Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SI4711-B30-GMR by Silicon Labs is a cellphone IC with 20 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it features RF and baseband circuitry, CMOS technology, and a nominal voltage of 3.3V. Ideal for telecom applications due to its compact size and surface-mount capability.
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Surface mount technology allows for easier and more efficient assembly of electronic devices, making this product a convenient choice for manufacturers.
The square package shape helps in optimizing space on the circuit board, making this product a suitable choice for compact designs.
Having a high number of terminals allows for more connectivity options and functionality, making this product versatile for different applications.
The package style with chip carrier, heat sink/slug, and very thin profile provides efficient heat dissipation and compact size, making this product ideal for high-performance applications with limited space.
With a high maximum operating temperature, this product can withstand demanding environmental conditions, ensuring reliability and durability.
The ability to operate at low temperatures makes this product suitable for use in a wide range of environments, increasing its versatility.
The quad terminal position offers improved stability and connectivity, making this product a reliable choice for consistent performance.
The low maximum seated height helps in achieving a slim profile design, making this product suitable for thin and compact devices.
The narrow width of this product allows for efficient use of space on the circuit board, making it a suitable choice for compact electronic designs.
The short length of this product helps in saving space on the circuit board, making it suitable for applications with limited board space.
CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable for various electronic applications.
The no-lead terminal form reduces the risk of solder joint failure and improves reliability, making this product a durable choice for long-term use.
Being designed for RF and baseband circuit applications, this product offers seamless integration with communication systems, making it suitable for telecom and wireless devices.
With a stable nominal supply voltage, this product ensures consistent performance and compatibility with various electronic systems requiring 3.3 V input.
The fine terminal pitch allows for high-density packaging and precise connections, making this product suitable for applications requiring compact design and high connectivity.
Cellphone ICs SI4711-B30-GMR attributes and parameters. Explore more Cellphone ICs devices from Silicon Labs
JESD-30 Code:
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SI4711-B30-GMR Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Mult Dev EOL 29/May/2019
Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.
M39029/56-351
Defense Logistics Agency
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Mating Contacts: M39029/58-363; Removal Tool Sources: MILITARY; Alternate Contact Sources: MILITARY;
2N2222A
SPC TECHNOLOGY/ MULTICOMP
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM358AN
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
FDC5614P
TAIZHOU ELECTRONICS CO LTD
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.92 W; Maximum Operating Temperature: 150 Cel; Package Body Material: PLASTIC/EPOXY;
C0805C104K5RACTU
KEMET Corporation
KEMET C0805C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and reliable performance.
LM358N
Philips Semiconductors
SMMBT2222ALT1G
Onsemi
SMMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, 0.6A IC, and 40V VCE. It has a hFE of 75, fT of 300MHz, and operates up to 150°C. Ideal for small signal applications in automotive electronics due to AEC-Q101 compliance.
M24308/2-1F
Tyco Electronics Amp
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; IEC Conformity: NO; Mixed Contacts: NO; Empty Shell: NO;
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
1N4148
Compensated Devices
RECTIFIER DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
LM317T
Bay Linear
Other Regulators; No. of Terminals: 3; No. of Outputs: 1; Surface Mount: NO; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel;
FDLL4148
FDLL4148 by Onsemi is a single rectifier diode with a max reverse recovery time of 0.004 us. With a max forward voltage of 1V and output current of 0.2A, it is ideal for applications requiring fast switching speeds in electronic circuits. The diode's glass package body material and isolated case connection make it suitable for surface mount designs operating at temperatures up to 175°C.
M39029/58360
Esterline Technologies
CONNECTOR ACCESSORY; Terminal Type: CRIMP; Removal Tools: M81969/14-01; Associated Military - Specifications: MIL-DTL-38999; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT;
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
ISO1050DUBR
Texas Instruments
ISO1050DUBR by Texas Instruments is a network interface IC with 8 terminals, operating from -55 to 105°C. It features a small outline package, nickel palladium gold finish, and gull wing terminal form. Ideal for telecom applications requiring a 5V supply voltage and peak reflow temperature of 260°C.
1N5819HW-7-F
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
NC7WZ07P6X
The Onsemi NC7WZ07P6X is a logic gate with 2 functions, featuring a propagation delay of 4.8 ns at 1.8V supply voltage. With open-drain output characteristics, it operates in industrial temperatures from -40 to 85°C. Ideal for applications requiring fast signal processing and low power consumption in compact designs.
Diotec Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM107H
Linear Technology
LM107H by Linear Technology is an Operational Amplifier with a max input offset voltage of 3000uV, common mode reject ratio of 96dB, and min voltage gain of 50000. It is used in military applications due to its MILITARY temperature grade and BIPOLAR technology for precise signal processing in harsh environments.
Rectron
MAX-7W-0
U-blox Ag
The U-blox Ag MAX-7W-0 is a CELLPHONE IC with AEC-Q100 screening, INDUSTRIAL temp grade, and RF/BASEBAND circuit type. It has 18 terminals in MICROELECTRONIC ASSEMBLY package style for applications requiring reliable performance in harsh environments. Operating from -40 to 85 °C, it offers compact dimensions of 9.7mm width and 10.1mm length with a low profile of 2.7mm for space-constrained designs.
1200
The Texas Instruments 1200 is a Cellphone IC with CMOS technology, suitable for RF and baseband circuits. It features a square package style, quad terminal position, and operates in industrial temperature grades (-40 to 85°C). With a nominal voltage of 3V and compact dimensions (4x4mm), it's ideal for telecom applications requiring surface mount compatibility.
CC1050PWR
CC1050PWR by Texas Instruments is a cellphone IC with 24 terminals in a small outline package. It operates at temperatures from -40 to 85°C, with supply voltages of 2.5/3.3V for RF and baseband circuits. The terminal finish is nickel palladium gold, making it suitable for industrial telecom applications.
MAX2031ETP/-T
Analog Devices
MAX2031ETP/-T by Analog Devices is a Cellphone IC with 20 terminals, operating at -40 to 85 °C. It features BICMOS technology, RF and baseband circuit for telecom applications, and requires 5V supply voltage with a max current of 0.1mA.
ADRF6620ACPZ-R7
Analog Devices' ADRF6620ACPZ-R7 is a 48-terminal cellphone IC with BICMOS technology. It operates in industrial temperature range (-40 to 85°C) and requires a nominal voltage of 5V. This RF and baseband circuit, suitable for telecom applications, comes in a square chip carrier package with very thin profile.
CC115LRTKR
CC115LRTKR by Texas Instruments is a cellphone IC with a square package and 20 terminals. It operates at temperatures ranging from -40 to 85 °C and has a nominal voltage of 3.6 V. This RF and baseband circuit is suitable for industrial applications.
HMC600LP4
Analog Devices' HMC600LP4 is a cellphone IC with 24 terminals in a square chip carrier package. Operating b/w -40 to 85°C, it's ideal for RF and baseband circuits, with a nominal voltage of 3.3V. The compact design (4x4mm) features surface mount capability and industrial temperature grade suitability.
TRF6903PTG4
TRF6903PTG4 by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates b/w -40 to 85°C, with power supplies of 2.5/3.3V. This RF and baseband circuit has a low profile flatpack style for industrial telecom applications.
ADRV9029BBCZ-REEL
RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30;
HMC832LP6GE
Hittite Microwave
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;
LMH6522SQE/NOPB
LMH6522SQE/NOPB by Texas Instruments is a 54-terminal cellphone IC with 4 channels, RF and baseband circuit for telecom applications. It operates b/w -40 to 85°C, has a gain tolerance of 25.74 dB, and draws a max supply current of 485 mA.
CC1110F16RSPG3
CC1110F16RSPG3 by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 85°C and has a supply voltage of 3V. This RF and baseband circuit technology is ideal for industrial telecom applications due to its compact size and low power consumption.
CC1050DK-433
CC1050DK-433 by Texas Instruments is a cellphone IC with 24 terminals in a small outline, thin profile package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.
GC5322IZND
GC5322IZND by Texas Instruments is a CELLPHONE IC with 352 terminals in a GRID ARRAY package. It operates b/w -40 to 85°C, has a low profile of 1.6mm, and uses TIN SILVER COPPER finish. Ideal for BASEBAND CIRCUIT applications due to its 1.2V supply voltage and industrial temperature grade suitability.
MAX2363ETMT
Analog Devices' MAX2363ETMT is a cellphone IC with 48 terminals in a square package. It operates at -40 to 85 °C, consuming 0.09mA at 2.8V. Ideal for RF and baseband circuits, it has a terminal pitch of 0.5mm and measures 7x7mm with a height of 0.8mm for industrial applications.
HMC421QS16E
Analog Devices' HMC421QS16E is a 16-terminal cellphone IC with a small outline, shrink pitch package. It operates b/w -40°C to 85°C and has a nominal voltage of 5V. Ideal for RF and baseband circuits in telecom applications due to its dual terminal position and gull wing form factor.
MAX2051ETP+
MAX2051ETP+ by Analog Devices is a Cellphone IC with 20 terminals in a square package. It operates at -40 to 85 °C, with a supply voltage of 5V and current draw of 0.13mA. This RF and baseband circuit uses BICMOS technology for industrial telecom applications.
CC1100ERTKT
CC1100ERTKT by Texas Instruments is a cellphone IC with 20 terminals in a square package. It operates b/w -40 to 85°C, with a supply voltage of 1.8/3.6V and peak reflow temperature of 260°C. Ideal for RF and baseband circuits, it features CMOS technology and nickel palladium gold terminal finish.
LMH2110TM
LMH2110TM by Texas Instruments is a Cellphone IC with a package style of GRID ARRAY, very thin profile, and fine pitch. It operates in industrial temperature range from -40 to 85°C and has RF and baseband circuit capabilities. With a nominal voltage of 4.5V, it is suitable for telecommunications applications.
TRF3710IRGZT
TRF3710IRGZT by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 5V, making it ideal for telecom applications.
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SI4713-B30-GM
Silicon Labs
SI4713-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20°C to 85°C, suitable for RF and baseband circuits. With a compact size of 3x3mm and CMOS technology, it's ideal for mobile phone applications.
SI4721-B20-GM
Skyworks Solutions
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
SI4711-B30-GM
SI4721-B20-GMR
Silicon Labs' SI4721-B20-GMR is a cellphone IC with 20 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it features RF and baseband circuits for telecom applications. With a nominal voltage of 3.3V, this IC has a compact size of 3x3mm suitable for surface mount designs.
SI4710-B30-GMR
SI4713-B30-GMR
SI4710
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Position: QUAD;
SI4711
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; JESD-30 Code: S-XQCC-N20;
SI4712
SI4713
SI4713 by Silicon Labs is a cellphone IC with 20 terminals in a square package. It features CMOS technology, 0.6mm seated height, and 0.5mm terminal pitch. Ideal for RF and baseband circuits in telecommunications applications due to its compact size and surface mount capability.
SI4710-B30-GM
SI4712-B30-GMR
SI4712-B30-GM
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