Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SI4713 by Silicon Labs is a cellphone IC with 20 terminals in a square package. It features CMOS technology, 0.6mm seated height, and 0.5mm terminal pitch. Ideal for RF and baseband circuits in telecommunications applications due to its compact size and surface mount capability.
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This feature allows for easy and efficient installation on circuit boards, making it ideal for mass production.
The square shape helps optimize space on the circuit board, allowing for compact and efficient design.
With 20 terminals, this IC provides ample connectivity options for various functions and components.
The combination of these package styles ensures effective heat dissipation and a streamlined design.
The quad terminal position enhances stability and connectivity, making it a reliable choice for cellphone applications.
The low profile of 0.6mm allows for slim and sleek cellphone designs without compromising on performance.
The 3mm width offers a balance between compact size and functionality, suitable for modern cellphone designs.
The 3mm length also contributes to the compact and space-saving design of the IC.
CMOS technology ensures low power consumption and high speed, making it an energy-efficient choice for cellphones.
The no lead terminal form reduces the risk of environmental contamination and enhances the durability of the IC.
This dual functionality as RF and baseband circuit makes it a versatile and cost-effective solution for cellphone communication.
The 0.5mm terminal pitch allows for tight spacing and high connectivity, ideal for complex cellphone applications.
Cellphone ICs SI4713 attributes and parameters. Explore more Cellphone ICs devices from Silicon Labs
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SI4713 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.
LM107H
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Bias Current (IIB) @25C: .075 uA;
SS14
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/56-351
Carlisle Interconnect Technologies
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Type: CRIMP; Removal Tools: M81969/8-06, M81969/14-02; IEC Conformity: NO; Contact Gender: FEMALE;
LL4148
General Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148
Semitronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M39029/58-360
Molex
CONNECTOR ACCESSORY; Alternate Contact Sources: MILITARY; Removal Tool Sources: MILITARY; Material: COPPER ALLOY; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354;
Bkc Semiconductors
1N4148WS
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Synsemi
2N7002
Transys Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 60 V; Maximum Operating Temperature: 150 Cel;
BAV99
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
AMS1117-3.3
Advanced Monolithic Systems
AMS1117-3.3 by Advanced Monolithic Systems is a fixed positive single output LDO regulator with 1A max output current, 3% voltage tolerance, and 1.3V dropout voltage. Ideal for applications requiring stable 3.3V supply in compact designs due to its small outline package and excellent load regulation of 0.025%.
ULN-2803A
Sprague Electric
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
MMBF170LT1G
Onsemi
MMBF170LT1G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage and 0.5A Drain Current. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 0.225W. This small outline transistor has a temperature range from -55 to 150 °C.
Grande Electronics
08055C104KAT4A
KYOCERA AVX
08055C104KAT4A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance, rated for 50V. With X7R temperature characteristics and -55 to 125 °C operating range, it's ideal for SMT applications requiring compact size and high reliability. The wraparound terminals and multi-layer design make it suitable for various electronic circuits.
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Hy Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
STMicroelectronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
AD6688BBPZ-3000
Analog Devices
AD6688BBPZ-3000 by Analog Devices is a CELLPHONE IC with 196 terminals in a GRID ARRAY package. It operates b/w -40 to 85°C, suitable for INDUSTRIAL telecom applications. Features include RF and baseband circuits, 0.975V supply voltage, and peak reflow temperature of 260°C.
LT5558EUF#PBF
Linear Technology
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
TCM4300PZ
Texas Instruments
Texas Instruments TCM4300PZ is a cellphone IC with 100 terminals, operating at -40 to 85°C. It features 3.3/5V power supplies, suitable for RF and baseband circuits in telecom applications. The package is a square flatpack with low profile, fine pitch design, ideal for surface mount assembly.
CC1101TRHBRG4Q1
CC1101TRHBRG4Q1 by Texas Instruments is a cellphone IC with 32 terminals, operating at -40 to 105°C. It features a supply voltage of 3V, RF and baseband circuitry for telecom applications, and AEC-Q100 screening level for industrial use.
HMC689LP4
Analog Devices' HMC689LP4 is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. Operating temperature range from -40 to 85 °C, suitable for RF and baseband circuits in telecom applications. Features include tin/lead terminal finish, 5V supply voltage, and compact 4x4mm dimensions.
CC1050PWRG3
CC1050PWRG3 by Texas Instruments is a cellphone IC with 24 terminals, operating at 2.5/3.3V. It features a small outline package style and CMOS technology for RF and baseband circuits. With a temperature range of -40 to 85°C, it is ideal for industrial telecom applications.
CC1110F8RSPR
The Texas Instruments CC1110F8RSPR is a cellphone IC with 36 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, CMOS technology, and RF/baseband circuit for telecom applications. Nominal voltage of 3V, terminal pitch of 0.5mm, and MSL level of 3 make it ideal for industrial use.
CC2510F32RSP
CC2510F32RSP by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3V. This RF and baseband circuit technology has a terminal pitch of 0.5mm and is suitable for industrial applications.
TLV321AC36CN
TLV321AC36CN by Texas Instruments is a Cellphone IC with 20 terminals, CMOS technology, and 3V supply voltage. It has a rectangular package style, suitable for baseband circuits in commercial temperature grades. Dimensions are 7.62mm width, 24.325mm length, and 5.08mm seated height for through-hole mounting at temperatures ranging from 0 to 70°C.
ADS58C20IPFPR
Texas Instruments ADS58C20IPFPR is an 80-terminal cellphone IC with a max analog input of 3.45V and operating temperature range from -40 to 85°C. It features a flatpack package style, gull wing terminal form, and is suitable for RF and baseband circuit applications in the telecom industry.
CC1000-RWP2
CC1000-RWP2 by Texas Instruments is a Cellphone IC with 28 terminals in a rectangular package. It operates at temperatures from -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 3V, making it ideal for cellphone applications.
CC2511F8RSPR
The Texas Instruments CC2511F8RSPR is a cellphone IC with 36 terminals in a square chip carrier package. Operating at 3V, it features RF and baseband circuitry for telecom applications. With a compact size of 6x6mm and CMOS technology, it offers high performance in a small form factor suitable for mobile devices.
MAX2021ETX+T
Analog Devices' MAX2021ETX+T is a Cellphone IC with 36 terminals in a square package. Operating b/w -40 to 85 °C, it uses BICMOS technology and has a supply voltage of 5V. Ideal for baseband circuits, this IC has a max supply current of 0.315mA and terminal pitch of 0.5mm.
CC1100ERGPT
The Texas Instruments CC1100ERGPT is a cellphone IC with 20 terminals, operating at temperatures from -40 to 85°C. It features a CMOS technology, RF and baseband circuit for data rates up to 0.5 Mbps. This chip carrier package with nickel palladium gold finish is suitable for industrial applications requiring low power supplies of 1.8-3.6V.
TLV321AC36IN
TLV321AC36IN by Texas Instruments is a 20-terminal IC for cellphones. It operates b/w -40°C to 85°C, with a supply voltage of 3V. Ideal for baseband circuits, it features CMOS technology and through-hole terminals in a rectangular package.
CC2400-RTR1
CC2400-RTR1 by Texas Instruments is a cellphone IC with 48 terminals, operating b/w -40 to 85°C. It features a supply voltage of 1.8V, RF and baseband circuitry, and low current draw at 0.005mA. Ideal for telecom applications due to its compact square package shape and CMOS technology.
HPA00452RSTR
Texas Instruments' HPA00452RSTR is a Cellphone IC with 16 terminals in a square chip carrier package. Operating b/w -40 to 85°C, it features RF and baseband circuit technology, NO LEAD terminal form, and 3V supply voltage. Ideal for telecom applications requiring a compact design with high performance.
MAX2902ETI+
MAX2902ETI+ by Analog Devices is a cellphone IC with 28 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It integrates RF and baseband circuits, with a nominal voltage of 4.5V for telecom applications.
EG91EXGA-128-SGNS
Quectel Wireless Solutions
Quectel Wireless Solutions' EG91EXGA-128-SGNS is a Cellphone IC with 102 terminals, operating temp. range of -35 to 75°C, and 3.8V supply voltage. It integrates RF and baseband circuits for telecom applications in a compact rectangular package measuring 25mm x 29mm with a seated height of 2.3mm, suitable for surface mount assembly.
CC1000_UCSP/T&R
CC1000_UCSP/T&R by Texas Instruments is a Cellphone IC with 28 terminals, operating at -40 to 85°C. It features a supply voltage of 2.5/3.3V and uses CMOS technology for RF and baseband circuits. This rectangular package with grid array style is ideal for telecom applications requiring compact design and high performance in industrial temperature environments.
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SI4713-B30-GM
Silicon Labs
SI4713-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20°C to 85°C, suitable for RF and baseband circuits. With a compact size of 3x3mm and CMOS technology, it's ideal for mobile phone applications.
SI4721-B20-GM
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
SI4711-B30-GM
SI4711-B30-GMR
SI4713-B30-GMR
SI4721-B20-GMR
Silicon Labs' SI4721-B20-GMR is a cellphone IC with 20 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it features RF and baseband circuits for telecom applications. With a nominal voltage of 3.3V, this IC has a compact size of 3x3mm suitable for surface mount designs.
SI4710-B30-GM
SI4710-B30-GMR
SI4712-B30-GMR
SI4720-B20-GM
SI4705-D50-GMR
BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; Package Body Material: UNSPECIFIED;
SI4710
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Position: QUAD;
SI4711
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; JESD-30 Code: S-XQCC-N20;
SI4712
SI4705-B20-GM
SI4712-B30-GM
SI4720-B20-GMR
Skyworks Solutions
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; Width: 3 mm;
SI4704
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: .6 mm;
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