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ADF7025BCP

Analog Devices

ADF7025BCP by Analog Devices

Analog Devices' ADF7025BCP is a cellphone IC with 48 terminals in a square chip carrier package. It operates at temperatures from -40 to 85 °C, with power supplies of 2.5/3.3V. This RF and baseband circuit is ideal for telecom applications requiring a nominal voltage of 3V.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 7,925 parts In-Stock

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Digiode

USA . 889 parts In-Stock

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Cogito LLC

Ukraine . 2 parts In-Stock

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Northwest PG Solutions

USA . 2,227 parts In-Stock

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$2.932

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$2.932

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AZTECH Wire

Italy . 702 parts In-Stock

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$10.000

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702

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Parana Technologies

USA . 3,584 parts In-Stock

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$13.303

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$12.372

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IDEA Electronic Components Group

UK . 1,334 parts In-Stock

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$14.304

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$13.589

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$13.589

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DigiPath Technology Company

USA . 3,584 parts In-Stock

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$22.314

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$21.422

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$21.422

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$21.422

Semicontronic

India . 738 parts In-Stock

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$682.000

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$664.950

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$661.540

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738

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One Stop Electronics

USA . 1,064 parts In-Stock

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$971.000

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A-Z Elektronik GmbH

Germany . 3,108 parts In-Stock

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Corphita

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Native Components

USA . 370 parts In-Stock

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370

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Overview

Unlock the potential of your cellphone with the ADF7025BCP by Analog Devices. Known for their top-quality manufacturing, Analog Devices delivers reliable and cutting-edge Cellphone ICs that are perfect for a variety of applications. With surface mount technology and a compact square package shape, this RF and Baseband Circuit offers customers a seamless and efficient experience. Trust Analog Devices to provide you with the innovation and performance you need in your cellphone technology. Experience the difference today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on a circuit board, making this product suitable for high-volume production.

Package Shape: SQUARE

The square package shape provides a compact design, saving space on the circuit board and enabling more components to be placed in a limited area.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages allows flexibility in designing circuits that require different voltage levels, enhancing the versatility of this product.

No. of Terminals: 48

Having a high number of terminals enables the IC to interface with a variety of other components and signals, making it suitable for complex cellphone circuitry.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG

The chip carrier style and inclusion of a heat sink/slub design enhance thermal management and ensure efficient heat dissipation, contributing to the longevity and stability of the IC.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the IC to function reliably under demanding conditions, making it suitable for cellphone applications that may experience temperature fluctuations.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the IC remains operational even in cold environments, providing reliable performance across a wide range of temperature conditions.

Terminal Finish: TIN LEAD

The use of tin lead terminal finish promotes excellent solderability and ensures secure connections, facilitating the assembly process and enhancing the overall reliability of the product.

Terminal Position: QUAD

The quad terminal position configuration enables efficient routing of connections and signals within the IC, optimizing circuit layout and promoting better signal integrity.

Maximum Seated Height: 1.5 mm

The low maximum seated height allows for a slim profile and close component placement, accommodating compact cellphone designs and enhancing overall product aesthetics.

Width: 7 mm

The narrow width of the IC contributes to space-saving layouts on the circuit board, enabling more efficient use of available space and facilitating compact cellphone designs.

Length: 7 mm

The short length of the IC further enhances its compact footprint, enabling it to be integrated seamlessly into small form factor cellphone devices with limited space constraints.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable performance in harsh environmental conditions commonly encountered in cellphone applications, making this product suitable for rugged use.

Terminal Form: NO LEAD

The use of no-lead terminal form reduces the risk of solder joint failures and enhances electrical reliability, ensuring consistent performance and longevity of the IC in cellphone circuitry.

Telecom IC Type: RF AND BASEBAND CIRCUIT

This IC type combines RF and baseband circuit functionality, making it suitable for integration into cellphone systems that require both wireless communication and signal processing capabilities.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V is commonly used in cellphone applications, ensuring compatibility with existing system requirements and facilitating seamless integration of this IC into cellphone designs.

Terminal Pitch: 0.5 mm

The tight terminal pitch of 0.5mm allows for dense routing of connections on the IC, enabling high signal density and promoting efficient circuit design in compact cellphone layouts.

Technical Specifications

Cellphone ICs ADF7025BCP attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e0

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

ADF7025BCP Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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