Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SI4711-B30-GMR by Silicon Labs is a cellphone IC with 20 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it features RF and baseband circuitry, CMOS technology, and a nominal voltage of 3.3V. Ideal for telecom applications due to its compact size and surface-mount capability.
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Surface mount technology allows for easier and more efficient assembly of electronic devices, making this product a convenient choice for manufacturers.
The square package shape helps in optimizing space on the circuit board, making this product a suitable choice for compact designs.
Having a high number of terminals allows for more connectivity options and functionality, making this product versatile for different applications.
The package style with chip carrier, heat sink/slug, and very thin profile provides efficient heat dissipation and compact size, making this product ideal for high-performance applications with limited space.
With a high maximum operating temperature, this product can withstand demanding environmental conditions, ensuring reliability and durability.
The ability to operate at low temperatures makes this product suitable for use in a wide range of environments, increasing its versatility.
The quad terminal position offers improved stability and connectivity, making this product a reliable choice for consistent performance.
The low maximum seated height helps in achieving a slim profile design, making this product suitable for thin and compact devices.
The narrow width of this product allows for efficient use of space on the circuit board, making it a suitable choice for compact electronic designs.
The short length of this product helps in saving space on the circuit board, making it suitable for applications with limited board space.
CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable for various electronic applications.
The no-lead terminal form reduces the risk of solder joint failure and improves reliability, making this product a durable choice for long-term use.
Being designed for RF and baseband circuit applications, this product offers seamless integration with communication systems, making it suitable for telecom and wireless devices.
With a stable nominal supply voltage, this product ensures consistent performance and compatibility with various electronic systems requiring 3.3 V input.
The fine terminal pitch allows for high-density packaging and precise connections, making this product suitable for applications requiring compact design and high connectivity.
Cellphone ICs SI4711-B30-GMR attributes and parameters. Explore more Cellphone ICs devices from Silicon Labs
JESD-30 Code:
Length:
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Peak Reflow Temperature (C):
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Telecom IC Type:
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SI4711-B30-GMR Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Mult Dev EOL 29/May/2019
Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.
BAV99
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
BSS138
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Operating Mode: ENHANCEMENT MODE;
National Semiconductor
1N4148
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WS
Vishay Intertechnology
Vishay Intertechnology's 1N4148WS is a single rectifier diode with a max forward voltage of 1V and output current of 0.15A. With a fast reverse recovery time of 0.004us, it operates up to 150°C. Ideal for applications requiring high-speed switching and low power consumption in surface mount configurations.
MS3V-T1R32.768KHZ+/-20PPM12.5PF
Golledge Electronics
MS3V-T1R32.768KHZ+/-20PPM12.5PF by Golledge Electronics is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 12.5 pF load capacitance. It is ideal for applications requiring precise timing in temperature-sensitive environments due to its -40 to 85 °C operating range.
Eic Semiconductor
DS18B20U+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: SQUARE; Housing: PLASTIC; Minimum Supply Voltage: 3 V;
LM317AEMP/NOPB
Texas Instruments
LM317AEMP/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and a max output current of 1.5A. It operates in temperatures ranging from -40°C to 125°C, making it suitable for various applications requiring precise voltage regulation in a compact package.
Itt Semiconductor
Renesas Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
CRCW04020000Z0EDHP
Vishay Intertechnology's CRCW04020000Z0EDHP is a 0402 SMT resistor with 0 ohm resistance, rated for temperatures from -55°C to 155°C. Ideal for jumper applications in automotive electronics due to AEC-Q200 compliance and compact size of 1mm x 0.5mm x 0.3mm.
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
MICRODIODE ELECTRONICS SHENZHEN CO LTD
EU2B-YS3303C
Idec
ROTARY SWITCH;
SMBJ18CA
Brightking
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
DS18B20Z+T&R
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Body Material: PLASTIC/EPOXY;
FT232RL-TUBE
FTDI
FTDI's FT232RL-TUBE is a bus controller with 28 terminals, operating at 3.3-5.25V. It supports USB, VBUS, and UART interfaces with a data transfer rate of 60MBps. Ideal for industrial applications requiring RS232/RS422/RS485 compatibility in compact designs due to its small outline package style.
CC1000PWRG3
CC1000PWRG3 by Texas Instruments is a cellphone IC with 28 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 2.5/3.3V and telecom IC type for RF and baseband circuits. The package is small outline, thin profile, with gull wing terminals suitable for industrial applications.
CC2400-RTB1
CC2400-RTB1 by Texas Instruments is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 1.8V, RF and baseband circuitry, and low supply current of 0.005mA. Ideal for telecom applications due to its compact square package shape and CMOS technology.
CC1110EMK868-915
RF AND BASEBAND CIRCUIT;
ADF4360-9BCPZ
Analog Devices
Analog Devices' ADF4360-9BCPZ is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. It operates at -40 to 85°C, with a supply voltage of 3.3V and terminal pitch of 0.5mm. Ideal for baseband circuits, it features matte tin finish and very thin profile for industrial telecom applications.
SI4721-B20-GMR
Silicon Labs
Silicon Labs' SI4721-B20-GMR is a cellphone IC with 20 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it features RF and baseband circuits for telecom applications. With a nominal voltage of 3.3V, this IC has a compact size of 3x3mm suitable for surface mount designs.
OC2321VQFN8XTMA2
Infineon Technologies
Infineon's OC2321VQFN8XTMA2 is a cellphone IC with 8 terminals in a small outline package. It operates b/w -40°C to 105°C, suitable for RF and baseband circuits. The PLASTIC/EPOXY material, NO LEAD terminal form, and 1.8V supply voltage make it ideal for compact mobile devices.
TCM320AC57IDW
TCM320AC57IDW by Texas Instruments is a Cellphone IC with 20 terminals, operating at temperatures from -40 to 85°C. It features a 13-bit linear coding and A-Law companding law, suitable for baseband circuit applications. This small outline package has a rectangular shape, gull wing terminal form, and requires a 5V supply voltage.
LMV228TL
LMV228TL by Texas Instruments is a cellphone IC with a package style of grid array, very thin profile, and fine pitch. It operates in industrial temperature range from -40 to 85°C, suitable for RF and baseband circuits in telecom applications. This surface-mount IC has 4 terminals with 0.5mm pitch and a compact square shape measuring 1.014mm x 1.014mm.
HMC601LP4E
Analog Devices' HMC601LP4E is a 24-terminal cellphone IC in a square chip carrier package. With an operating temperature range of -40 to 85°C, it's ideal for industrial telecom applications requiring RF front end circuits. The IC operates at a nominal voltage of 3.3V and features matte tin over nickel terminal finish.
HMC421QS16ETR
Analog Devices' HMC421QS16ETR is a 16-terminal cellphone IC in small outline package with matte tin finish. It operates b/w -40 °C to 85°C, suitable for industrial telecom applications requiring RF and baseband circuits. With shrink pitch design, it has a compact size of 4.9mm x 3.9mm x 1.75mm for space-constrained designs.
MAX2676EWT+
MAX2676EWT+ by Analog Devices is a CELLPHONE IC with BICMOS tech. It operates at -40 to 85 °C, has 3.3V supply, and RF/BASEBAND circuits. The package is GRID ARRAY, 0.69mm height, and 1.27mm length for telecom applications.
HMC6001LP711E
Analog Devices' HMC6001LP711E is a 60-terminal cellphone IC in a rectangular chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 2.7V, making it ideal for telecom applications.
CC2420Z-RTB1
CC2420Z-RTB1 by Texas Instruments is a cellphone IC with 48 terminals, operating temperature range of -40 to 85°C. It features a supply voltage of 1.8V, RF and baseband circuit for telecom applications, and CMOS technology. The package style includes chip carrier and heat sink/slug, making it suitable for industrial use in compact devices.
CC2591RGVT
The Texas Instruments CC2591RGVT is a cellphone IC with 16 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 85°C, with a supply voltage of 3V and max current of 4mA. This RF front end circuit has a terminal pitch of 0.65mm and is suitable for industrial applications requiring very thin profile components.
TCM4300PZ-00
Texas Instruments TCM4300PZ-00 is a cellphone IC with 100 terminals in a square, low-profile package. It features RF and baseband circuits, gull-wing terminals, and 0.5mm pitch. Ideal for telecom applications due to its compact size and surface-mount capability.
SARA-R410M-02B-03
U-blox Ag
SARA-R410M-02B-03 by U-blox Ag is a surface mount Cellphone IC with 96 terminals. Telecom IC type includes RF and baseband circuit, operating at -20 to 65°C. Nominal voltage of 3.8V makes it ideal for commercial applications requiring compact design and high performance.
TCM320AC57IDWR
TCM320AC57IDWR by Texas Instruments is a Cellphone IC with 20 terminals, CMOS technology, and 5V supply voltage. It operates b/w -40 to 85°C, suitable for industrial use in baseband circuits. The package is small outline, rectangular in shape, with gull wing terminals for surface mount applications.
LMV227SDX/NOPB
LMV227SDX/NOPB by Texas Instruments is a cellphone IC with 6 terminals, operating temperature range of -40 to 85°C, and supply voltage of 2.7V. It is used in RF and baseband circuits for telecom applications due to its small outline package style and surface mount capability.
LMV225UR
LMV225UR by Texas Instruments is a Cellphone IC with 4 terminals in a square package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 2.7V, making it ideal for cellphone applications.
LMV225TLX
Texas Instruments LMV225TLX is a cellphone IC with 4 terminals in a square package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 2.7V, making it ideal for telecom applications.
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SI4713-B30-GM
SI4713-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20°C to 85°C, suitable for RF and baseband circuits. With a compact size of 3x3mm and CMOS technology, it's ideal for mobile phone applications.
SI4721-B20-GM
Skyworks Solutions
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
SI4711-B30-GM
SI4710-B30-GMR
SI4713-B30-GMR
SI4710
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Position: QUAD;
SI4711
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; JESD-30 Code: S-XQCC-N20;
SI4712
SI4713
SI4713 by Silicon Labs is a cellphone IC with 20 terminals in a square package. It features CMOS technology, 0.6mm seated height, and 0.5mm terminal pitch. Ideal for RF and baseband circuits in telecommunications applications due to its compact size and surface mount capability.
SI4710-B30-GM
SI4712-B30-GMR
SI4712-B30-GM
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