Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MAX5865ETM-T by Maxim Integrated is a 48-terminal cellphone IC with 2 channels. It operates b/w -40 to 85°C, offering an output voltage of up to 3V in OFFSET BINARY code. Ideal for RF and baseband circuits, this CMOS technology chip has a compact square package style suitable for telecom applications.
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Surface mount technology allows for easy and efficient placement on circuit boards, making this product easy to integrate into electronic devices.
Offset binary output code ensures accurate and reliable data transmission and processing, making this product suitable for high-performance applications.
Square package shape provides compact and space-saving design, ideal for mobile devices and compact electronics.
Compatibility with multiple power supplies allows for flexible power options, enabling usage in a variety of electronic devices.
Having 48 terminals allows for multiple connections and functionalities, making this IC versatile and capable of handling complex tasks.
Different package styles offer versatility in mounting options and thermal management, ensuring optimal performance and reliability in various applications.
High maximum operating temperature tolerance ensures reliability and stability in demanding environmental conditions.
Low minimum operating temperature tolerance allows for operation in cold environments, expanding the usability of this product in various settings.
Tin lead terminal finish provides good solderability and conductivity, facilitating easy assembly and reliable connections.
The maximum output voltage of 3V supports a wide range of applications and ensures compatibility with various electronic components.
Quad terminal positioning offers efficient connection options, enabling easy integration into circuit designs.
Voltage output functionality makes this product suitable for applications requiring precise voltage control and accuracy.
Low seated height allows for compact design and space-saving integration, making this IC ideal for slim and portable devices.
7mm width provides a balance between space efficiency and accessibility, allowing for easy placement on circuit boards and integration into electronic systems.
The maximum analog input of 1.5V supports a wide range of analog signal processing tasks, providing flexibility and compatibility with various input sources.
Compact length of 7mm allows for space-efficient placement and integration in compact electronic devices.
Industrial temperature grade ensures reliability and performance in harsh industrial environments, making this product suitable for industrial applications.
Having 2 channels allows for multiple data processing tasks simultaneously, enhancing the capabilities and efficiency of this IC.
CMOS technology offers low power consumption, high speed, and compatibility with various digital systems, making this product energy-efficient and versatile.
No lead terminal form eliminates concerns related to lead toxicity and environmental impact, ensuring compliance with environmental regulations.
RF and baseband circuit integration provides comprehensive communication functionalities, making this product suitable for telecommunication applications that require both RF signal processing and baseband data handling.
The nominal supply voltage of 3V ensures compatibility with standard power sources and electronic components, making this IC easy to integrate into existing systems.
Fine terminal pitch of 0.5mm allows for high-density mounting and precise connection, enabling compact and efficient circuit designs.
High resolution of 8 micrometers supports precision measurement and data processing tasks, making this product suitable for applications that require accurate sensing and control.
Differential input type offers noise immunity and signal integrity, ensuring reliable data transmission and processing in noisy environments, making this product suitable for high-performance applications.
Cellphone ICs MAX5865ETM-T attributes and parameters. Explore more Cellphone ICs devices from Maxim Integrated
Maximum Analog Input:
Input Type:
JESD-30 Code:
JESD-609 Code:
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Maximum Output Voltage:
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Power Supplies (V):
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MAX5865ETM-T Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Maxim Integrated is a leading provider of analog and mixed-signal integrated circuits for a range of industries, including automotive, industrial, communications, consumer, and computing. Founded in 1983 with headquarters in San Jose, California, Maxim has grown to become one of the world’s largest producers of integrated circuits due to its innovative solutions that solve customers’ toughest design challenges. Maxim's broad portfolio includes products such as power management solutions, high-voltage solutions, motor driver solutions, amplifiers and comparators, data converters and interface ICs. For over 35 years, Maxim has continued to push the boundaries of analog integration by providing innovative integrated circuit products that offer the industry’s highest performance and best quality. The company’s commitment to delivering cutting-edge technology enables customers to stay current with changing demands in the market. From automotive check engine lights to fitness trackers worn on the wrist – Maxim enables customers across multiple industries to create groundbreaking products through their advanced IC designs. Maxim Integrated is now officially part of Analog Devices.
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489,000
USA
Beaverton
312,000
Thailand
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194,000
AB26TRB-32.768KHZ--T
Abracon
AB26TRB-32.768KHZ--T by Abracon is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 35000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal frequency in surface mount configurations.
BAV99
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
FDV304P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
2N2222A
Gec Plessey Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
North American Philips Discrete Products Div
KSZ9031RNXIC
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
SS14
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; No. of Phases: 1; Config: SINGLE; Maximum Operating Temperature: 125 Cel;
MBR0530T1G
Onsemi
MBR0530T1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.375V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring high-speed switching in compact electronic devices like smartphones and tablets. The package style is small outline with gull wing terminals for surface mount assembly.
1N4148WS
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
OPA2277UA
Texas Instruments
OPA2277UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 100 uV and micropower consumption of 1.65 mA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1000 kHz in a small outline package.
MBR1560CT
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 150 Cel; Maximum Repetitive Peak Reverse Voltage: 60 V; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 150 A;
1N4148
Philips Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Hi-tron Semiconductor
ULN2803A
Vishay Intertechnology
NPN; Configuration: COMPLEX; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; JESD-30 Code: R-PDIP-T18;
Capar Components
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Forward Voltage (VF): 1 V; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Output Current: .15 A;
Baneasa S A
Motorola
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Terminal Position: DUAL; JESD-30 Code: R-PDIP-T18;
2N7002
Itt Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Package Shape: RECTANGULAR;
BSS138-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain Current (ID): .2 A; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
ADF7025BCPZ-RL
Analog Devices
Analog Devices' ADF7025BCPZ-RL is a cellphone IC with 48 terminals, operating at -40 to 85 °C. It has a supply voltage of 2.5/3.3V and terminal pitch of 0.5mm. Ideal for telecom applications, this chip carrier package IC is surface mountable and suitable for industrial use.
MAX2055EUP+T
Analog Devices' MAX2055EUP+T is a BICMOS technology-based Cellphone IC with 20 terminals in a small outline package. It operates b/w -40 to 85 °C, suitable for industrial telecom applications. The IC has a nominal voltage of 5V and peak reflow temperature of 260°C, making it ideal for baseband circuit integration.
ADF4360-6BCPZ
Analog Devices' ADF4360-6BCPZ is a 24-terminal cellphone IC with 3.3V supply voltage, operating from -40 to 85 °C. It features BICMOS technology, matte tin finish, and quad terminal position for baseband circuit applications in industrial telecom settings.
CC1070-RTY1
CC1070-RTY1 by Texas Instruments is a cellphone IC with 20 terminals, operating at -40 to 105°C. It features a supply voltage of 3V, CMOS technology, and RF/baseband circuitry. This square-shaped chip carrier is surface-mountable with a very thin profile, ideal for industrial telecom applications.
SKY53735-21
Skyworks Solutions
SKY53735-21 by Skyworks Solutions is a Cellphone IC with 47 terminals in a rectangular chip carrier package. It operates b/w -30°C to 85°C, suitable for RF and baseband circuits. With a low profile of 0.7mm, it features no-lead terminals and requires a nominal voltage of 1.8V.
HMC600LP4
Analog Devices' HMC600LP4 is a cellphone IC with 24 terminals in a square chip carrier package. Operating b/w -40 to 85°C, it's ideal for RF and baseband circuits, with a nominal voltage of 3.3V. The compact design (4x4mm) features surface mount capability and industrial temperature grade suitability.
HMC6000LP711E
Analog Devices' HMC6000LP711E is a cellphone IC with 60 terminals in a rectangular chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 2.7V, making it ideal for telecom applications.
ADRF6650ACPZ
Analog Devices' ADRF6650ACPZ is a 56-terminal cellphone IC in a square chip carrier package. Operating from -40 to 105°C, it's ideal for RF and baseband circuits with a nominal voltage of 3.3V. Utilizing BiCMOS technology, this industrial-grade IC has a very thin profile at 0.8mm seated height.
TCM8000FN
Texas Instruments TCM8000FN is a Cellphone IC with BICMOS technology. It features 44 terminals in a square chip carrier package, suitable for baseband circuit applications. Operating temperature ranges from -25°C to 80°C, making it ideal for commercial extended telecom use.
MAX2046ETJ+
MAX2046ETJ+ by Analog Devices is a 32-terminal cellphone IC with a square package shape. It operates b/w -40 to 85 °C, suitable for industrial use. This BASEBAND CIRCUIT has a nominal voltage of 5V and terminal pitch of 0.5mm, making it ideal for telecom applications.
HMC832LP6GE
Hittite Microwave
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;
AD6635BBC
AD6635BBC by Analog Devices is a Cellphone IC with 324 terminals in a GRID ARRAY package. Operating at -40 to 85 °C, it uses CMOS technology and has a supply voltage of 2.5V for BASEBAND CIRCUIT applications. The package measures 19x19mm with a terminal pitch of 1mm and TIN LEAD finish on the bottom terminals.
ST25R3920AQWT
STMicroelectronics
RF AND BASEBAND CIRCUIT;
1168
Amecon
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
CC2510F16RSPR
CC2510F16RSPR by Texas Instruments is a cellphone IC with 36 terminals in a square package. It operates b/w -40 to 85°C, with a supply voltage of 2.5/3.3V and peak reflow temperature of 260°C. Ideal for RF and baseband circuits, this CMOS technology chip carrier is suitable for industrial applications requiring low-profile components.
MAX2309ETI+T
MAX2309ETI+T by Analog Devices is a cellphone IC with 28 terminals in a square package. It operates at -40 to 85 °C, with power supplies of 3/3.3V. Ideal for baseband circuits, it has a terminal pitch of 0.5mm and low supply current of 0.0415mA.
CC2511F16RSP
CC2511F16RSP by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. It operates at temperatures from 0 to 85°C and has a supply voltage of 3.3V. This RF and baseband circuit features CMOS technology, making it suitable for various wireless communication applications.
AD9361BBCZ-CSL
AD9361BBCZ-CSL by Analog Devices is a cellphone IC with 144 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 85°C, consuming max 150mA at 1.3V. Ideal for RF and baseband circuits in telecom applications due to its compact size and surface-mount capability.
HMC6001
Analog Devices' HMC6001 is a 45-terminal cellphone IC with surface mount capability. Operating b/w -40 °C to 85°C, it's an industrial-grade RF and baseband circuit for telecom applications. With a compact rectangular shape of 1.852mm x 3.452mm, this unencased chip operates at a nominal voltage of 1.35V.
HMC689LP4E
Analog Devices' HMC689LP4E is a 24-terminal cellphone IC in a square chip carrier package with matte tin finish. Operating temperature range from -40 to 85°C, suitable for industrial telecom applications. Utilizes BiCMOS technology with 5V supply voltage and RF/baseband circuit integration.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MAX5865ETM+T
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
Maxim Integrated
MAX5865ETM+
MAX5865ETM
MAX5865E/D
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Package Body Material: UNSPECIFIED;
MAX5864E/D
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; JESD-30 Code: X-XUUC-N;
MAX5866ETM+
MAX5866ETM+T
MAX5863E/D
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Technology: CMOS;
MAX5864ETM+
MAX5863ETM+T
MAX5864ETM+T
MAX5863ETM
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES;
MAX5864ETM
MAX5863ETM-T
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