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ADF7020BCPZ-RL7

Analog Devices

ADF7020BCPZ-RL7 by Analog Devices

Analog Devices' ADF7020BCPZ-RL7 is a cellphone IC with 48 terminals, operating at -40 to 85 °C. It features a supply voltage of 3V, RF and baseband circuitry for telecom applications, and a compact square package suitable for surface mounting in industrial environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,328 parts In-Stock

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Chip Stock

USA . 4,500 parts In-Stock

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Digiode

USA . 710 parts In-Stock

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710

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Distributors (Availability)

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Parana Technologies

USA . 3,698 parts In-Stock

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$8.631

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$8.027

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$8.631

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$8.027

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IDEA Electronic Components Group

UK . 1,374 parts In-Stock

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$9.281

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$8.817

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AZTECH Wire

Italy . 638 parts In-Stock

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638

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DigiPath Technology Company

USA . 1,442 parts In-Stock

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$14.478

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$13.899

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$13.899

1,442

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$13.899

Semicontronic

India . 1,435 parts In-Stock

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$30.000

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$29.250

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$29.100

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One Stop Electronics

USA . 625 parts In-Stock

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$665.000

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Northwest PG Solutions

USA . 2,045 parts In-Stock

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Corphita

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Native Components

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Overview

Unlock seamless connectivity with the ADF7020BCPZ-RL7 by Analog Devices, a leading manufacturer in cellphone ICs. This cutting-edge technology offers unparalleled reliability and performance for a wide range of applications. Say goodbye to connectivity issues and hello to fast, efficient communication. With a sleek square design and advanced features, this product is a game-changer in the industry. Trust Analog Devices to deliver top-quality solutions that exceed expectations. Elevate your connectivity experience today with the ADF7020BCPZ-RL7.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and reducing manufacturing costs.

Package Shape: SQUARE

Square package shape provides better space utilization and allows for a more compact design.

Power Supplies (V): 2.5/3.3

Supports a wide range of power supplies, making it compatible with various voltage requirements.

No. of Terminals: 48

Provides a sufficient number of terminals for connecting to other components and peripherals in the cellphone system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers a versatile package style that can accommodate different mounting and cooling requirements.

Maximum Operating Temperature: 85 °C

Ensures reliable performance under high temperature conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely low temperature environments, adding to its versatility.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

Quad terminal position offers improved stability and connectivity on the circuit board.

Maximum Seated Height: 1 mm

Low seated height enables a slim and compact design for the overall cellphone system.

Width: 7 mm

Narrow width allows for space-saving integration into the cellphone design.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during the manufacturing process without compromising performance.

Length: 7 mm

Compact length facilitates easy placement within the cellphone system.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature requirements, ensuring reliability in harsh environments.

Terminal Form: NO LEAD

Lead-free terminal form is environmentally friendly and compliant with RoHS regulations.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combines RF and baseband circuit functionality in a single IC, reducing component count and complexity.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage eliminates the need for additional voltage regulation circuitry.

Terminal Pitch: 0.5mm

Fine terminal pitch allows for high-density mounting and miniaturization of the cellphone system.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the IC can be exposed to standard moisture conditions during storage and assembly.

Technical Specifications

Cellphone ICs ADF7020BCPZ-RL7 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

ADF7020BCPZ-RL7 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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