Loading...

ADF7025BCPZ-RL

Analog Devices

ADF7025BCPZ-RL by Analog Devices

Analog Devices' ADF7025BCPZ-RL is a cellphone IC with 48 terminals, operating at -40 to 85 °C. It has a supply voltage of 2.5/3.3V and terminal pitch of 0.5mm. Ideal for telecom applications, this chip carrier package IC is surface mountable and suitable for industrial use.

Median Price

$4.140

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$4.140

1k+ parts

$3.710

10k+ parts

$3.490

5,000

-

$4.140

$3.710

$3.490

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 603 parts In-Stock

1+ parts

$4.076

100+ parts

-

1k+ parts

-

10k+ parts

-

603

$4.076

-

-

-

Vyrian

USA . 974 parts In-Stock

1+ parts

$4.290

100+ parts

-

1k+ parts

-

10k+ parts

-

974

$4.290

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,665 parts In-Stock

1+ parts

$3.650

100+ parts

-

1k+ parts

-

10k+ parts

-

4,665

$3.650

-

-

-

Semicontronic

India . 4,579 parts In-Stock

1+ parts

$3.650

100+ parts

$3.559

1k+ parts

$3.540

10k+ parts

-

4,579

$3.650

$3.559

$3.540

-

Corphita

USA . 840 parts In-Stock

1+ parts

$3.861

100+ parts

-

1k+ parts

-

10k+ parts

-

840

$3.861

-

-

-

Corohmni

South Africa . 224 parts In-Stock

1+ parts

$6.458

100+ parts

-

1k+ parts

-

10k+ parts

-

224

$6.458

-

-

-

Parana Technologies

USA . 2,304 parts In-Stock

1+ parts

$13.313

100+ parts

-

1k+ parts

$12.381

10k+ parts

-

2,304

$13.313

-

$12.381

-

IDEA Electronic Components Group

UK . 749 parts In-Stock

1+ parts

$14.315

100+ parts

$13.599

1k+ parts

$13.599

10k+ parts

-

749

$14.315

$13.599

$13.599

-

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$14.657

100+ parts

$13.338

1k+ parts

$12.019

10k+ parts

-

100

$14.657

$13.338

$12.019

-

DigiPath Technology Company

USA . 1,812 parts In-Stock

1+ parts

$22.331

100+ parts

$21.438

1k+ parts

-

10k+ parts

$21.438

1,812

$22.331

$21.438

-

$21.438

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 2,580 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,580

-

-

-

-

RC Electronics

USA . 2,533 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,533

-

-

-

-

Northwest PG Solutions

USA . 2,037 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,037

-

-

-

-

Kepictronics

USA . 1,720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,720

-

-

-

-

Native Components

USA . 17 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17

-

-

-

-

Overview

Unlock the future of cellphone technology with the ADF7025BCPZ-RL by Analog Devices. Known for their top-notch quality and reliability, Analog Devices delivers cutting-edge solutions for the telecom industry. This surface mount IC boasts a square package shape and a wide range of applications, making it a versatile choice for your next project. With its low power requirements and high performance, this product offers unmatched value and benefits to customers looking to stay ahead in the competitive world of mobile communications. Elevate your designs with the ADF7025BCPZ-RL and experience the difference Analog Devices can make in your next innovation.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on PCBs, making this product suitable for mass production.

Package Shape: SQUARE

The square package shape provides a compact design, saving space on the PCB and allowing for denser integration of components.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages allows for flexibility in designing and integrating this IC into different cellphone systems.

No. of Terminals: 48

With 48 terminals, this IC offers a wide range of connectivity options and functionality for various cellphone applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile packaging styles ensures efficient heat dissipation and space-saving design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliability and performance under challenging environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows for operation in a wide range of temperature conditions, making this IC versatile and suitable for various environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and reliability, ensuring secure connections and long-term performance of the IC in cellphone devices.

Terminal Position: QUAD

Quad terminal position offers stable and secure connectivity, reducing signal interference and improving overall performance of the IC in cellphone circuits.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm allows for a slim and compact design, facilitating the integration of this IC into sleek and portable cellphone devices.

Width: 7 mm

The small width of 7mm enables space-efficient placement on the PCB, contributing to a compact and streamlined design of the cellphone circuitry.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures proper soldering and reliability during assembly processes, leading to consistent product quality.

Length: 7 mm

The short length of 7mm further enhances the compact form factor of this IC, enabling efficient use of space on the PCB and sleek design of cellphone devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade signifies robustness and reliability, making this IC suitable for demanding industrial applications where performance under extreme conditions is required.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and compliant with RoHS regulations, making this IC a sustainable choice for cellphone manufacturers.

Telecom IC Type: BASEBAND CIRCUIT

Specifically designed for baseband circuit applications in cellphones, this IC offers optimized performance and functionality for telecommunications operations.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V is commonly used in cellphone applications, ensuring compatibility and efficient power management within the device.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density packing of terminals on the IC, enabling more connectivity options and efficient use of space on the PCB.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that this IC can withstand exposure to moderately humid environments during storage and assembly, ensuring long-term reliability in cellphone devices.

Technical Specifications

Cellphone ICs ADF7025BCPZ-RL attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

ADF7025BCPZ-RL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Analog Devices 10

Similar products 19