional performance and functionality. Upgrade to the ADF7025BCPZ-RL7 today and stay ahead of the curve in the fast-paced world of telecommunications.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient soldering onto the circuit board, making installation and manufacturing processes faster and more cost-effective.

Package Shape: SQUARE

The square package shape provides a compact design, maximizing space efficiency in the overall cellphone ICs layout.

Power Supplies (V): 2.5/3.3

Supporting multiple power supply voltages allows for flexibility in compatibility with different cellphones and devices, ensuring reliable performance.

No. of Terminals: 48

Having 48 terminals allows for more connectivity options and functionalities, enhancing the capabilities of the cellphone ICs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offers high thermal efficiency and space-saving benefits.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the cellphone ICs can withstand demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures reliable performance even in extreme cold conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides a durable and reliable connection for the cellphone ICs, preventing corrosion and ensuring long-term functionality.

Terminal Position: QUAD

The quad terminal position offers enhanced stability and connectivity, improving overall performance and reliability of the cellphone ICs.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm enables a slim and compact design for the cellphone ICs, facilitating space-saving integration into devices.

Width: 7 mm

The 7 mm width provides a balance between compactness and ease of handling during installation and maintenance of the cellphone ICs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures proper soldering and connection reliability during manufacturing processes.

Length: 7 mm

The 7 mm length contributes to the overall compactness and space efficiency of the cellphone ICs, allowing for versatile integration in various devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that the cellphone ICs are designed to operate reliably in harsh industrial environments, ensuring durability and performance consistency.

Terminal Form: NO LEAD

The no lead terminal form eliminates the risk of lead contamination, making the cellphone ICs environmentally friendly and safe for use.

Telecom IC Type: BASEBAND CIRCUIT

Being a baseband circuit telecom IC type, the product offers essential functionalities for processing communication signals efficiently in cellphones and other telecom devices.

Nominal Supply Voltage: 3 V

The 3 V nominal supply voltage provides a standard power input for the cellphone ICs, ensuring compatibility and stable performance across various applications.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density mounting of the cellphone ICs on the circuit board, optimizing space utilization and increasing connectivity options.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the cellphone ICs can withstand moderate exposure to moisture during handling and storage, reducing the risk of damage.

Technical Specifications

Cellphone ICs ADF7025BCPZ-RL7 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

ADF7025BCPZ-RL7 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Analog Devices 10

Similar products 20