Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SI4711-B30-GMR by Silicon Labs is a cellphone IC with 20 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it features RF and baseband circuitry, CMOS technology, and a nominal voltage of 3.3V. Ideal for telecom applications due to its compact size and surface-mount capability.
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Surface mount technology allows for easier and more efficient assembly of electronic devices, making this product a convenient choice for manufacturers.
The square package shape helps in optimizing space on the circuit board, making this product a suitable choice for compact designs.
Having a high number of terminals allows for more connectivity options and functionality, making this product versatile for different applications.
The package style with chip carrier, heat sink/slug, and very thin profile provides efficient heat dissipation and compact size, making this product ideal for high-performance applications with limited space.
With a high maximum operating temperature, this product can withstand demanding environmental conditions, ensuring reliability and durability.
The ability to operate at low temperatures makes this product suitable for use in a wide range of environments, increasing its versatility.
The quad terminal position offers improved stability and connectivity, making this product a reliable choice for consistent performance.
The low maximum seated height helps in achieving a slim profile design, making this product suitable for thin and compact devices.
The narrow width of this product allows for efficient use of space on the circuit board, making it a suitable choice for compact electronic designs.
The short length of this product helps in saving space on the circuit board, making it suitable for applications with limited board space.
CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable for various electronic applications.
The no-lead terminal form reduces the risk of solder joint failure and improves reliability, making this product a durable choice for long-term use.
Being designed for RF and baseband circuit applications, this product offers seamless integration with communication systems, making it suitable for telecom and wireless devices.
With a stable nominal supply voltage, this product ensures consistent performance and compatibility with various electronic systems requiring 3.3 V input.
The fine terminal pitch allows for high-density packaging and precise connections, making this product suitable for applications requiring compact design and high connectivity.
Cellphone ICs SI4711-B30-GMR attributes and parameters. Explore more Cellphone ICs devices from Silicon Labs
JESD-30 Code:
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SI4711-B30-GMR Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Mult Dev EOL 29/May/2019
Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.
SMBJ18CA
World Products
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Bytesonic Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Position: DUAL; Minimum Operating Temperature: -55 Cel;
LM317TG
Onsemi
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Minimum Input-Output Voltage Differential: 3 V; Qualification Status: Not Qualified; No. of Functions: 1;
STM32H743ZIT6
STMicroelectronics
STM32H743ZIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications, offering features such as 21 timers, CAN and USB connectivity, and low power mode.
SS14+
Multicomp Pro
SS14+ by Multicomp Pro is a Schottky rectifier diode with a max output current of 1A and a reverse test voltage of 40V. It is designed for surface mount applications in electronic circuits, offering a small outline package style and dual terminal position. With a temperature range from -65°C to 150°C, it is suitable for various industrial and consumer electronics.
SS14
Rfe International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Formosa Microsemi
LM358N
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BSS138
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; No. of Elements: 1; Maximum Drain Current (Abs) (ID): .2 A;
1N4148
Invensys Sensor Systems
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Repetitive Peak Reverse Voltage: 100 V;
DS18B20Z/T&R
Maxim Integrated
DS18B20Z/T&R by Maxim Integrated is a 12-bit digital temperature sensor with a max supply voltage of 5.5V and an accuracy of 0.50°C. It features a 1-Wire interface, operates b/w -55°C to 125°C, and is ideal for applications requiring precise temperature monitoring in compact spaces.
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
LM107H
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Minimum Voltage Gain: 25000;
MBR130T1G
MBR130T1G by Onsemi is a Schottky rectifier diode with max output current of 1A and max repetitive peak reverse voltage of 30V. It operates b/w -65 to 125°C, suitable for surface mount applications in electronics requiring low forward voltage drop.
2N2222A
Dionics-usa
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LL4148
Weitron Technology
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SSL-LXA228SRC-TR11
Lumex
SSL-LXA228SRC-TR11 by Lumex is a 1.9mm SINGLE COLOR LED with peak wavelength of 660nm and max forward current of 0.03A. Ideal for applications requiring SUPER RED light emission, such as indicator lights in electronic devices due to its clear lens and surface mounting feature.
BAV99
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
MAX2606EUT+T
BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;
CC1020-RTB1
Texas Instruments
CC1020-RTB1 by Texas Instruments is a cellphone IC with 32 terminals in a square package. It operates at temperatures from -40 to 85°C, with a supply voltage of 3V. This RF and baseband circuit technology has a terminal pitch of 0.65mm, making it ideal for industrial telecom applications.
TRF3710IRGZRG4
TRF3710IRGZRG4 by Texas Instruments is a cellphone IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.
TCM4400EGGM
Texas Instruments TCM4400EGGM is a BICMOS technology Cellphone IC with 80 terminals in a square package. It operates at -25 to 85 °C, consuming 0.03 mA at 3V. Ideal for BASEBAND CIRCUIT applications due to its low profile and fine pitch design.
ADF7025BCPZ-RL7
Analog Devices
Analog Devices' ADF7025BCPZ-RL7 is a cellphone IC with 48 terminals, operating at -40 to 85 °C. It features a 3V supply voltage, 0.5mm terminal pitch, and matte tin finish. Ideal for baseband circuits in telecom applications due to its compact square package and low profile design.
HMC786LP4E
Hittite Microwave
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: RECTANGULAR;
TCM8002IFR
Texas Instruments TCM8002IFR is a cellphone IC with 44 terminals in a square flatpack package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. Features include CMOS technology, 3.3V supply voltage, and baseband circuit for telecom applications.
HMC687LP4E
Analog Devices' HMC687LP4E is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial telecom applications. With matte tin finish and no-lead terminal form, it supports RF and baseband circuits at 5V nominal voltage.
ADF4360-8BCPZRL
Analog Devices' ADF4360-8BCPZRL is a cellphone IC with 24 terminals, operating at 3.3V. It features BICMOS technology, matte tin finish, and quad terminal position. Ideal for baseband circuits in telecom applications, it has a compact square package with a very thin profile and can withstand industrial temperatures from -40 to 85 °C.
BGA725L6E6327FTSA1
Infineon Technologies
Infineon's BGA725L6E6327FTSA1 is a cellphone IC with 6 terminals in a rectangular chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features a nominal voltage of 1.8V and is designed for baseband circuit applications.
CC2420RGZ
CC2420RGZ by Texas Instruments is a cellphone IC with 48 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for RF and baseband circuits. With CMOS technology and a nominal voltage of 1.8V, it's ideal for telecom applications requiring compact design and high performance.
CC1260RGZT
CC1260RGZT by Texas Instruments is a cellphone IC with 48 terminals in a square chip carrier package. It operates b/w -40°C to 105°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3.3V, making it ideal for telecom applications.
SARA-R510M8S-71B
U-blox Ag
RF AND BASEBAND CIRCUIT;
TRF3705IRGER
TRF3705IRGER by Texas Instruments is a 24-terminal cellphone IC with 3.3V supply voltage, operating from -40 to 85°C. It features RF and baseband circuits in a square chip carrier package suitable for telecom applications. The IC has a terminal pitch of 0.5mm, no-lead terminal form, and MSL level of 2 for industrial-grade usage.
ADF4360-0BCPRL7
Analog Devices' ADF4360-0BCPRL7 is a cellphone IC with 24 terminals, BICMOS technology, and 3.3V supply voltage. It operates b/w -40 to 85 °C, suitable for industrial telecom applications requiring a compact square chip carrier package with a low profile design.
TRF3702IRHCG4
TRF3702IRHCG4 by Texas Instruments is a cellphone IC with 16 terminals, operating at -40 to 85°C. It features a supply voltage of 5V, RF and baseband circuit for telecom applications, and a compact square chip carrier package suitable for surface mounting.
BG77LA-64-SGNS
Quectel Wireless Solutions
BG77LA-64-SGNS by Quectel Wireless Solutions is a BASEBAND CIRCUIT Telecom IC with 94 terminals, RECTANGULAR package shape, and 3.3V supply voltage. It operates b/w -35°C to 75°C, making it suitable for cellphone applications requiring compact design and surface mount capability.
TLV320AC56DW
TLV320AC56DW by Texas Instruments is a Cellphone IC with 20 terminals, operating temperature range of -40 to 85°C. It features Gull Wing terminal form, 3V supply voltage, and is ideal for baseband circuit applications in the telecom industry.
ADF7021-VBCPZ
Analog Devices' ADF7021-VBCPZ is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 2.5/3.3V and telecom IC type for RF and baseband circuits. The chip carrier package style with a very thin profile makes it suitable for industrial applications requiring compact design and high performance in telecommunications systems.
HMC683LP6CTR
Analog Devices' HMC683LP6CTR is a 40-terminal cellphone IC in a square chip carrier package with very thin profile. It operates b/w -40 °C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.
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SI4713-B30-GM
Silicon Labs
SI4713-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20°C to 85°C, suitable for RF and baseband circuits. With a compact size of 3x3mm and CMOS technology, it's ideal for mobile phone applications.
SI4721-B20-GM
Skyworks Solutions
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
SI4711-B30-GM
SI4721-B20-GMR
Silicon Labs' SI4721-B20-GMR is a cellphone IC with 20 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it features RF and baseband circuits for telecom applications. With a nominal voltage of 3.3V, this IC has a compact size of 3x3mm suitable for surface mount designs.
SI4710-B30-GMR
SI4713-B30-GMR
SI4710
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Position: QUAD;
SI4711
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; JESD-30 Code: S-XQCC-N20;
SI4712
SI4713
SI4713 by Silicon Labs is a cellphone IC with 20 terminals in a square package. It features CMOS technology, 0.6mm seated height, and 0.5mm terminal pitch. Ideal for RF and baseband circuits in telecommunications applications due to its compact size and surface mount capability.
SI4710-B30-GM
SI4712-B30-GMR
SI4712-B30-GM
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